公开(公告)号：US07463122B2

公开(公告)日：2008-12-09

申请号：US10558888

申请日：2004-06-01

Applicant: Taras Kushta ,  Kaoru Narita ,  Takanori Saeki ,  Tomoyuki Kaneko ,  Hirokazu Tohya

Inventor： Taras Kushta ,  Kaoru Narita ,  Takanori Saeki ,  Tomoyuki Kaneko ,  Hirokazu Tohya

IPC: H01P1/04

CPC classification number: H05K1/0222 ,  H01P3/06 ,  H05K1/024 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

Abstract: A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Abstract translation: 一种用于具有优选特性阻抗并能够使包括多层印刷电路板的印刷电路板小型化并且扩展安装在印刷电路板上的通孔传输线的频率范围的印刷电路板的紧凑型通路传输线，以及设计方法 一样的。 传输线具有形成内导体层边界的中心导体，构成信号通孔，围绕中心导体布置的多个通孔形成外导体层边界，以及由印刷电路板导体形成的多个导体板 通过传输线在压缩体的内部和外部导体层边界之间进一步设置本构参数调整间隙孔，并且电隔离以防止通过信号通孔传播的信号与其他信号在高电平中的串扰 频率信号频带。

公开(公告)号：US20080264685A1

公开(公告)日：2008-10-30

申请号：US12010437

申请日：2008-01-24

Applicant: Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

Inventor： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC: H05K1/11 ,  H01F1/00

CPC classification number: H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

Abstract: An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

Abstract translation: 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US07436268B2

公开(公告)日：2008-10-14

申请号：US11217658

申请日：2005-08-31

Applicant: Shin-Shing Jiang ,  Sheng-Yuan Lee

Inventor： Shin-Shing Jiang ,  Sheng-Yuan Lee

IPC: H03H7/38

CPC classification number: H01R12/58 ,  H01R12/7064 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09281 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/09809 ,  H05K2201/10189

Abstract: A signal transmission structure for connecting a coaxial cable connector is provided. The coaxial cable connector has a signal pin. The signal transmission structure includes a reference plane and a conductive layer, and the conductive layer is located on one side of the reference plane. Moreover, the conductive layer includes a signal perforated pad, a first line segment, a second line segment, and a compensation pad. The signal pin is suitable for threading the signal perforated pad. The first line segment is connected to the signal perforated pad, and the compensation pad is connected between the first line segment and the second line segment.

Abstract translation: 提供了用于连接同轴电缆连接器的信号传输结构。 同轴电缆连接器有一个信号引脚。 信号传输结构包括参考平面和导电层，并且导电层位于参考平面的一侧。 此外，导电层包括信号穿孔垫，第一线段，第二线段和补偿垫。 信号针适用于信号穿孔垫的穿线。 第一线段连接到信号穿孔焊盘，补偿焊盘连接在第一线段和第二线段之间。

公开(公告)号：US20080230254A1

公开(公告)日：2008-09-25

申请号：US12111317

申请日：2008-04-29

Applicant: Kazuyoshi Kobayashi ,  Kenichiro Hanamura ,  Tomomitsu Hori

Inventor： Kazuyoshi Kobayashi ,  Kenichiro Hanamura ,  Tomomitsu Hori

IPC: H01B7/08

CPC classification number: H05K1/0219 ,  H05K1/0393 ,  H05K3/4647 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618

Abstract: A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.

Abstract translation: 提供传输电缆及其制造方法。 多个信号线形成在绝缘层的一侧，并且在信号线之间形成接地线。 接地线通过形成并嵌入在绝缘层中的金属凸块与与绝缘层的背面形成的屏蔽层电连接。 可以在夹着信号线和接地线的相对侧上形成绝缘层和屏蔽层。 在这种情况下，接地线分别通过其两侧的金属凸块与屏蔽层电连接。 因此，可以提供能够高速传输和大容量传输的高度可靠的传输电缆。

公开(公告)号：US20080212283A1

公开(公告)日：2008-09-04

申请号：US11997764

申请日：2006-08-04

Applicant: Alexander Chernyakov ,  Patric Heide ,  Johann Heyen ,  Thomas Von Kerssenbrock

