公开(公告)号：US20240226565A9

公开(公告)日：2024-07-11

申请号：US18547999

申请日：2022-03-10

Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

Inventor： Shadi A. Dayeh ,  Youngbin Tchoe ,  Andrew M. Bourhis

IPC: A61N1/36 ,  A61N1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

CPC classification number: A61N1/36125 ,  A61N1/0531 ,  H05K1/113 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/041 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2203/0384 ,  H05K2203/1305

Abstract: A flexible electrode array with hundreds or thousands channels for clinical use includes an array of at least hundreds of electrodes on a flexible biocompatible polymer substrate. Perfusion through holes are provided through the substrate. Individual elongate leads connect to each of the electrodes, the elongate lead connections being supported by the flexible biocompatible polymer substrate and extending away from the array. Flexible biocompatible polymer insulates the individual elongate lead connections and supporting the array. An interposer with individual channel connections is conductively bonded to the individual elongate lead connections. Sterile bag packaging encloses a portion of the interposer, where the outer side of the package including the array and individual elongate lead is sterile while the inner side of the packaging is non-sterile. The portion interposer inside the package is configured to connect to a circuit board within the packaging.

公开(公告)号：US11877485B2

公开(公告)日：2024-01-16

申请号：US17315456

申请日：2021-05-10

Applicant: Samsung Display Co., Ltd.

Inventor： Chung-seok Lee ,  Joonsam Kim ,  Chulho Jung

IPC: H01L27/12 ,  H01K1/14 ,  H01L23/34 ,  H10K59/131 ,  H05K1/14 ,  H05K1/11 ,  H01L23/544 ,  H05K1/02 ,  H10K59/123 ,  H10K59/124 ,  H10K59/121 ,  H01L23/00 ,  H10K102/00

CPC classification number: H10K59/131 ,  H01L23/544 ,  H01L27/1262 ,  H05K1/0271 ,  H05K1/118 ,  H05K1/147 ,  H10K59/123 ,  H10K59/124 ,  H10K59/1213 ,  H01L24/29 ,  H01L24/32 ,  H01L27/124 ,  H01L27/1248 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/2929 ,  H01L2224/32227 ,  H01L2924/1304 ,  H05K2201/041 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10977 ,  H05K2203/166 ,  H10K2102/351 ,  H01L2924/00012

Abstract: Provided is an electronic device including a display panel including a base substrate, pixels, a first insulation layer, and panel pads spaced along a first direction from pixels and each arranged along a second direction crossing the first direction, a circuit board disposed on the display panel and connected to panel pads, and an adhesive interconnect layer disposed between the display panel and the circuit board and electrically connecting the display panel and the circuit board. The circuit board includes a flexible substrate including a top surface facing the base substrate, output pads disposed on the flexible substrate and connected to panel pads, each obliquely extending in the first and second directions and arranged along the second direction, an alignment pad spaced along the second direction from output pads, and a stress relaxation pad disposed between output pads and alignment pads and electrically insulated from panel pads.

公开(公告)号：US20230389180A1

公开(公告)日：2023-11-30

申请号：US17944348

申请日：2022-09-14

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： SHIN-WEN CHEN ,  ZHUANG-ZHUANG JING ,  JING-WEI LI ,  SHUAI-PENG LI

IPC: H05K1/14 ,  H04M1/02 ,  H05K1/02 ,  H05K1/18 ,  H04N5/232

CPC classification number: H05K1/144 ,  H04M1/0264 ,  H05K1/0274 ,  H05K1/18 ,  H04N5/23287 ,  H05K2201/041 ,  H05K2201/10121

Abstract: A dustproof member includes a base plate, a dustproof plate, and a connecting portion. A first through hole is defined by an inner surface of the base plate. A second through hole is defined by an inner surface of the dustproof plate. The connecting portion has a shape of a hollow barrel and defines a hollow cavity. Two opposite ends of the connecting portion are respectively connected to an end of the inner surface of the base plate and an end of the inner surface of the dustproof plate, thereby forming a dust collecting groove between the base plate and the dustproof plate. A camera module having the dustproof member and an electronic device having the camera module are also provided.

公开(公告)号：US11800210B2

公开(公告)日：2023-10-24

申请号：US18074883

申请日：2022-12-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Sang Song

IPC: H04N23/54 ,  H05K1/14 ,  H01F7/08 ,  H01F7/126 ,  H04N23/55 ,  H04N23/57 ,  H04N23/68 ,  H05K1/18 ,  H04N23/51 ,  G02B26/00

CPC classification number: H04N23/54 ,  H01F7/081 ,  H01F7/126 ,  H04N23/55 ,  H04N23/57 ,  H04N23/687 ,  H05K1/147 ,  H05K1/181 ,  G02B26/004 ,  H04N23/51 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10151

Abstract: A sensor driving device includes a first substrate; a second substrate disposed on the first substrate; and an image sensor. The second substrate includes a body having first and second lateral surfaces; a first protrusion part protruding from the first lateral surface; and a second protrusion part protruding from the second lateral surface. The first protrusion part includes a first extension part, and a second extension part extending in a direction different from the first extension part. The second protrusion part includes a first extension part, and a second extension part extending in a direction different from the first extension part. The first extension parts are disposed parallel to an optical axis of the image sensor. The second extension part of the first protrusion part is closer to the second extension part of the second protrusion part than to the first extension part of the second protrusion part.

