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公开(公告)号：US09595487B2
公开(公告)日：2017-03-14
申请号：US13925900
申请日：2013-06-25
Applicant: Infineon Technologies AG
Inventor： Ralf Otremba , Klaus Schiess , Anton Mauder
IPC: H01L23/367 , H01L23/31 , H01L23/40 , H01L23/495 , H05K1/02 , H05K3/34
CPC classification number: H01L23/3675 , H01L23/3107 , H01L23/4006 , H01L23/4093 , H01L23/49562 , H01L2224/06181 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/1431 , H05K1/0203 , H05K1/0265 , H05K1/0287 , H05K3/3447 , H05K2201/066 , H05K2201/09227 , H01L2924/00
Abstract: Various embodiments may provide a circuit arrangement. The circuit arrangement may include a carrier having at least one electrically conductive line; a plurality of discrete encapsulated integrated circuits arranged on the carrier; wherein a first integrated circuit of the plurality of integrated circuits is in electrical contact with a second integrated circuit of the plurality of integrated circuits to form a first current path bypassing the carrier; and wherein the first integrated circuit of the plurality of integrated circuits is in electrical contact with the second integrated circuit of the plurality of integrated circuits to form a second current path via the at least one electrically conductive line.
Abstract translation: 各种实施例可以提供电路装置。 电路装置可以包括具有至少一个导电线的载体; 布置在载体上的多个分立封装集成电路; 其中所述多个集成电路的第一集成电路与所述多个集成电路中的第二集成电路电接触以形成绕过所述载体的第一电流路径; 并且其中所述多个集成电路中的所述第一集成电路与所述多个集成电路中的所述第二集成电路电接触以形成经由所述至少一个导电线路的第二电流路径。
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公开(公告)号：US20170064870A1
公开(公告)日：2017-03-02
申请号：US15342073
申请日：2016-11-02
Applicant: SanDisk Technologies LLC
Inventor： David A. Wright , David Dean , Robert W. Ellis
CPC classification number: H05K7/20709 , H05K1/0203 , H05K1/0207 , H05K1/0254 , H05K1/0259 , H05K1/181 , H05K7/1489 , H05K7/2039 , H05K7/205 , H05K2201/066 , H05K2201/10159
Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.
Abstract translation: 本文描述的各种实施例包括用于消散由电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热量的系统，方法和/或设备。 具体地，散热器包括附接结构和突片。 附接结构限定了被配置为接收衬底的边缘并热耦合到衬底的接地平面的槽。 突片位于槽的相对侧并且被配置成滑入组装架的卡引导槽中，使得在使用中，由衬底上的至少一个电子部件产生的热至少部分地通过接地平面传递到 要消散的附件结构。
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公开(公告)号：US20170042027A1
公开(公告)日：2017-02-09
申请号：US15296198
申请日：2016-10-18
Applicant: RAYTHEON COMPANY
Inventor： Peter D. Morico , John D. Walker
CPC classification number: H05K1/142 , H05K1/0209 , H05K3/32 , H05K3/36 , H05K2201/066 , Y10T29/49126
Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.
Abstract translation: 混合电路组件包括其上安装有高电压，大功率部件的集成金属基板（IMS）。 IMS在金属基板上包括金属基板和绝缘粘合剂，以及绝缘粘合剂上的一个或多个布线层。 混合电路组件包括其上安装有低电压，低功率元件的多层印刷电路板（PWB）。 多层PWB连接到IMS并具有与IMS的上表面共面的上表面。 PWB通过绝缘粘合剂安装在金属基板上。
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84.发明授权Passive cooling system integrated into a printed circuit board for cooling electronic components 有权被动冷却系统集成在印刷电路板上，用于冷却电子部件公开(公告)号：US09538633B2
公开(公告)日：2017-01-03
申请号：US13713395
申请日：2012-12-13
Applicant: NVIDIA Corporation
Inventor： Richard Washburn Clay
CPC classification number: H05K1/0206 , H01L2224/16225 , H05K1/0207 , H05K1/0209 , H05K7/205 , H05K2201/066 , H05K2201/09609 , H05K2201/10371 , H05K2201/10734
Abstract: A passive cooling system is provided for dissipating heat from an electronic component. The system includes a printed circuit board including a first dielectric layer and a first conductive layer, an electronic component coupled to the printed circuit board via a plurality of electrical contacts, and a cooling component thermally coupled to the electronic component through the first conductive layer by a micro via thermal array.