Inventor： Alexander Chernyakov ,  Patric Heide ,  Johann Heyen ,  Thomas Von Kerssenbrock

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H05K1/0207 ,  H01L23/3677 ,  H01L23/552 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/0219 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/16 ,  H05K2201/09618 ,  H05K2201/1006 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one variant, an electrical component is specified, with a substrate (1), through which a heat sink (109) that is integrated into a filter realized in substrate (1) is led. According to a second variant, an electrical component is specified, with a substrate (1), through which a heat sink (103, 104) that serves to conduct signals is led. According to a third variant, an electrical component is specified, with a substrate (1), through which a heat sink (105, 108) that is connected to a conductive surface (111, 112, 113) buried in substrate (1) is led.

Abstract translation: 根据一个变型，使用衬底（1）指定电子部件，通过该衬底将集成在衬底（1）中实现的过滤器中的散热器（109）引导到衬底（1）。 根据第二变型，电气部件被指定为具有用于传导信号的用于传导信号的散热器（103,104）的基板（1）。 根据第三变型，规定电气部件与衬底（1）连接在埋入衬底（1）中的导电表面（111,112,113）上的散热片（105,108），通过该衬底 LED。

公开(公告)号：US20080143358A1

公开(公告)日：2008-06-19

申请号：US11610925

申请日：2006-12-14

Applicant: Keith J. Breinlinger

Inventor： Keith J. Breinlinger

IPC: G01R1/067 ,  G01R31/02 ,  H01R43/00

CPC classification number: G01R1/18 ,  G01R1/07342 ,  G01R3/00 ,  H05K1/0219 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618 ,  Y10T29/49204

Abstract: A method of fabricating a guard structure can include depositing an insulating material over at least a portion of electrical signal conductors disposed on a component of a probe card assembly, and depositing an electrically conductive material onto the insulating material and at least a portion of electrical guard conductors disposed on the component of the probe card assembly. Each signal conductor can be disposed between a pair of the guard conductors. The probe card assembly can include a plurality of probes disposed to contact an electronic device to be tested. The signal conductors can be part of electrical paths within the probe card assembly to the probes.

Abstract translation: 制造防护结构的方法可以包括在布置在探针卡组件的部件上的电信号导体的至少一部分上沉积绝缘材料，以及将导电材料沉积到绝缘材料上以及至少一部分电保护 布置在探针卡组件的部件上的导体。 每个信号导体可以设置在一对保护导体之间。 探针卡组件可以包括多个探针，其布置成接触要测试的电子设备。 信号导体可以是探针卡组件内的探针的电气路径的一部分。

公开(公告)号：US07336221B2

公开(公告)日：2008-02-26

申请号：US10555651

申请日：2005-03-24

Applicant: Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

Inventor： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

IPC: G01S7/28

CPC classification number: H05K1/167 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/183 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A multilayer dielectric substrate includes a first signal via, a second signal via, an internal-layer signal line, an internal-layer ground conductor, and ground vias. The first signal via is connected to a bias-and-control-signal terminal of a high-frequency semiconductor, and is arranged within a region corresponding to the electromagnetic shielding members. The second signal via is arranged outside the region, and is connected to an external terminal for a bias and control signal. The internal-layer signal line connects between the first and the second signal vias. The internal-layer ground conductor is arranged around the first and the second signal vias and the internal-layer signal line. The ground vias are arranged around the first and the second signal vias and the internal-layer signal line, on the internal-layer ground conductor. A resistance film is provided on at least one of an upper surface and a lower surface of the internal-layer signal line.