公开(公告)号：US11784115B2

公开(公告)日：2023-10-10

申请号：US17444266

申请日：2021-08-02

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Roland Wilfing

IPC: H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H05K1/0271 ,  H05K1/11 ,  H05K1/0204 ,  H05K1/0206 ,  H05K2201/041 ,  H05K2201/06 ,  H05K2201/096 ,  H05K2201/09827

Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one electrically insulating layer structure has at least partly tapering through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. In addition, different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.

公开(公告)号：US11765830B2

公开(公告)日：2023-09-19

申请号：US17435158

申请日：2020-12-25

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Lianbin Liu ,  Hengzhen Liang ,  Xu Lu ,  Xiaolong Zhu ,  Qing Gong ,  Hui Wen ,  Ting Qin

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  H05K1/03 ,  G01L9/08 ,  G01L9/02 ,  G01L9/12

CPC classification number: H05K1/144 ,  G01L9/02 ,  G01L9/08 ,  G01L9/12 ,  H05K1/028 ,  H05K1/0218 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: A flexible printed circuit and a display device are provided. The flexible printed circuit includes: a plurality of sub-circuit boards arranged in a stack, wherein the plurality of sub-circuit boards include at least a first sub-circuit board and a second sub-circuit board; and a pressure sensor arranged on the first sub-circuit board, wherein the first sub-circuit board includes: a substrate film; a conductive film arranged on a side of the substrate film away from the second sub-circuit board; an adhesive layer arranged on a side of the conductive film away from the substrate film; a cover layer arranged on a side of the adhesive layer away from the substrate film; and an electromagnetic shielding layer arranged on a side of the cover layer away from the substrate film, wherein at least a part of the conductive film is formed as an electrode of the pressure sensor.

公开(公告)号：US11737212B2

公开(公告)日：2023-08-22

申请号：US17565470

申请日：2021-12-30

Applicant: SHENNAN CIRCUITS CO., LTD.

Inventor： Lixiang Huang ,  Hua Miao ,  Jin Dong

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/041

Abstract: Disclosed are an electronic component package, an electronic assembly, and a voltage regulation module. The electronic component package includes a substrate and a first electronic component. The substrate includes a first surface and a second surface; wherein the first surface is arranged with a first conductive layer, and the second surface is arranged with a second conductive layer. The substrate defines a first conductive hole connected to the first conductive layer and a second conductive hole connected to the second conductive layer. The first electronic component is received in the substrate and arranged with a first electrical connection terminal and a second electrical connection terminal; the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the second conductive layer through the second conductive hole. The first electronic component is a passive electronic component.

公开(公告)号：US11721887B2

公开(公告)日：2023-08-08

申请号：US16996912

申请日：2020-08-19

Applicant: SHENZHEN JAGUAR WAVE TECHNOLOGY LTD.

Inventor： Haibo Li ,  Wei Shin Tung

IPC: H01Q1/38 ,  H01Q1/12 ,  H01Q1/48 ,  H05K1/02 ,  H05K3/46

CPC classification number: H01Q1/38 ,  H01Q1/12 ,  H01Q1/48 ,  H05K1/0243 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/09036

Abstract: A millimeter wave antenna and a process design of a millimeter wave antenna are provided. The millimeter wave antenna includes a substrate and an antenna attached to the substrate. The substrate includes a first region and a second region. A thickness of the first region is less than a thickness of the second region. The antenna is arranged on the first region. According to the present application, the millimeter wave antenna enables the substrate attached with the antenna to be as thin as possible, such that a medium structure of the first region of the substrate is changed, reducing an energy loss while a millimeter wave is being transmitted.

公开(公告)号：US11690172B2

公开(公告)日：2023-06-27

申请号：US17681279

申请日：2022-02-25

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Wm. Todd Crandell

IPC: H05K1/11 ,  H05K1/14 ,  H01R12/00 ,  H05K1/02 ,  H05K3/36 ,  H01R13/717 ,  H01R12/52 ,  H01R4/02 ,  F21Y107/30 ,  F21Y115/10 ,  H05K3/00

CPC classification number: H05K1/0293 ,  H01R4/02 ,  H01R12/00 ,  H01R12/523 ,  H01R13/717 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0292 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/113 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K3/363 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/041 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2201/2027 ,  H05K2203/0228

Abstract: Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

公开(公告)号：US11678438B2

公开(公告)日：2023-06-13

申请号：US17562614

申请日：2021-12-27

Applicant: PANELSEMI CORPORATION

Inventor： Chin-Tang Li

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09609 ,  H05K2201/10121

Abstract: An electronic device includes a supporting board, an electrical board and electronic units. The supporting board includes a circuit layer. The electrical board has a board body, through holes through the board body, an electrical layer on the board body, and primary conductive elements respectively in the through holes. The board body has opposite first and second surfaces. The through holes communicate with the first surface and the second surface. The primary conductive elements electrically connect the electrical layer to the circuit layer. The electronic units are arranged on the first surface. Each electronic unit partially overlaps with one corresponding through hole in a projection direction of the electrical board. Each electronic unit has an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer. The secondary conductive elements and the primary conductive elements are arranged in dislocation in the projection direction.