公开(公告)号：US20080223611A1

公开(公告)日：2008-09-18

申请号：US12048544

申请日：2008-03-14

Applicant: Takayuki ASHIDA

Inventor： Takayuki ASHIDA

IPC: H05K1/11

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K3/3468 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09627

Abstract: A printed wiring board having a wiring layer formed by a wiring pattern for wiring an electronic circuit comprised of an electric part mounted thereon and including a connecting terminal, a first conductor layer formed by a first conductor pattern that is maintained at either a power potential or a ground potential when the electronic circuit is in operation, a second conductor layer formed by a second conductor pattern that is maintained at either the power potential or the ground potential when the electronic circuit is in operation; and a through hole having the connecting terminal of the electric part inserted therein and including, formed on an internal wall thereof, a conductor film that is directly connected to the first conductor pattern and not directly connected to the second conductor pattern.

Abstract translation: 一种印刷电路板，具有由布线图形形成的布线层，布线图形用于布线电子电路，该电子电路包括安装在其上的电气部件并包括连接端子，第一导体层由第一导体图形形成， 当电子电路处于工作状态时，接地电位由第二导体图案形成的第二导体层，当第二导体图案在电子电路运行时保持在功率电位或接地电位; 以及具有插入其中的电气部件的连接端子并且在其内壁上形成直接连接到第一导体图案而不直接连接到第二导体图案的导体膜的通孔。

公开(公告)号：US07415761B2

公开(公告)日：2008-08-26

申请号：US10356464

申请日：2003-02-03

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07378599B2

公开(公告)日：2008-05-27

申请号：US10338720

申请日：2003-01-09

Applicant: Junichi Somei

Inventor： Junichi Somei

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0201 ,  H01Q1/247 ,  H01Q1/38 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/42 ,  H05K3/4688 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/09718

Abstract: A printed circuit board has a substrate formed of an insulator, a strip line provided on a front surface of the substrate, and a ground metal layer provided on a rear surface of the substrate. An opening is provided in the ground metal layer to reach the substrate. A radio wave receiving converter and an antenna device each include the printed circuit board.

Abstract translation: 印刷电路板具有由绝缘体形成的基板，设置在基板的前表面上的带状线和设置在基板的后表面上的接地金属层。 在接地金属层中设置开口以到达基板。 无线电波接收转换器和天线装置各自包括印刷电路板。

公开(公告)号：US07362576B2

公开(公告)日：2008-04-22

申请号：US11076938

申请日：2005-03-11

Applicant: Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

Inventor： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

IPC: H05K7/20

CPC classification number: H01L23/345 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/062 ,  H01L2924/00012

Abstract: In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the first chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

Abstract translation: 在紧凑型射频模块中，第一芯片形成加热元件，第二芯片形成其工作特性随温度变化而变化或其最大工作温度低于第一芯片的最大工作温度的器件。 多层基板具有多个电介质层和多个导体层，并且机械地支撑第一芯片和第二芯片，其中一些导体层与这些芯片电连接。 该模块可以在整个模块中传导第一芯片产生的热量; 将第一芯片产生的热量从模块的顶面引导到其底面; 并且将来自第一芯片的第一导体图案的热传导中断到放置第二芯片的第二导体图案。

公开(公告)号：US20080068810A1

公开(公告)日：2008-03-20

申请号：US11940758

申请日：2007-11-15

Applicant: Yousuke Watanabe

Inventor： Yousuke Watanabe

IPC: H05K7/20 ,  H04M1/02

CPC classification number: H05K1/0207 ,  G06F1/203 ,  H04M1/0202 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/141 ,  H05K1/148 ,  H05K3/4641 ,  H05K2201/062

Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure. Furthermore, the rigidity of the circuit board can be raised, and the reliability of the mobile terminal device can be improved.

Abstract translation: 在移动终端装置中，在安装了电子部件的电路基板的内部设置有由导热性优异的铜，铝或碳等构件形成的至少一个导热层。 在电子部件中产生的热量通过导热层迅速地分散在电路板的表面方向上，并从电路板的整个面传递到操作部件，例如键和壳体，以及 然后辐射到外面。 利用这种结构，可以抑制操作构件和壳体处的局部温度上升，并且可以使移动终端装置的表面上的温度均匀，而不会显着增加移动终端装置的成本和厚度。 此外，通过采用该结构，可以使用高性能的电子部件。 此外，可以提高电路板的刚性，并且可以提高移动终端装置的可靠性。

公开(公告)号：US20070284138A1

公开(公告)日：2007-12-13

申请号：US11591576

申请日：2006-11-02

Applicant: Chien-Liang Chen ,  Chun-Yu Lee ,  Shih-Ping Chou

Inventor： Chien-Liang Chen ,  Chun-Yu Lee ,  Shih-Ping Chou

IPC: H05K1/16

CPC classification number: H05K3/361 ,  H05K1/0298 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/0969

Abstract: A circuit board is provided. The circuit board includes a first metal layer, at least a second metal layer and at least an insulating layer. The first metal layer has at least a solder pad. The second metal layer does not overlap with the solder pad. The insulating layer is disposed between the second metal layer and the first metal layer.

