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    Vehicle accessory control arrangement
    84.
    发明授权
    Vehicle accessory control arrangement 有权
    车辆附件控制装置

    公开(公告)号：US09538589B2

    公开(公告)日：2017-01-03

    申请号：US14168036

    申请日：2014-01-30

    Applicant: UUSI, LLC

    Inventor： David W. Shank ,  John M. Washeleski ,  Edward J. Cox, II

    IPC: B60Q1/14 ,  H05B33/08 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K1/16

    CPC classification number: H05B33/0803 ,  H05B33/086 ,  H05K1/02 ,  H05K1/117 ,  H05K1/142 ,  H05K1/16 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10356

    Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

    Abstract translation: 车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。 第一电路板各自具有支撑在基板上的多个电路元件的基板。 第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。 第二电路板各自具有支撑在它们上的多个电路元件的基板。 第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。 第二电路板基板包括与外边缘轮廓的多个第二偏差。 第二偏差的至少一部分不同于第一电路板的第一偏差。

    Thermoforming a substrate bearing LEDs into a curved bulb enclosure
    85.
    发明授权
    Thermoforming a substrate bearing LEDs into a curved bulb enclosure 有权
    将带有LED的基板热成型为弯曲的灯泡外壳

    公开(公告)号：US09528667B1

    公开(公告)日：2016-12-27

    申请号：US14844796

    申请日：2015-09-03

    Applicant: Rodrigo M. Pereyra

    Inventor： Rodrigo M. Pereyra

    IPC: F21V23/00 ,  F21K99/00 ,  H05K3/00

    CPC classification number: F21K9/90 ,  F21K9/232 ,  F21V23/005 ,  F21Y2107/20 ,  F21Y2115/10 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2201/09027 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/085 ,  H05K2203/1453

    Abstract: A method of manufacturing a lamp comprising forming a first sheet segment (48) into a first shell portion (110) after forming a first electrically conductive trace (70) on the first sheet segment (48) and after placing a first plurality of LEDs (90) on the first sheet segment (48); forming a second sheet segment (50) into a second shell portion (120) after forming a second electrically conductive trace (80) on the second plastic segment (50) and after placing a second plurality of LEDs (90) on the second sheet segment (50); and joining the first shell portion (110) and the second shell portion (120) into a bulb enclosure (40) defining an interior region (42) therein. The first and second sheet segments (48, 50) are preferably thermoformed and may be connected by a web (60).

    Abstract translation: 一种制造灯的方法，包括在第一片段（48）上形成第一导电迹线（70）之后并且在放置第一多个LED（第一片段）之后，将第一片段（48）形成第一壳部分（110） 90）在第一片段（48）上; 在第二塑料段（50）上形成第二导电迹线（80）之后，在将第二多个LED（90）放置在第二片段上之后，将第二片段（50）形成第二壳部分（120） （50）; 以及将所述第一外壳部分（110）和所述第二外壳部分（120）接合到其中限定内部区域（42）的灯泡外壳（40）中。 第一和第二片段（48,50）优选地被热成型，并且可以通过网（60）连接。

    Component-embedded resin substrate
    86.
    发明授权
    Component-embedded resin substrate 有权
    部件嵌入式树脂基板

    公开(公告)号：US09526176B2

    公开(公告)日：2016-12-20

    申请号：US14246682

    申请日：2014-04-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Norio Sakai ,  Yoshihito Otsubo

    IPC: H05K1/18 ,  H01L23/498 ,  H01L23/50 ,  H01L23/00 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/186 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0195 ,  H05K2201/09027 ,  H05K2201/10507 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.

