公开(公告)号：US4020209A

公开(公告)日：1977-04-26

申请号：US564485

申请日：1975-04-02

Applicant: Edward Lung Yuan

Inventor： Edward Lung Yuan

IPC: D03D25/00 ,  D06N3/00 ,  H05K1/03 ,  D03D13/00

CPC classification number: D03D25/00 ,  D06N3/0002 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/3187 ,  Y10T442/3415 ,  Y10T442/3854

Abstract: A coated triaxial fabric, a process for its preparation and a laminated article prepared therefrom are provided. The coated fabric comprises a triaxial fabric, such as glass or polyester fibers, having a polymeric material impregnating and coating the fabric in an amount sufficient to set the yarn courses of the fabric where they cross one another and to give such a coated fabric superior isotropic tear resistance and strength (substantially uniform in all directions) when compared to a similarly constructed coated fabric prepared from a conventional biaxial fabric or a conventional bias ply construction. The coated fabric can be bonded to substrates such as metals and polymeric films.

Abstract translation: 提供涂覆的三轴织物，其制备方法和由其制备的层压制品。 涂覆的织物包括三轴织物，例如玻璃或聚酯纤维，其具有浸渍和涂覆织物的聚合物材料，其量足以将织物的纱线排列成彼此交叉，并且使这种涂布织物具有优异的各向同性 与由常规双轴织物或常规偏压层结构制备的类似构造的涂层织物相比，抗撕裂性和强度（在所有方向上基本均匀）。 涂布的织物可以结合到诸如金属和聚合物膜的基底上。

公开(公告)号：US3956561A

公开(公告)日：1976-05-11

申请号：US558321

申请日：1975-03-14

Applicant: Gary C. Anderson ,  Loyd G. Kasbo

Inventor： Gary C. Anderson ,  Loyd G. Kasbo

IPC: D04H1/54 ,  H01B3/48 ,  H01B3/50 ,  H05K1/03 ,  B32B27/02

CPC classification number: D04H1/54 ,  H01B3/485 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31728 ,  Y10T442/696 ,  Y10T442/698

Abstract: Nonwoven fabrics of enhanced resistance to shrinkage, degradation, and planar instability at elevated temperatures are prepared from a major portion of aramid fibers bonded by a minor portion of polyamide fibers.

Abstract translation: 通过少量聚酰胺纤维粘合的芳族聚酰胺纤维的主要部分制备了在高温下增强的耐收缩性，降解性和平面不稳定性的无纺织物。

公开(公告)号：US3895158A

公开(公告)日：1975-07-15

申请号：US38853373

申请日：1973-08-15

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： GAUSE SMITH A ,  GRAY JR MARION C ,  THOMAS WILBUR R

IPC: B32B5/28 ,  B29C70/00 ,  B32B17/04 ,  C08J5/24 ,  H05K1/03 ,  B32B5/08 ,  B32B5/12 ,  H05K1/00

CPC classification number: B32B29/02 ,  B29C70/00 ,  B29K2309/08 ,  B32B5/024 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B29/06 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/188 ,  B32B2307/202 ,  B32B2311/12 ,  B32B2311/30 ,  B32B2457/08 ,  C08J5/24 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S273/03 ,  Y10S273/07 ,  Y10T442/3634

Abstract: Unclad and metal clad laminates are constructed by sandwiching a resin impregnated core of paper between epoxy resin impregnated woven glass fabric sheets. The paper is a water laid sheet of cellulose fibers, preferably wood cellulose or cotton linter fibers having an average length from about 0.5 to 5 mm. The laminates are used as substrates for printed circuits and printed circuit modules.

Abstract translation: 通过将环氧树脂浸渍的玻璃织物片材之间的树脂浸渍的芯片夹在中间而构成未包层和金属覆层压板。 该纸是纤维素纤维的水性片材，优选平均长度为约0.5至5mm的木纤维素或棉绒纤维。 层压板用作印刷电路和印刷电路模块的基板。

公开(公告)号：US3700341A

公开(公告)日：1972-10-24

申请号：US3700341D

申请日：1970-07-27

Applicant: LCOA LAMINATING CO OF AMERICA

Inventor： BLOCK JAMES P

IPC: B23B35/00 ,  H05K3/00

CPC classification number: H05K3/0047 ,  B23B35/005 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0214 ,  Y10T83/9309 ,  Y10T408/03 ,  Y10T408/561

Abstract: A laminated board formed of a core of pressed wood covered with preferably aluminum foil outer layers, adhesively bonded thereto, which is useful for a back-up board when drilling printed circuit boards which is formed by drying the pressed fiber core to a low moisture contest prior to adhesively bonding the aluminum foil thereto.

