公开(公告)号：US08497432B2

公开(公告)日：2013-07-30

申请号：US12561526

申请日：2009-09-17

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H05K1/16

CPC classification number: H05K3/305 ,  G02F1/13458 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02373 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/03515 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/03831 ,  H01L2224/0519 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/0569 ,  H01L2224/05691 ,  H01L2224/061 ,  H01L2224/06155 ,  H01L2224/06505 ,  H01L2224/08058 ,  H01L2224/08238 ,  H01L2224/09055 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27515 ,  H01L2224/2761 ,  H01L2224/27825 ,  H01L2224/27831 ,  H01L2224/29008 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29017 ,  H01L2224/29023 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29563 ,  H01L2224/2957 ,  H01L2224/29582 ,  H01L2224/29624 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29655 ,  H01L2224/29664 ,  H01L2224/29666 ,  H01L2224/29671 ,  H01L2224/29684 ,  H01L2224/301 ,  H01L2224/30155 ,  H01L2224/30505 ,  H01L2224/32058 ,  H01L2224/32238 ,  H01L2224/33055 ,  H01L2224/80194 ,  H01L2224/80203 ,  H01L2224/80385 ,  H01L2224/80424 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80488 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/8088 ,  H01L2224/80902 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/834 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83488 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83902 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01028

Abstract: An electronic component mounting structure includes a substrate having a terminal, an electronic component having an active face, an electrode that is formed on the active face of the electronic component, a base resin that is formed on the active face, a first opening that is formed at the base resin to expose the electrode, and a conductive film that covers a part of a top surface of the base resin and that is electrically connected to the electrode via the first opening. Because the base resin is bonded to the substrate, the bonding strength between the conductive film located on the top surface of the base resin and the terminal of the substrate is increased. Therefore, the reliability of electrical connection between the conductive film and the terminal is improved.

Abstract translation: 一种电子部件安装结构，包括具有端子的基板，具有有源面的电子部件，形成在电子部件的主动面上的电极，形成在主动面上的基体树脂，第一开口部 形成在所述基体树脂上以露出所述电极;以及导电膜，其覆盖所述基础树脂的顶表面的一部分并且经由所述第一开口电连接到所述电极。 由于基体树脂与基板结合，所以位于基体树脂的上表面的导电膜与基板的端子之间的接合强度提高。 因此，提高了导电膜和端子之间的电连接的可靠性。

公开(公告)号：US08405812B2

公开(公告)日：2013-03-26

申请号：US12861853

申请日：2010-08-24

Applicant: Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

Inventor： Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

IPC: G02F1/1345 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09845 ,  H05K2201/10136 ,  H05K2201/1028

Abstract: A connecting structure of the present invention includes a first substrate, a second substrate on which the first substrate is laminated, and a sheet like connection body having one end connected to one principal surface of the first substrate and another end connected to one principal surface of the second substrate, wherein a lengthwise direction of the sheet like connection body is parallel to a perimeter part of the first substrate, and the sheet like connection body has a slit part extending from one of end portions thereof to a part thereof along the lengthwise direction, and has a first end and a second end divided by the slit part at one of end portions, the first end is connected to a principal surface of the first substrate in vicinity of a peripheral part of the first substrate, and the second end is connected to a principal surface of the second substrate in vicinity of a peripheral part of the first substrate.

Abstract translation: 本发明的连接结构包括第一基板，层叠有第一基板的第二基板以及与第一基板的一个主面连接的一端的片状连接体， 第二基板，其中片状连接体的长度方向平行于第一基板的周边部分，并且片状连接体具有从其一个端部沿其长度方向延伸到其一部分的狭缝部分 并且具有在一个端部处被狭缝部分分割的第一端和第二端，所述第一端在所述第一基板的周边部分附近与所述第一基板的主表面连接，并且所述第二端是 在第一基板的周边部分附近与第二基板的主表面连接。

公开(公告)号：US08383947B2

公开(公告)日：2013-02-26

申请号：US12585101

申请日：2009-09-03

Applicant: Yoshitaka Sugiyama ,  Kenichi Hanazaki ,  Tomokatsu Aizawa

Inventor： Yoshitaka Sugiyama ,  Kenichi Hanazaki ,  Tomokatsu Aizawa

IPC: H05K1/00

CPC classification number: H01R12/61 ,  B23K13/01 ,  B23K20/06 ,  B23K2101/38 ,  H01R43/02 ,  H05K3/28 ,  H05K3/328 ,  H05K3/3494 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0382 ,  H05K2201/058 ,  H05K2203/101

Abstract: The present invention is intended to provide an enhanced conductor module capable of reducing a joint area between conductors, and a method for preparing the same. The conductor module has a pair of flattened circuits each of which comprises a rectangular shaped conductors, a pair of sheeted coverings disposed on both sides of the conductor, and at least one hole having a diameter smaller than a width of the conductor, and formed in the coverings so as to expose one surface of the conductor to outside the flattened circuit. The conductor of one flattened circuit is joined to the conductor of the other flattened circuit via the hole by application of electromagnetic welding.