    Abstract translation: 嵌入树脂组件的树脂基板包括树脂结构体，该树脂结构体包括多个层压树脂层，并且具有围绕树脂层的外周的端面和嵌入树脂结构体中的多个嵌入部件。 多个嵌入式组件包括第一嵌入组件和第二嵌入组件。 当在平面视图中观察时，第一嵌入部件具有沿最靠近第一嵌入部件的端面5的一部分延伸的第一外侧。 当在平面视图中观察时，第二嵌入部件具有沿最靠近第二嵌入部件的端表面的一部分延伸的第二外侧。 当在平面图中观察时，外侧与第二外侧倾斜。

    FIELD DEVICE USING A SEAL BOARD ASSEMBLY
    88.
    发明申请
    FIELD DEVICE USING A SEAL BOARD ASSEMBLY 有权
    使用密封板组件的现场设备

    公开(公告)号：US20160093997A1

    公开(公告)日：2016-03-31

    申请号：US14501321

    申请日：2014-09-30

    Applicant: Rosemount Inc.

    Inventor： Christopher Eriksen ,  Michael Barth

    IPC: H01R25/00 ,  H01R13/719 ,  H01R13/52

    CPC classification number: H01R25/006 ,  H01L2224/73265 ,  H01R9/2466 ,  H01R12/55 ,  H01R12/585 ,  H01R13/5202 ,  H01R13/719 ,  H01R24/68 ,  H05K1/115 ,  H05K3/3447 ,  H05K3/429 ,  H05K7/026 ,  H05K2201/09027 ,  H05K2201/09309 ,  H05K2201/10015 ,  H05K2201/10303

    Abstract: A seal board includes a circuit board with vias, conductor pins, and solder joints. The solder joints connect and seal each conductor pin to a single via, such that each conductor pin extends through the via and extends from a first side of the circuit board and a second side of the circuit board. The seal board is mounted to cover an opening in a bulkhead that separates a first compartment (such as a terminal block compartment) from a second compartment (such as an electronics or feature board compartment). The seal board provides electrical paths between the compartments while protecting components within one of the compartments from the surrounding environment.

    Abstract translation: 密封板包括具有通孔，导体引脚和焊点的电路板。 焊接点将每个导体销连接并密封到单个通孔，使得每个导体引脚延伸穿过通孔并从电路板的第一侧和电路板的第二侧延伸。 密封板被安装成覆盖隔离第一隔室（例如端子排隔室）与第二隔室（例如电子设备或特征板隔室）的隔板中的开口。 密封板在隔室之间提供电气路径，同时保护隔室内的部件与周围环境保持一致。

    PRINTED CIRCUIT BOARD AND ELECTRIC FILTER
    90.
    发明申请
    PRINTED CIRCUIT BOARD AND ELECTRIC FILTER 审中-公开
    印刷电路板和电动过滤器

    公开(公告)号：US20150327356A1

    公开(公告)日：2015-11-12

    申请号：US14409525

    申请日：2012-06-28

    Applicant: Claes KJELLSTRÖM

    Inventor： Claes KJELLSTRÖM

    IPC: H05K1/02 ,  A47L9/28 ,  H02K11/00

    CPC classification number: H05K1/0218 ,  A47L9/28 ,  H02K11/0094 ,  H02K11/01 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/0233 ,  H05K2201/0715 ,  H05K2201/09027 ,  H05K2201/09063

    Abstract: A printed circuit board and an electric filter. The printed circuit board is arranged to accommodate an electric circuitry on one side, and an electrically conductive material on the other side which forms a common ground point with the electric circuitry and a device contacting the conductive material. The electric filter for filtering electric signals of a DC motor includes a freewheeling diode coupled in parallel to the motor, a capacitor coupled in parallel to the motor, where a ground terminal of the capacitor is coupled to a chassis of the motor, a low pass filter including a ferrite bead and another capacitor is connected to each motor terminal (M+, M−), and a resistor-capacitor filter is coupled in parallel to the motor.

    Abstract translation: 印刷电路板和电动过滤器。 印刷电路板被布置成在一侧容纳电路，另一侧的导电材料与电路和与导电材料接触的装置形成公共接地点。 用于滤波直流电动机的电信号的滤波器包括并联于电动机的续流二极管，与电动机并联耦合的电容器，其中电容器的接地端子耦合到电动机的底盘，低通 滤波器包括铁氧体磁珠和另一个电容器连接到每个电动机端子（M +，M-），并且电阻 - 电容滤波器并联到电动机。

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