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公开(公告)号：US20170094773A1
公开(公告)日：2017-03-30
申请号：US15215849
申请日：2016-07-21
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Il-Jong SEO , Ogura ICHIRO , Myung-Sam KANG , Tae-Hong MIN
CPC classification number: H05K1/0206 , H05K1/0207 , H05K1/115 , H05K3/4038 , H05K3/4602 , H05K3/4644 , H05K2201/0338 , H05K2201/049 , H05K2201/06 , H05K2201/09536 , H05K2201/09609 , H05K2201/09645 , H05K2201/10674
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board may include a core layer, a metal layer disposed on the core layer, and a heat dissipation unit disposed to pass through the core layer in across a thickness of the core layer.
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公开(公告)号：US09609741B1
公开(公告)日：2017-03-28
申请号：US15272201
申请日：2016-09-21
Applicant: CANON KABUSHIKI KAISHA
Inventor： Koji Noguchi
CPC classification number: H05K1/0203 , H05K1/0206 , H05K1/0209 , H05K1/181 , H05K2201/06 , H05K2201/09227 , H05K2201/09372 , H05K2201/10015 , H05K2201/10545
Abstract: A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.
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83.发明授权Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board 有权具有电路板的电路板，电子模块和照明装置以及电路板的制造方法公开(公告)号：US09516748B2
公开(公告)日：2016-12-06
申请号：US14407074
申请日：2013-06-14
Applicant: OSRAM GmbH
Inventor： Jianghui Yang , Chuanpeng Zhong , Hao Li , Xiaomian Chen
CPC classification number: H05K1/053 , H01L2224/48091 , H01L2224/73265 , H05K1/0201 , H05K1/0203 , H05K1/0204 , H05K1/0284 , H05K1/0306 , H05K1/056 , H05K1/142 , H05K1/181 , H05K3/10 , H05K2201/048 , H05K2201/06 , H05K2201/09745 , H05K2201/10106 , H05K2201/10416 , Y10T29/49155 , H01L2924/00014
Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.
Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。
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84.发明申请公开(公告)号：US20160260879A1
公开(公告)日：2016-09-08
申请号：US15156030
申请日：2016-05-16
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Seok PARK
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.
Abstract translation: 一种发光器件封装，包括：基底，包括顶部平坦表面; 基底上的绝缘层; 基座上的发光二极管; 光学构件，其包括透光材料，使得从所述发光二极管发出的光穿过其中; 用于引导光学构件的引导构件，所述引导构件具有环形形状; 电连接到所述发光二极管的所述电路层，所述电路层包括电极部分和延伸部分，所述电极部分设置在所述引导部件内并电连接到所述发光二极管，所述延伸部分从所述电极部分延伸 引导成员外; 以及在电路层的电极部分上并电连接到发光二极管的电极层。
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公开(公告)号：US09107308B2
公开(公告)日：2015-08-11
申请号：US14380981
申请日：2013-02-26
IPC: H05K1/03 , H05K1/05 , C04B41/90 , C04B41/00 , C04B41/52 , H05K1/02 , H05K1/09 , H05K3/12 , H01L23/373 , H05K1/18 , C04B111/00
CPC classification number: H05K1/053 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , H01L23/373 , H01L2924/0002 , H05K1/0284 , H05K1/09 , H05K1/181 , H05K3/12 , H05K2201/0104 , H05K2201/0137 , H05K2201/0195 , H05K2201/0323 , H05K2201/06 , H05K2201/10106 , H01L2924/00 , C04B35/522 , C04B41/4539 , C04B41/5001 , C04B41/5031 , C04B41/5089 , C04B41/5059 , C04B41/5092 , C04B41/522 , C04B41/5063 , C04B41/5064 , C04B41/4535 , C04B41/4572 , C04B41/5127
Abstract: Different kinds of printing pastes or inks are utilized in various combinations to develop multiple ceramic dielectric layers on graphitic substrates in order to create effective dielectric ceramic layers that combine good adhesion to both graphitic substrates and printed copper traces, and strong insulating capability. The pastes or inks may comprise a high thermal conductivity powder.
Abstract translation: 不同种类的印刷浆料或油墨被用于各种组合以在石墨基材上形成多个陶瓷电介质层，以便产生有效的介电陶瓷层，其与石墨基材和印刷的铜迹线具有良好的粘合性，并具有很强的绝缘性能。 糊剂或油墨可以包含高导热性粉末。
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Patent Agency Ranking
公开(公告)号：US20150223339A1
公开(公告)日：2015-08-06
申请号：US14685747
申请日：2015-04-14
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Hideyo NAKAMURA , Masafumi HORIO
CPC classification number: H05K1/181 , H01L21/565 , H01L23/04 , H01L23/3107 , H01L23/3735 , H01L23/49833 , H01L24/17 , H01L25/072 , H01L25/18 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H05K1/0212 , H05K1/0243 , H05K1/0296 , H05K3/3447 , H05K7/2089 , H05K2201/0364 , H05K2201/06 , H05K2201/09972 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: A semiconductor device, while being small, makes it possible to achieve low inductance responding to high speed switching. The semiconductor device includes a plurality of conductive pattern members, on each of which is mounted one or a plurality of power semiconductor chips, and a printed circuit board wherein a chip rod-form conductive connection member connected to the power semiconductor chip and a pattern rod-form conductive connection member connected to the conductive pattern member are disposed on the surface opposing the conductive pattern member. The conductive pattern member is formed of a narrow portion and a wide portion, the narrow portion of at least one conductive pattern member and the printed circuit board are connected by the pattern rod-form conductive connection member, and a current path is formed between the conductive pattern member and the power semiconductor chip connected via the chip rod-form conductive connection member to the printed circuit board.