Abstract translation: 提供了一种用于从电子部件散热的被动冷却系统。 该系统包括印刷电路板，该印刷电路板包括第一电介质层和第一导电层，经由多个电触头耦合到印刷电路板的电子部件以及通过第一导电层热耦合到电子部件的冷却部件 微通道热阵列。
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85.发明授权System for modular multi-panel display wherein each display is sealed to be waterproof and includes array of display elements arranged to form display panel surface 有权用于模块化多面板显示器的系统，其中每个显示器被密封以防水，并且包括布置成形成显示面板表面的显示元件阵列公开(公告)号：US09535650B2
公开(公告)日：2017-01-03
申请号：US14948939
申请日：2015-11-23
Applicant: Ultravision Technologies, LLC
Inventor： William Y. Hall
IPC: G03F3/00 , G06F3/14 , G06F3/147 , H05K7/20 , H05K1/18 , H05K5/03 , F21V23/02 , F21V31/00 , G06F1/16 , G06F1/18 , G09F9/302 , G09F13/22 , H01B7/282 , H01B9/00 , H01B11/02 , H05K5/00 , H05K5/02 , H05K7/14 , G06F1/26 , H04N7/00 , G09G3/32 , F21Y101/00
CPC classification number: G09F13/22 , F21K9/20 , F21K9/90 , F21V23/023 , F21V31/005 , F21Y2101/00 , F21Y2115/10 , G06F1/1601 , G06F1/182 , G06F1/183 , G06F1/188 , G06F1/189 , G06F1/20 , G06F1/26 , G06F3/1446 , G06F3/147 , G09F9/3023 , G09F2013/222 , G09G3/006 , G09G3/32 , G09G5/14 , G09G2300/026 , G09G2320/029 , G09G2330/02 , G09G2330/045 , G09G2330/10 , G09G2360/04 , H01B7/2825 , H01B9/003 , H01B11/02 , H04N7/00 , H05K1/181 , H05K3/32 , H05K5/0017 , H05K5/0247 , H05K5/0256 , H05K5/03 , H05K5/06 , H05K7/1422 , H05K7/1427 , H05K7/20 , H05K7/20127 , H05K7/20136 , H05K7/2039 , H05K7/20954 , H05K7/20963 , H05K2201/066 , H05K2201/10106 , H05K2201/10128 , Y02P70/611
Abstract: Embodiments of the present invention relate to integrated modular display systems. In one embodiment, a modular multi-panel display system includes a mechanical support structure, and a plurality of display panels detachably mounted to the mechanical support structure so as to form an integrated display panel. Each LED panel includes an LED array and an LED driver coupled to the LED array. Each panel further includes a power supply unit disposed outside the housing and electrically coupled to the receiver circuit. The mechanical structure is configured to provide mechanical support to the plurality of display panels without providing hermetic sealing. Each of the plurality of display panels is hermetically sealed.
Abstract translation: 本发明的实施例涉及集成模块化显示系统。 在一个实施例中，模块化多面板显示系统包括机械支撑结构和可拆卸地安装到机械支撑结构上的多个显示面板，以形成集成显示面板。 每个LED面板包括LED阵列和耦合到LED阵列的LED驱动器。 每个面板还包括设置在壳体外部并电耦合到接收器电路的电源单元。 机械结构被配置为在不提供密封的情况下向多个显示面板提供机械支撑。 多个显示面板中的每一个被气密地密封。
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Patent Agency Ranking
公开(公告)号：US20160348884A1
公开(公告)日：2016-12-01
申请号：US14725936
申请日：2015-05-29
Applicant: Cree, Inc.
Inventor： Bart P. Reier , Curt Progl , Daniel J. Van Epps, JR. , John R. Rowlette, JR. , John Adam Edmond , Kurt Wilcox , David Power
CPC classification number: F21V29/70 , F21K9/232 , F21K9/237 , F21V19/003 , F21Y2113/17 , F21Y2115/10 , F21Y2115/15 , H05K1/0209 , H05K2201/066 , H05K2201/10106
Abstract: A LED fixture is provided, the lamp comprising a LED board having a thermally conductive periphery, the LED board comprising at least one LED operable to emit light when energized through an electrical path from a base; and a heat sink assembly thermally coupled to the thermally conductive periphery.
