公开(公告)号：US07964957B2

公开(公告)日：2011-06-21

申请号：US12342363

申请日：2008-12-23

Applicant: Mitsuru Noguchi ,  Sadamichi Takakusaki

Inventor： Mitsuru Noguchi ,  Sadamichi Takakusaki

IPC: H01L23/24

CPC classification number: H05K1/05 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/44 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09745 ,  H05K2203/1572 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.

Abstract translation: 一种包括金属基板的半导体器件，包括顶表面，底表面和四个侧表面，与金属基板绝缘的导电图案，以及安装在导电图案上并电连接到导电图案的半导体元件。 顶面绝缘。 金属基板的每个侧表面包括第一倾斜侧表面和第二倾斜侧表面，以便形成在金属基板的顶表面和底表面之间向外突出的凸形，并且第一倾斜侧表面 一对两个相对的侧表面小于另一对相对侧表面的相应的第一倾斜侧表面。

公开(公告)号：US20100288540A1

公开(公告)日：2010-11-18

申请号：US12808107

申请日：2009-01-16

Applicant: Kazuhiko Honjo ,  Tadashi Nakamura

Inventor： Kazuhiko Honjo ,  Tadashi Nakamura

IPC: H05K1/03

CPC classification number: H05K3/462 ,  H05K1/183 ,  H05K3/4069 ,  H05K3/4697 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/09154 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/068

Abstract: A three-dimensional circuit board includes a lower substrate, a connection layer provided on an upper surface of the lower substrate, and an upper substrate provided on an upper surface of the connection layer. The connection layer exposes a portion of the upper surface of the lower substrate. The connection layer includes an insulating layer having a through-hole, and a via-conductor made of conductive material filling the through-hole. A recess is provided directly above the portion of the upper surface of the lower substrate and is surrounded by a side surface of the upper substrate and a side surface of the connection layer. A portion of the upper surface of the connection layer connected to the side surface of the connection layer inclines in a direction toward the portion of the upper surface of the lower substrate. The portion of the upper surface of the connection layer is provided from the side surface of the connection layer to the via-conductor. A portion of an upper substrate of the upper substrate connected to the side surface of the upper substrate inclines in a direction toward the portion of the upper surface of the lower substrate. The circuit board allows a component to be mounted in the recess efficiently.

Abstract translation: 三维电路板包括下基板，设置在下基板的上表面上的连接层和设置在连接层的上表面上的上基板。 连接层露出下部基板的上表面的一部分。 连接层包括具有通孔的绝缘层和由填充通孔的导电材料制成的通孔导体。 在下基板的上表面的正上方设置凹部，被上基板的侧面和连接层的侧面包围。 连接到连接层的侧表面的连接层的上表面的一部分在朝向下基板的上表面的部分的方向上倾斜。 连接层的上表面的部分从连接层的侧表面提供到通孔导体。 连接到上基板的侧表面的上基板的上基板的一部分在朝向下基板的上表面的部分的方向上倾斜。 电路板允许组件有效地安装在凹槽中。

公开(公告)号：US07649246B2

公开(公告)日：2010-01-19

申请号：US11396526

申请日：2006-04-04

Applicant: Ye-chung Chung ,  Sa-yoon Kang

Inventor： Ye-chung Chung ,  Sa-yoon Kang

IPC: H01L23/495

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  H01L23/3157 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/181 ,  H05K3/281 ,  H05K3/361 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.

Abstract translation: 提供了一种装置，其中具有斜边的玻璃面板与TAB封装灵活地连接。 TAB封装的外引线部分包括连接到玻璃面板上的连接图案的第一宽度的端部，具有大于第一宽度的第二宽度的端子部分和具有在第一宽度之间变化的宽度的过渡部分 和第二宽度。 当连接TAB封装时，相应的外引线部分的过渡部分设置在玻璃面板的斜边上。

公开(公告)号：US07504722B2

公开(公告)日：2009-03-17

申请号：US11135668

申请日：2005-05-24

Applicant: Isao Ochiai

Inventor： Isao Ochiai

IPC: H01L23/04

CPC classification number: H05K3/3442 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/81 ,  H01L24/83 ,  H01L29/0657 ,  H01L2221/6834 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16105 ,  H01L2224/2919 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/10156 ,  H05K2201/0367 ,  H05K2201/09154 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/013

Abstract: The invention provides a semiconductor device and a manufacturing method thereof where mounting strength and accuracy can be improved without making processes complex. Grooves are formed on a back surface of a semiconductor substrate along a dicing line. Via holes are formed penetrating the semiconductor substrate from its back surface to pad electrodes. Embedded electrodes are then formed in the via holes, and a wiring layer connected with the embedded electrodes is formed extending to a region near a dicing line. Conductive terminals are formed at end portions of the wiring layer. Then, dicing is performed along the dicing line to complete the semiconductor device having inclined surfaces at end portions of its back surface. When the semiconductor device is connected with the circuit board by a reflow process, conductive paste having increased fluidity covers the conductive terminals and the inclined surfaces. The conductive paste having side fillets are formed on the circuit board around an outer edge of the semiconductor device.

Abstract translation: 本发明提供一种半导体器件及其制造方法，其中可以在不使工艺复杂化的情况下提高安装强度和精度。 沟槽沿着切割线形成在半导体衬底的背面上。 穿过半导体衬底的通孔从其背面到焊盘电极。 然后在通孔中形成嵌入电极，并且与嵌入电极连接的布线层形成为延伸到切割线附近的区域。 导电端子形成在布线层的端部。 然后，沿着切割线进行切割，以完成其后表面的端部具有倾斜表面的半导体器件。 当半导体器件通过回流工艺与电路板连接时，具有增加的流动性的导电膏覆盖导电端子和倾斜表面。 具有侧片的导电膏在半导体器件的外边缘周围形成在电路板上。

公开(公告)号：US07336498B2

公开(公告)日：2008-02-26

申请号：US10952591

申请日：2004-09-28

Applicant: Hem P. Takiar ,  Robert Miller

Inventor： Hem P. Takiar ,  Robert Miller

IPC: H05K1/14

CPC classification number: G06K19/07732 ,  G06K13/0825 ,  G06K19/077 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/02 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2203/0271 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.