Abstract translation: 半导体器件虽然小，但可以实现响应于高速开关的低电感。 半导体器件包括多个导电图案构件，每个导电图案构件安装有一个或多个功率半导体芯片，以及印刷电路板，其中连接到功率半导体芯片的芯片棒状导电连接构件和图案棒 连接到导电图案构件的导电连接构件设置在与导电图案构件相对的表面上。 导电图案构件由狭窄部分和宽部分形成，至少一个导电图案构件的窄部分和印刷电路板通过图案棒状导电连接构件连接，并且电流路径形成在 导电图案构件和通过芯片棒状导电连接构件连接到印刷电路板的功率半导体芯片。
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87.发明授权公开(公告)号：US08878200B2
公开(公告)日：2014-11-04
申请号：US14066468
申请日：2013-10-29
Applicant: LG Innotek Co., Ltd.
Inventor： Jun Seok Park
IPC: H01L29/267 , H01L33/64 , H01L33/62 , H01L33/60 , F21K99/00 , H01L33/52 , H05K1/18 , H05K1/05 , H05K1/02 , H05K3/24
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.
Abstract translation: 本发明公开了一种发光封装，包括：基座; 基底上的发光器件; 电连接到所述发光装置的电路层; 屏幕构件，具有开口并且设置在与所述发光装置相邻的所述基座上; 以及覆盖所述发光器件的透镜，其中所述屏幕部件的横截面形状的宽度大于所述屏幕部件的横截面形状的高度，其中所述透镜设置在所述屏幕部件上，并且其中 透镜连接到屏幕部件的最上表面。
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公开(公告)号：US20140321061A1
公开(公告)日：2014-10-30
申请号：US14265595
申请日：2014-04-30
Applicant: David Moore , Dean Flockton
Inventor： David Moore , Dean Flockton
IPC: H05K7/20
CPC classification number: G02B6/4269 , B32B7/12 , B32B27/06 , B32B27/281 , G02B6/428 , H05K1/18 , H05K3/301 , H05K7/20 , H05K7/2039 , H05K7/20409 , H05K7/20418 , H05K9/0058 , H05K2201/06 , H05K2201/066 , H05K2201/10121 , H05K2201/10962
Abstract: Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.
Abstract translation: 目前，将可插拔光模块传导热量的热解决方案使用附有弹簧夹的金属散热器。 可插拔模块和散热器之间的接口是简单的金属对金属接触，这本质上是一个差的热接口，并限制了光学模块的散热。 通过使用诸如先进的碳纳米管天鹅绒的导热纤维来增强可插拔光学模块的散热。 该解决方案可以改善散热，同时保持光学模块的可拆卸性。
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公开(公告)号：US20140054622A1
公开(公告)日：2014-02-27
申请号：US14066468
申请日：2013-10-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Seok PARK
IPC: H01L33/64
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.
Abstract translation: 本发明公开了一种发光封装，包括：基座; 基底上的发光器件; 电连接到所述发光装置的电路层; 屏幕构件，具有开口并且设置在与所述发光装置相邻的所述基座上; 以及覆盖所述发光器件的透镜，其中所述屏幕部件的横截面形状的宽度大于所述屏幕部件的横截面形状的高度，其中所述透镜设置在所述屏幕部件上，并且其中 透镜连接到屏幕部件的最上表面。
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公开(公告)号：US08445922B2
公开(公告)日：2013-05-21
申请号：US13651110
申请日：2012-10-12
Applicant: LG Innotek Co., Ltd.
Inventor： Jun Seok Park
IPC: H01L29/267
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a cross-sectional shape of the screen member is substantially rectangular, and a width of the cross-sectional shape of the screen member being larger than a height of the cross sectional shape of the screen member, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.
Abstract translation: 本发明公开了一种发光封装，包括：基座; 基底上的发光器件; 电连接到所述发光装置的电路层; 电路层上的金层; 电连接在发光器件和金层之间的线; 屏幕构件，具有开口并且设置在与所述发光装置相邻的所述基座上; 以及覆盖所述发光器件的透镜，其中所述屏幕部件的截面形状基本上是矩形的，并且所述屏幕部件的横截面形状的宽度大于所述屏幕部件的横截面形状的高度 其中，所述屏幕部件的底面位于比所述发光装置高的位置，并且所述屏部件的整个最上表面与所述透镜接触。
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