Abstract translation: 提供电路板。 电路板包括第一金属层，至少第二金属层和至少绝缘层。 第一金属层至少具有焊盘。 第二金属层不与焊盘重叠。 绝缘层设置在第二金属层和第一金属层之间。

公开(公告)号：US20070080465A1

公开(公告)日：2007-04-12

申请号：US11396605

申请日：2006-04-04

Applicant: Hideo Ebukuro

Inventor： Hideo Ebukuro

IPC: H01L23/48

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09627

Abstract: A printed board having wiring patterns laminated with insulating layers therebetween is provided. The printed board has a through hole and via holes. A terminal of an electronic component can be inserted into the through hole and a conducting layer is formed on the through hole for connecting wiring patterns of outer layers. A wiring pattern of an inner layer is not connected electrically to the conducting layer. The via holes are provided around the through hole for electrically connecting the wiring pattern of the inner layer and the wiring patterns of the outer layers.

Abstract translation: 提供了具有层压有绝缘层的布线图案的印刷电路板。 印刷电路板具有通孔和通孔。 电子部件的端子可以插入到通孔中，并且在用于连接外层的布线图案的通孔上形成导电层。 内层的布线图案不与导电层电连接。 通孔设置在通孔周围，用于电连接内层的布线图案和外层的布线图案。

公开(公告)号：US07161240B2

公开(公告)日：2007-01-09

申请号：US10184346

申请日：2002-06-27

Applicant: Tina P. Barcley

Inventor： Tina P. Barcley

IPC: H01L23/34 ,  H01L23/10 ,  H01L23/495

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0061 ,  H05K3/3442 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical assemblage reduces heat generated by components during operation. The assemblage has at least one heat-generating component, typically a resistor, and at least one heat-removing element electrically associated with the heat-generating component. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged ends. Heat absorbed by the heat-removing element is then transported to a heat sink, cooperatively associated therewith, for disposal. In an electrical assemblage, a circuit board contains multiple heat generating components each being associated with a heat-removing element of the invention.

Abstract translation: 电气组合减少组件在运行过程中产生的热量。 组合件具有至少一个发热部件，通常为电阻器，以及与发热部件电连接的至少一个散热元件。 除热元件在其中包括多个通孔并且固定地附接到电气部件的尖端，通常在相对的带电端上。 然后将由除热元件吸收的热量输送到散热器，与散热器配合使用，以进行处理。 在电气组合中，电路板包含多个发热部件，每个发热部件与本发明的散热元件相关联。

公开(公告)号：US07145110B1

公开(公告)日：2006-12-05

申请号：US11254078

申请日：2005-10-19

Applicant: Howard Rosen

Inventor： Howard Rosen

IPC: H05B1/02

CPC classification number: H05K3/3426 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/10022 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/10962 ,  Y02P70/613

Abstract: The present invention is a an effective thermal barrier between the thermistor and higher temperature solids or electrical components in a thermostat or its equivalent device. The invention thermal barrier substantially reduces or essentially eliminates undesired conductive heating of the thermistor from support means or other electrical components.

Abstract translation: 本发明是热敏电阻和恒温器或其等效装置中的较高温度固体或电气部件之间的有效热障。 本发明的热障基本上减少或基本上消除了热敏电阻从支撑装置或其它电气部件的不期望的导电加热。

公开(公告)号：US20060268527A1

公开(公告)日：2006-11-30

申请号：US11431097

申请日：2006-05-10

Applicant: Hirokazu Tanaka ,  Hiroyuki Ishibashi

Inventor： Hirokazu Tanaka ,  Hiroyuki Ishibashi

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/0201 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/202 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09972 ,  H05K2201/2036 ,  H05K2203/1316

Abstract: In a lead frame board, while a heat radiation wall member formed by a resin having a relatively high thermal conductivity is provided in a low heat-resistance heat generating component mounting region where a low heat-resistance heat generating component is mounted, heat block wall members formed by resins having relatively low thermal conductivities are provided in a high heat-resistance heat generating component mounting region where a high heat-resistance heat generating component is mounted and in a non-heat generating component mounting region where a non-heat generating component is mounted. Thus, heat block is performed between the low heat-resistance heat generating component mounting region and the high heat-resistance heat generating component mounting region and non-heat generating component mounting region, and a heat radiation function is enhanced in the low heat-resistance heat generating component.

Abstract translation: 在引线框架板中，在安装有低耐热性发热部件的低耐热发热部件安装区域中设置由具有较高导热性的树脂形成的散热壁部件，但是热阻壁 在具有较高耐热发热部件的高耐热发热部件安装区域和非发热部件安装区域中设置具有较低热导率的树脂构成的部件， 被安装。 因此，在低耐热性发热部件安装区域和高耐热发热部件安装区域和非发热部件安装区域之间进行热阻，并且在低耐热性下提高散热功能 发热部件。