Abstract translation: 本发明旨在提供能够减少导体之间的接合面积的增强导体模块及其制备方法。 导体模块具有一对扁平电路，每个扁平电路包括矩形导体，设置在导体两侧的一对片状覆盖物，以及直径小于导体宽度的至少一个孔，并形成在 覆盖物以使导体的一个表面暴露在扁平电路外部。 一个扁平电路的导体通过电磁焊接通过孔与另一个扁平电路的导体接合。

公开(公告)号：US08297517B2

公开(公告)日：2012-10-30

申请号：US12988210

申请日：2009-04-28

Applicant: Akira Shingu ,  Kiyoji Egashira

Inventor： Akira Shingu ,  Kiyoji Egashira

IPC: G06K19/06 ,  H01L23/02

CPC classification number: H01Q7/00 ,  G06K19/07749 ,  H01Q1/38 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4685 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2201/0382

Abstract: Provided are an antenna circuit constituent body for an IC card/tag, which enhances a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body includes the base material made of resin film; and circuit pattern layers formed on each of both sides of the base material and made of aluminum foil. The circuit pattern layer includes a coiled pattern layer. Parts of the circuit pattern layers, which mutually face each other; and a part of the base material, which is interposed between the parts of the circuit pattern layers, constitute a capacitor. The circuit pattern layers are electrically connected by crimping parts. The base material includes a plurality of void-state-air layers. A relative density of the base material with respect to a density of a resin is less than or equal to 0.9.

Abstract translation: 提供一种用于IC卡/标签的天线电路构成体，其通过降低制成基材的树脂膜的介电常数来提高Q值; 和IC卡。 天线电路构成体包括由树脂膜制成的基材; 以及形成在基材的两面的每一侧并由铝箔制成的电路图案层。 电路图案层包括线圈图案层。 相互面对的电路图案层的部分; 并且插入在电路图案层的部分之间的基底材料的一部分构成电容器。 电路图案层通过压接部件电连接。 基材包括多个空隙状态空气层。 基材相对于树脂的密度的相对密度小于或等于0.9。

公开(公告)号：US08101266B2

公开(公告)日：2012-01-24

申请号：US12135842

申请日：2008-06-09

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H01K1/00

CPC classification number: H05K3/4641 ,  H05K3/386 ,  H05K2201/0382 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.

Abstract translation: 多层印刷电路板包括第一印刷电路板，第二印刷电路板，粘合膜和功能层。 粘合膜夹在第一印刷电路板和第二印刷电路板之间。 功能层设置在第一印刷电路板和第二印刷电路板之间，用于阻止水从其中通过，并用于屏蔽第一印刷电路板和第二印刷电路板之间的电磁干扰。

公开(公告)号：US20110198663A1

公开(公告)日：2011-08-18

申请号：US13095059

申请日：2011-04-27

Applicant: Sheng-Jia Sheu ,  Chien-Chang Pei

Inventor： Sheng-Jia Sheu ,  Chien-Chang Pei

IPC: H01L33/62

CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.

Abstract translation: 提供发光二极管的结构。 在一个方面，发光二极管结构包括发光二极管，导电框架和基板。 导电框架电连接到发光二极管，并且具有连接导电框架的第一侧和导电框架与第一侧相对的第二侧的固定孔。 固定孔具有梯形内侧壁，其内侧壁的第一半径与第一侧相邻，小于邻近第二侧的内侧壁的第二半径。 衬底具有通过从导电框架的第一侧进入固定孔而被固定在固定孔中的导电柱，并使其导电柱粘附到固定孔的梯形内侧壁。

公开(公告)号：US07969740B2

公开(公告)日：2011-06-28

申请号：US12720739

申请日：2010-03-10

Applicant: Hideyuki Miyahara

Inventor： Hideyuki Miyahara

IPC: H05K7/20 ,  B32B15/00

CPC classification number: H05K3/44 ,  F28F3/048 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0382 ,  H05K2203/0195 ,  H05K2203/0323 ,  Y10T428/12493

Abstract: In a metal-based print board formed with radiators, a metal foil is affixed to a front surface of a metal plate having good thermal conductivity, an insulating adhesive layer interposed therebetween. A radiator is integrally provided on a reverse surface of the metal plate, the radiator having a plurality of thin radiating fins formed upright in a tabular shape due to having been dug out by an excavating tool. The radiating fins give the radiator a large area over which heat can be released. The thickness of a first metal plate portion formed between adjacent radiating fins is less than the original thickness of the metal plate. Heat generated by an electronic component or another component provided on a side of the front surface of the metal plate is rapidly transmitted from the reduced-thickness first metal plate portion of the metal plate to each of the radiating fins of the radiator on the reverse surface side, and efficiently released from each of the radiating fins, which have a large area over which heat is radiated.