Abstract translation: 大致描述的本发明涉及一种小型存储卡，其包括允许存储卡更容易由用户处理的特征。 在各种实施例中，存储卡可以包括倒角和/或凸起部分，其允许存储卡被人的手（或机械装置）更容易地抓住，并且还提供额外的空间以存储诸如电容器和/ 或电阻器。 因为不同的电子设备使用不同类型的存储卡，所以提供了一种适配器，其允许本文所公开的存储卡被用在用于其他类型的存储卡的电子设备上的端口或连接器中。

公开(公告)号：US20080037230A1

公开(公告)日：2008-02-14

申请号：US11826754

申请日：2007-07-18

Applicant: Yuki Yoneu

Inventor： Yuki Yoneu

IPC: H01L23/12 ,  H01R12/04 ,  H05K5/00

CPC classification number: H05K1/148 ,  H01L2224/48091 ,  H01L2924/19107 ,  H05K1/0237 ,  H05K1/0286 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/366 ,  H05K2201/091 ,  H05K2201/09154 ,  H05K2201/09918 ,  H05K2203/175 ,  H01L2924/00014

Abstract: A circuit board has circuitry including a first part and a second part connected to each other via a given first dividing plane. After the circuitry is divided by the first dividing plane, the circuitry can be restored by reconnecting the first part and the second part. The circuit board further has: first division assisting means for facilitating division of the circuit board; and first connection assisting means for facilitating reconnection of the first part and the second part. This eliminates the need to prepare different circuit boards having different specifications, making it possible to efficiently incorporate the circuit board in as many types of devices as possible.

Abstract translation: 电路板具有包括经由给定的第一分割平面相互连接的第一部分和第二部分的电路。 在电路被第一分割平面分割之后，可以通过重新连接第一部分和第二部分来恢复电路。 电路板还具有：便于划分电路板的第一分区辅助装置; 以及用于促进第一部分和第二部分的重新连接的第一连接辅助装置。 这样就不需要准备具有不同规格的不同电路板，从而可以将电路板有效地并入尽可能多的器件类型。

公开(公告)号：US20080022523A1

公开(公告)日：2008-01-31

申请号：US11868148

申请日：2007-10-05

Applicant: Alan Wang ,  Kevin Olson

Inventor： Alan Wang ,  Kevin Olson

IPC: H05K3/00 ,  H01K3/10

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US20070279890A1

公开(公告)日：2007-12-06

申请号：US11784736

申请日：2007-04-09

Applicant: Hiroyuki Motohara ,  You Kondoh ,  Mikio Nakamura ,  Takanori Sekido ,  Shinji Yasunaga

Inventor： Hiroyuki Motohara ,  You Kondoh ,  Mikio Nakamura ,  Takanori Sekido ,  Shinji Yasunaga

IPC: H05K7/00 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01L2224/16 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4685 ,  H05K2201/042 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49126

Abstract: A stacked mounting structure includes a first substrate, a second substrate, and an intermediate substrate which has a space accommodating therein components to be mounted. A first contact (connecting) terminal and a second contact (connecting) terminal are formed on the first substrate and the second substrate, and have a wire which is formed on a side surface of the intermediate substrate. By formation of the intermediate substrate to be on an inner side than an edge surface of the substrates, a part of the two contact terminals respectively are exposed. One end of the wire is connected to an exposed portion of the first contact terminal, and the other end of the wire is connected to an exposed portion of the second contact terminal.

Abstract translation: 堆叠的安装结构包括第一基板，第二基板和中间基板，其具有容纳要安装的部件的空间。 第一接触（连接）端子和第二接触（连接）端子形成在第一基板和第二基板上，并且具有形成在中间基板的侧表面上的线。 通过形成位于比基板的边缘表面更内侧的中间基板，分别露出两个接触端子的一部分。 线的一端连接到第一接触端子的暴露部分，并且导线的另一端连接到第二接触端子的暴露部分。

公开(公告)号：US07264997B2

公开(公告)日：2007-09-04

申请号：US10892483

申请日：2004-07-16

Applicant: Koujiro Kameyama ,  Kiyoshi Mita

Inventor： Koujiro Kameyama ,  Kiyoshi Mita

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.

Abstract translation: 半导体器件包括半导体元件和电连接到半导体元件的电极，半导体元件和电极被具有绝缘性能的密封剂密封，电极暴露在通过接合剂连接到安装表面上 外部安装电路板，其中电极被成形为使得当安装表面经由接合剂连接到安装电路板时，接合剂可以从围绕安装表面的侧表面可视地识别。

公开(公告)号：US20070099483A1

公开(公告)日：2007-05-03

申请号：US11476849

申请日：2006-06-29

Applicant: Ching-Cheng Tsai

Inventor： Ching-Cheng Tsai

IPC: H01R12/24

CPC classification number: H05K1/118 ,  H01R12/592 ,  H05K1/117 ,  H05K2201/09154 ,  H05K2203/0346 ,  Y10S439/951

Abstract: A flexible circuit board is provided, comprising a flexible substrate having an upper surface and a lower surface and a plurality of electrically conductive pads overlaid on an upper surface of the flexible substrate. Front ends of the electrically conductive pads do not reach a front edge of the flexible substrate and are separated from the front edge of the flexible substrate by a distance.