Abstract translation: 提供了一种LED固定装置，该灯包括具有导热周边的LED板，该LED板包括至少一个可操作以在通过电路从基座通电时发光的LED; 以及热耦合到导热周边的散热器组件。
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公开(公告)号：US09504157B2
公开(公告)日：2016-11-22
申请号：US14016806
申请日：2013-09-03
Applicant: RAYTHEON COMPANY
Inventor： Peter D. Morico , John D. Walker
CPC classification number: H05K1/142 , H05K1/0209 , H05K3/32 , H05K3/36 , H05K2201/066 , Y10T29/49126
Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.
Abstract translation: 混合电路组件包括其上安装有高电压，大功率部件的集成金属基板（IMS）。 IMS在金属基板上包括金属基板和绝缘粘合剂，以及绝缘粘合剂上的一个或多个布线层。 混合电路组件包括其上安装有低电压，低功率元件的多层印刷电路板（PWB）。 多层PWB连接到IMS并具有与IMS的上表面共面的上表面。 PWB通过绝缘粘合剂安装在金属基板上。
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公开(公告)号：US09497889B2
公开(公告)日：2016-11-15
申请号：US14275690
申请日：2014-05-12
Applicant: SanDisk Enterprise IP LLC
Inventor： David A. Wright , David Dean , Robert W. Ellis
CPC classification number: H05K7/20709 , H05K1/0203 , H05K1/0207 , H05K1/0254 , H05K1/0259 , H05K1/181 , H05K7/1489 , H05K7/2039 , H05K7/205 , H05K2201/066 , H05K2201/10159
Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system includes a substrate, at least one electronic component, and a heat sink. The at least one electronic component is mechanically coupled to the substrate and thermally coupled to a ground plane of the substrate, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate. The heat sink is mechanically coupled to an edge of the substrate, and thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component. In some embodiments, the heat sink further includes an attachment structure, a tab and a plurality of heat dissipaters.
Abstract translation: 本文描述的各种实施例包括用于消散由电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热的系统，方法和/或设备。 一方面，电子系统包括基板，至少一个电子部件和散热器。 所述至少一个电子部件机械耦合到所述基板并且热耦合到所述基板的接地平面，使得由所述至少一个电子部件产生的热量至少部分地被耗散到所述基板的接地平面。 散热器机械耦合到衬底的边缘，并且热耦合到衬底的接地平面，以至少部分地耗散由至少一个电子部件产生的热量。 在一些实施例中，散热器还包括附接结构，突片和多个散热器。
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公开(公告)号：US20160320813A1
公开(公告)日：2016-11-03
申请号：US15205319
申请日：2016-07-08
Applicant: Western Digital Technologies, Inc.
Inventor： Kevin M. TAKEUCHI , ROBERT G. FAIRCHILD
CPC classification number: G06F1/20 , F16B5/0233 , F16B35/06 , H05K1/021 , H05K7/20172 , H05K7/20409 , H05K2201/066 , Y10T29/49117
Abstract: A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.
Abstract translation: 一种计算机系统，包括包括周边部分和中间部分的散热器，电路板，被配置为固定到电路板的第一控制器，被配置为将散热器固定到外围电路板的一个或多个附接装置 散热器的一部分，以及支座部件。 支架部件包括构造成将支架部件固定到电路板的第一螺纹部分，以及配置成将支架部件固定到散热器中部处的散热器的第二螺纹部分。 一个或多个附接装置和支架部件构造成将散热器固定到电路板并且允许散热器与第一控制器热接触。
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公开(公告)号：US09474188B2
公开(公告)日：2016-10-18
申请号：US14265595
申请日：2014-04-30
Applicant: Lumentum Operations LLC
Inventor： David Moore , Dean Flockton
CPC classification number: G02B6/4269 , B32B7/12 , B32B27/06 , B32B27/281 , G02B6/428 , H05K1/18 , H05K3/301 , H05K7/20 , H05K7/2039 , H05K7/20409 , H05K7/20418 , H05K9/0058 , H05K2201/06 , H05K2201/066 , H05K2201/10121 , H05K2201/10962
Abstract: Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.
Abstract translation: 目前，将可插拔光模块传导热量的热解决方案使用附有弹簧夹的金属散热器。 可插拔模块和散热器之间的接口是简单的金属对金属接触，这本质上是一个差的热接口，并限制了光学模块的散热。 通过使用诸如先进的碳纳米管天鹅绒的导热纤维来增强可插拔光学模块的散热。 该解决方案可以改善散热，同时保持光学模块的可拆卸性。
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