Abstract translation: 多层介质基板包括第一信号通孔，第二信号通孔，内层信号线，内层接地导体和接地通孔。 第一信号通孔连接到高频半导体的偏置和控制信号端子，并且被布置在对应于电磁屏蔽构件的区域内。 第二信号通孔布置在区域外部，并且连接到用于偏置和控制信号的外部端子。 内层信号线连接在第一和第二信号通孔之间。 内层接地导体围绕第一和第二信号通孔和内层信号线布置。 接地通孔围绕第一和第二信号通孔和内层信号线布置在内层接地导体上。 电阻膜设置在内层信号线的上表面和下表面中的至少一个上。

公开(公告)号：US20070257339A1

公开(公告)日：2007-11-08

申请号：US11382202

申请日：2006-05-08

Applicant: Hsien-Wei Chen ,  Victor Chang ,  Tzu-Jin Yeh ,  Shu-Ying Cho ,  Keh-Jeng Chang ,  Kwang-Leei Young

Inventor： Hsien-Wei Chen ,  Victor Chang ,  Tzu-Jin Yeh ,  Shu-Ying Cho ,  Keh-Jeng Chang ,  Kwang-Leei Young

IPC: H01L23/62

CPC classification number: H01L23/552 ,  H01L23/5225 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K1/0298 ,  H05K2201/09236 ,  H05K2201/09618 ,  H01L2924/00

Abstract: Shield structures are provided. A first and second shield lines are formed over a substrate and coupled with a first voltage. A conductive line is formed between the first and the second shield lines, and coupled with a second voltage. The first shield layer is formed over the substrate and coupled to the first and the second shield lines via at least one first conductive structure.

Abstract translation: 提供盾构结构。 第一和第二屏蔽线形成在衬底上并与第一电压耦合。 在第一和第二屏蔽线之间形成导线，并与第二电压耦合。 第一屏蔽层形成在衬底上并且经由至少一个第一导电结构耦合到第一屏蔽线和第二屏蔽线。

公开(公告)号：US07269032B2

公开(公告)日：2007-09-11

申请号：US10535212

申请日：2004-07-02

Applicant: Matthias Lungwitz

Inventor： Matthias Lungwitz

IPC: H05K9/00

CPC classification number: H05K1/141 ,  H05K1/0218 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10477

Abstract: A shielding apparatus for EMI-sensitive electronic components, especially for radio transmitting devices and/or radio receiving devices of telecommunication terminals for contactless telecommunication, such as cordless telephones and mobile telephones and similar, which can be constructed without using expensive manufacturing and assembly steps without any extra space requirement. The EMI-sensitive electronic components and/or circuits are arranged on a separate, at least double-layered printed circuit board and are embodied as a printed circuit board module. Said circuit board and another separate, at least two-layered circuit board which includes a recess for the EMI-sensitive electronic components and/or circuits and which is embodied in the form of a base printed circuit board, are joined together by soldering, preferably in the region of contact areas, to form a unit such that a cage is formed by the recess which is disposed between two metal surfaces being respectively connected to the shielding surfaces by means of continuous, highly adjacent contacts. The cage shields the EMI-sensitive electronic components and/or circuits on all sides.

Abstract translation: 一种用于EMI敏感电子部件的屏蔽装置，特别是用于无线电通信的电信终端（例如无绳电话和移动电话等）的无线电发射装置和/或无线电接收装置，其可以在不使用昂贵的制造和组装步骤的情况下构建而不需要 任何额外的空间要求。 EMI敏感的电子部件和/或电路被布置在单独的至少双层印刷电路板上并被实施为印刷电路板模块。 所述电路板和另外分开的至少两层电路板，其包括用于EMI敏感的电子部件和/或电路的凹部，并且以基本印刷电路板的形式实施，通过焊接连接在一起，优选地 在接触区域的区域中，形成一个单元，使得保持架由设置在两个金属表面之间的凹部形成，两个金属表面之间通过连续的，高度相邻的触点分别连接到屏蔽表面。 笼子屏蔽了EMI敏感的电子元件和/或电路在所有方面。

公开(公告)号：US20070175657A1

公开(公告)日：2007-08-02

申请号：US11507478

申请日：2006-08-22

Applicant: Nobutaka Itoh

Inventor： Nobutaka Itoh

IPC: H05K1/16

CPC classification number: H05K1/0271 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09618 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/1572

Abstract: A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.

Abstract translation: 印刷电路板包括产品部分和背板。 背板的上表面和下表面涂覆有具有不同材料特性的焊接掩模。