Abstract translation: 在形成有散热器的金属制打印板中，金属箔固定在具有良好导热性的金属板的前表面，绝缘粘合层插入其间。 散热器一体地设置在金属板的背面上，散热器具有由挖掘工具挖出的直立形成为平板状的多个薄的散热片。 散热片为散热器提供了一个可以释放热量的大面积。 形成在相邻散热片之间的第一金属板部分的厚度小于金属板的原始厚度。 由设置在金属板前表面侧的电子部件或其他部件产生的热量从金属板的厚度小的第一金属板部迅速传递到散热器的背面的散热片 并且从散热片的每一个有效地释放，散热片具有大的辐射面积。

公开(公告)号：US07877870B2

公开(公告)日：2011-02-01

申请号：US11521811

申请日：2006-09-15

Applicant: Hideki Yamaguchi ,  Kouichi Tokairin ,  Hirofumi Suzuki ,  Hiroaki Kobayashi ,  Hiroshi Minami

Inventor： Hideki Yamaguchi ,  Kouichi Tokairin ,  Hirofumi Suzuki ,  Hiroaki Kobayashi ,  Hiroshi Minami

IPC: H01R9/00 ,  H05K3/00

CPC classification number: H05K3/363 ,  G11B5/486 ,  G11B25/043 ,  H05K3/3494 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: The tip end of the bonding tip is defined between first and second edges. A first inclined surface gets remoter from a first terminal at a position remoter from the first edge. The second inclined surface likewise gets remoter from the first terminal at a position remoter from the second edge. The solder is contoured by first and second contours on the first terminal. The second terminal is located on the solder between the first and second contours. The tip end of the bonding tip is urged against the second terminal. Heat is transferred from the bonding tip to the solder. The melted solder spreads into gaps between the second terminal and the first and second inclined surfaces. The solder is thus prevented from spreading outside the contour of the first terminal. This results in a reliable avoidance of a short circuit between the adjacent first terminals.

Abstract translation: 接合末端的末端被限定在第一和第二边缘之间。 第一倾斜表面从远离第一边缘的位置处的第一端子远离。 第二倾斜表面同样在距离第二边缘更远的位置处从第一端子偏离。 焊料通过第一端子上的第一和第二轮廓形成轮廓。 第二端子位于第一和第二轮廓之间的焊料上。 接合末端的尖端被推靠在第二端子上。 热量从接合端传递到焊料。 熔融的焊料扩散到第二端子和第一和第二倾斜表面之间的间隙中。 因此防止了焊料扩散到第一端子的轮廓之外。 这导致可靠地避免相邻的第一端子之间的短路。

公开(公告)号：US20110006420A1

公开(公告)日：2011-01-13

申请号：US12878536

申请日：2010-09-09

Applicant: Shigehisa TAJIMI

Inventor： Shigehisa TAJIMI

IPC: H01L23/498

CPC classification number: H05K3/3436 ,  H01L22/12 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K1/189 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2224/0401

Abstract: A method for manufacturing a semiconductor device includes: preparing a wiring board having a base substrate and wiring that is plated on surface with a plating metal; pressing a bump that is formed on the active side of the semiconductor chip against an end part of the wiring of the wiring board, thereby exfoliating the area surrounding the pressed portion of the wiring from the base substrate while keeping the end of the wiring bonded with the base substrate; melting the plating metal that is located on the end part of the wiring, thereby causing the plating metal and the bump to form an alloy that bonds the bump and the wiring and infiltrate the plating metal into a space between the wiring and the base substrate; and judging that the bump and the wiring are well bonded if the plating metal has infiltrated a space between the wiring and the base substrate so as to have an area, width or length of infiltration that exceeds a reference value.

Abstract translation: 一种制造半导体器件的方法包括：制备具有基底基板的布线板和在电镀金属表面上的布线; 将形成在半导体芯片的有源侧上的凸块压在布线板的布线的端部上，从而使布线的端部从基底剥离，同时保持布线的端部与 基底; 熔化位于配线的端部的电镀金属，从而使电镀金属和凸块形成接合突起和布线并将电镀金属浸入布线和基底基板之间的空间的合金; 并且如果电镀金属已经渗透在布线和基底基板之间的空间中，以便具有超过参考值的渗透的面积，宽度或长度，则判断凸块和布线是良好的结合。

公开(公告)号：US20100328903A1

公开(公告)日：2010-12-30

申请号：US12863179

申请日：2008-10-16

Applicant: Shotaro Nagaike

Inventor： Shotaro Nagaike

IPC: H05K7/00

CPC classification number: H05K1/181 ,  G02F1/13452 ,  H01L23/04 ,  H01L23/24 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0382 ,  H05K2201/10128 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611 ,  H01L2924/00

Abstract: A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions.

Abstract translation: 电路板模块包括：具有安装表面的板; 安装在安装表面上的电子部件; 框架，其安装在安装表面上以包围电子部件; 树脂部分，设置在框架内部并紧密接触电子部件，安装表面和框架; 以及覆盖电子部件并与框架连接的盖部。 盖部包括平坦部，该平坦部设置在包含与未被树脂部覆盖的电子部件相对应的区域的区域，并且比其他区域向外突出。