公开(公告)号：US3393117A

公开(公告)日：1968-07-16

申请号：US34467664

申请日：1964-02-13

Applicant: CINCINNATI MILLING MACHINE CO

Inventor： ZOLG FRED U ,  SOUKUP VICTOR G

IPC: B32B5/28 ,  B29C43/02 ,  B29C43/18 ,  B29C43/20 ,  B29C57/00 ,  B29C67/00 ,  B29C70/00 ,  B29C70/08 ,  B32B15/08 ,  B32B17/04 ,  E04C2/26 ,  H05K1/03

CPC classification number: H05K1/036 ,  B29C70/00 ,  B29C70/08 ,  B29C70/088 ,  B29C70/12 ,  B29C70/34 ,  B29K2105/0809 ,  B29K2105/128 ,  B29K2309/08 ,  B29K2705/10 ,  B32B15/08 ,  E04C2/26 ,  H05K1/0366 ,  H05K2201/0293 ,  Y10T442/3439

公开(公告)号：US09779880B2

公开(公告)日：2017-10-03

申请号：US15251214

申请日：2016-08-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Tao Cheng ,  Qilin Chen ,  Zhou Jin

IPC: B32B15/092 ,  B32B27/20 ,  B32B27/38 ,  H01G4/20 ,  C08L63/00 ,  C09D163/00 ,  H01G9/07 ,  H05K1/03 ,  C08K3/24 ,  C08K7/08 ,  C08K7/14 ,  H01G9/042 ,  H01G9/055 ,  H01G9/15

CPC classification number: H01G9/07 ,  C08K3/24 ,  C08K7/08 ,  C08K7/14 ,  H01G4/203 ,  H01G9/042 ,  H01G9/055 ,  H01G9/15 ,  H05K1/0366 ,  H05K2201/0293

Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

公开(公告)号：US20160280965A1

公开(公告)日：2016-09-29

申请号：US14997130

申请日：2016-01-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Koji MOTOMURA

IPC: C09J7/02 ,  C09J9/02 ,  H05K3/00 ,  C09J5/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: C09J9/02 ,  C09J163/00 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2481/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2924/351 ,  H05K1/141 ,  H05K3/323 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10727 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

Abstract translation: 膜材料包括基板和布置在基板的一个主表面上的膜层。 膜层含有未固化或半固化状态的纤维状第一树脂和热固性第二树脂，第一树脂的线膨胀系数CF小于固化状态下的第二树脂的线膨胀系数CR。

公开(公告)号：US08933161B2

公开(公告)日：2015-01-13

申请号：US14005692

申请日：2012-03-16

Applicant: Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Bernardus Antonius Gerardus Schrauwen

IPC: B60C1/00 ,  C08J5/04 ,  C23C18/20 ,  C23C18/16 ,  C08G69/26 ,  C08K13/04 ,  H05K3/18 ,  B41M5/26 ,  H01Q1/38 ,  C08L77/06 ,  C08K7/04 ,  C23C18/38 ,  C08K9/02 ,  H05K1/03 ,  C08K3/22

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract translation: 提供了弯曲强度，弯曲模量和夏氏冲击强度优异的热塑性树脂成型体，其上可以成功地形成镀层。 用于激光直接结构的热塑性树脂组合物包括：相对于100重量份的热塑性树脂，10至150重量份的无机纤维和1至30重量份的激光直接结构化添加剂，所述激光直接结构化添加剂包含 铜，锑和锡中的至少一种，并且具有比无机纤维的莫氏硬度小1.5或更大的莫氏硬度。

公开(公告)号：US20140170412A1

公开(公告)日：2014-06-19

申请号：US13827374

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Young JI ,  Shang Hoon Seo ,  Suk Jin Ham ,  Seung Hwan Kim

IPC: C09D7/12 ,  B05D7/24

CPC classification number: C09D11/324 ,  C09D11/38 ,  H05K1/0373 ,  H05K3/28 ,  H05K2201/0141 ,  H05K2201/0257 ,  H05K2201/0293 ,  H05K2203/013 ,  Y10T428/26

Abstract: An insulating composition including a graphene oxide and an insulating material including the same; and a polar solvent having a solvent polarity index (P) of greater than 5.5, a substrate including an insulating layer using the same, and a method for manufacturing the substrate. It is possible to provide an insulating composition including a specific solvent that can secure dispersibility of the graphene oxide while including the graphene oxide having excellent insulating and mechanical properties as an insulating material. Further, it is possible to provide a substrate including a fine insulating layer pattern as well as a bulk insulating layer pattern by using the insulating composition to overcome an aggregation problem in a conventional inkjet printing method.

Abstract translation: 包含石墨烯氧化物和包含其的绝缘材料的绝缘组合物; 和具有大于5.5的溶剂极性指数（P）的极性溶剂，使用其的绝缘层的基板以及该基板的制造方法。 可以提供包含能够确保石墨烯氧化物的分散性的特定溶剂的绝缘组合物，同时包括具有优异的绝缘和机械性能的石墨烯氧化物作为绝缘材料。 此外，通过使用绝缘组合物来克服常规喷墨打印方法中的聚集问题，可以提供包括精细绝缘层图案的衬底以及体绝缘层图案。

公开(公告)号：US08397378B2

公开(公告)日：2013-03-19

申请号：US12232894

申请日：2008-09-25

Applicant: Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

Inventor： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/02

CPC classification number: H05K1/0366 ,  C08J5/046 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0293 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.