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    Controlling Apparatus for Electric Power Steering Apparatus
    83.
    发明申请
    Controlling Apparatus for Electric Power Steering Apparatus 有权
    电动转向装置控制装置

    公开(公告)号：US20150334822A1

    公开(公告)日：2015-11-19

    申请号：US14760900

    申请日：2014-01-09

    Applicant: NSK LTD.

    Inventor： Naoto SHINKAWA ,  Shigeru FUKINUKI

    IPC: H05K1/02 ,  H05K1/16 ,  H05K1/11

    CPC classification number: H05K1/0231 ,  B62D5/0406 ,  H01L2224/4103 ,  H01L2924/00014 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/141 ,  H05K1/162 ,  H05K1/18 ,  H05K2201/042 ,  H05K2201/097 ,  H05K2201/1006 ,  H01L2224/37099

    Abstract: There is provided a printed circuit substrate and a noise suppression structure capable of minimizing constraint on a component layout on a substrate and suppressing noise. The printed circuit substrate includes conductive patterns of odd numbered layers and conductive patterns of even numbered layers which are alternately arranged in a vertical direction and hold an insulating layer between each layer. Portions excepting predetermined areas for connecting a first through-hole and predetermined areas for insulating from a second through-hole in the conductive patterns of the odd numbered layers have a same shape as portions excepting predetermined areas for connecting the second through-hole and predetermined areas for insulating the first through-hole in the conductive patterns of the even numbered layers, and the portions are laminated on one another at the same position in the vertical direction.

    Abstract translation: 提供了能够最小化对基板上的部件布局的约束并抑制噪声的印刷电路基板和噪声抑制结构。 印刷电路基板包括偶数层的导电图案和偶数层的导电图案，其在垂直方向上交替布置并且在每层之间保持绝缘层。 除了用于连接第一通孔的预定区域和用于与奇数层的导电图案中的第二通孔绝缘的预定区域之外的部分具有与用于连接第二通孔和预定区域的预定区域之外的部分相同的形状 用于绝缘偶数层的导电图案中的第一通孔，并且这些部分在垂直方向上的相同位置彼此层叠。

    Circuit for and method of routing signals in a plurality of metal layers of an integrated circuit
    86.
    发明授权
    Circuit for and method of routing signals in a plurality of metal layers of an integrated circuit 有权
    在集成电路的多个金属层中路由信号的电路和方法

    公开(公告)号：US08759690B1

    公开(公告)日：2014-06-24

    申请号：US13369228

    申请日：2012-02-08

    Applicant: Andrew J. DeBaets

    Inventor： Andrew J. DeBaets

    IPC: H05K1/11 ,  H05K1/02

    CPC classification number: H05K1/0219 ,  H01L23/147 ,  H01L23/49838 ,  H01L23/5222 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0228 ,  H05K2201/097 ,  H01L2924/00

    Abstract: According to an embodiment, an die for routing signals in a plurality of metal layers of an integrated circuit device is disclosed. The die comprises a first pair of conductive lines (302A and 302B) having a first reference line and a first signal line, the first reference line having traces and crossover segments in a plurality of metal layers; and second pair of conductive lines (304A and 304B) having a second reference line and a second signal line, the second reference line having traces and crossover segments in the plurality of metal layers which are offset from the traces and crossover segments of the first reference lines; wherein a first signal trace (310) of the first signal line in a first metal layer is adjacent to a first reference trace (308) of the first reference line on a first side of the first signal trace and to a second reference trace (314) of the second reference line on a second side of the first signal trace. A method for routing signals in a plurality of metal layers of an integrated circuit device is also disclosed.

    Abstract translation: 根据实施例，公开了一种用于在集成电路器件的多个金属层中路由信号的管芯。 芯片包括具有第一参考线和第一信号线的第一对导线（302A和302B），第一参考线在多个金属层中具有迹线和交叉段; 和具有第二参考线和第二信号线的第二对导线（304A和304B），所述第二参考线具有多个金属层中的迹线和交叉段，所述迹线和交叉段偏离所述迹线并且所述第一参考的交叉段 线条 其中第一金属层中的第一信号线的第一信号迹线（310）在第一信号迹线的第一侧上与第一参考线的第一参考迹线（308）相邻，并且与第二参考迹线（314 ）在第一信号迹线的第二侧上。 还公开了用于在集成电路器件的多个金属层中路由信号的方法。

    Multi-layer flexible printed circuit board for electronic device
    87.
    发明授权
    Multi-layer flexible printed circuit board for electronic device 有权
    电子设备多层柔性印刷电路板

    公开(公告)号：US08680402B2

    公开(公告)日：2014-03-25

    申请号：US13178081

    申请日：2011-07-07

    Applicant: Jong-Hun An ,  Hyun-Sik Min

    Inventor： Jong-Hun An ,  Hyun-Sik Min

    IPC: H05K1/00

    CPC classification number: H05K1/028 ,  H05K2201/053 ,  H05K2201/097

    Abstract: A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer.

    Abstract translation: 一种用于电子设备的多层柔性印刷电路板（FPCB），其中多个部件交替地设置在基层的顶表面和底表面上，并且将部件从另一区域移除。 多层FPCB包括基层，设置在基层顶面的侧面区域的第一电路图案，设置在第一电路图案中的第一粘合剂层，设置在第一电路图案的底面上的第二电路图案 基底层和与侧面区域相反的另一侧区域，设置在第二电路图案中的第二粘合剂层，设置在第一粘合剂层的顶表面上的第一绝缘/保护层和第二绝缘/保护层 设置在第二粘合剂层的底表面上。

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