公开(公告)号：US20150270065A1

公开(公告)日：2015-09-24

申请号：US14663725

申请日：2015-03-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Hirobumi ADACHI

IPC: H01G2/06 ,  H05K1/16 ,  H05K1/02 ,  H01G4/30

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

Abstract: An electronic component includes an electronic element including outer electrodes on a surface, a substrate terminal on which the electronic element is mounted, and a conductor that covers at least a portion of the substrate terminal. The substrate terminal includes a first main surface, a second main surface at a side opposite to the first main surface, and a side surface connecting the first main surface and the second main surface. The substrate terminal includes a mounting electrode that is provided on the first main surface and is electrically connected to the outer electrodes of the electronic element. The mounting electrode includes adjacent portions that are located to be adjacent to the side surface of the substrate terminal. The conductor covers at least a portion of the adjacent portion.

Abstract translation: 电子部件包括电子元件，其包括表面上的外部电极，安装有电子元件的基板端子和覆盖基板端子的至少一部分的导体。 基板端子包括第一主表面，与第一主表面相对的一侧的第二主表面和连接第一主表面和第二主表面的侧表面。 基板端子包括设置在第一主表面上并与电子元件的外部电极电连接的安装电极。 安装电极包括邻近基板端子的侧表面邻近的部分。 导体覆盖相邻部分的至少一部分。

公开(公告)号：US20150228410A1

公开(公告)日：2015-08-13

申请号：US14694437

申请日：2015-04-23

Applicant: ALLISON TRANSMISSION, INC.

Inventor： Steven D. Slagle ,  James D. Shaw ,  George C. Mimms ,  Kyle E. Erickson

IPC: H01G4/35 ,  H01G2/06 ,  H01G4/12 ,  H01G4/38 ,  H05K1/18 ,  H01G4/30

CPC classification number: H01G4/35 ,  F16H57/0006 ,  H01G2/065 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H05K1/0231 ,  H05K1/18 ,  H05K1/181 ,  H05K3/30 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/2045 ,  H05K2203/1572 ,  Y02P70/611 ,  Y10T29/4913

Abstract: Devices and methods are disclosed for reducing vibration and noise from capacitor devices. The device includes a circuit board, and first and second capacitor structures. The second capacitor structure has substantially the same properties as the first and is coupled to the opposite face of a supporting structure substantially opposite of the first capacitor structure. The first and second capacitor structures can receive substantially the same excitation signals, can be electrically connected in parallel or in series. The first and second capacitor structures can be discrete capacitors, capacitor layers, stacks or arrays of multiple capacitor devices, or other capacitor structures. Stacks of multiple capacitor devices can be arranged symmetrically about the supporting structure. Arrays of multiple capacitor devices can be arranged with offsetting capacitors on the opposite face of the supporting structure substantially opposite one another.

Abstract translation: 公开了用于减少电容器装置的振动和噪声的装置和方法。 该装置包括电路板，以及第一和第二电容器结构。 第二电容器结构具有与第一电容器结构基本上相同的特性，并且耦合到与第一电容器结构基本相反的支撑结构的相对面。 第一和第二电容器结构可以接收基本上相同的激励信号，可以并联或串联电连接。 第一和第二电容器结构可以是分立电容器，电容器层，堆叠或多个电容器器件的阵列，或其它电容器结构。 可以围绕支撑结构对称地布置多个电容器装置的堆叠。 多个电容器器件的阵列可以在支撑结构的相对面上大致相反地布置有抵消电容器。

公开(公告)号：US20150136464A1

公开(公告)日：2015-05-21

申请号：US14335753

申请日：2014-07-18

Applicant: Kabushiki Kaisha Toshiba

Inventor： Akihisa Shimizu ,  Takahiro Sakaguchi

IPC: H05K1/18 ,  H01G2/06 ,  H05K1/11

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

Abstract: According to one embodiment, an electronic device includes a printed circuit board on which mounted is a multilayer ceramic capacitor includes a rectangular parallelepiped capacitor main body in which a pair of external electrodes are formed on both ends in a shorter side. The electronic device has a mount structure in which portions of the pair of external electrodes are soldered to the printed circuit board while setting a width of first and second pads provided respectively on the pair of external electrodes less than a width of the pair of external electrodes.

Abstract translation: 根据一个实施例，电子设备包括印刷电路板，其上安装有多层陶瓷电容器，其包括长边平行六面体电容器主体，其中在短边的两端形成有一对外部电极。 该电子设备具有安装结构，其中一对外部电极的一部分焊接到印刷电路板，同时设置分别设置在一对外部电极上的第一和第二焊盘的宽度小于该对外部电极的宽度 。

公开(公告)号：US20150090484A1

公开(公告)日：2015-04-02

申请号：US14499495

申请日：2014-09-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuo FUJII ,  Toshiki TANAKA

IPC: H01G2/06 ,  H01G4/228 ,  H01G4/30 ,  H01G4/005 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A monolithic-capacitor-mounted structure satisfies Lc>Wc and Lx/Wx

Abstract translation: 单片电容器安装的结构满足Lc> Wc和Lx / Wx

公开(公告)号：US20150014043A1

公开(公告)日：2015-01-15

申请号：US14311966

申请日：2014-06-23

Applicant: OMRON CORPORATION

Inventor： Akihiro HOZUMI

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/0999 ,  H05K2201/2045

Abstract: A printed wiring board including a connection part that is connected to a projecting portion of an external member by soldering, the connection part including a first hole in which the projecting portion is inserted, a main land to which the projecting portion is soldered, a metallic pattern that is drawn from the main land, and a sub-land that is connected to the main land through the metallic pattern, wherein the main land is constructed with a metallic film configured to cover a peripheral region of the first hole in at least a front face of the printed wiring board including the front face and a back face, the front face to which the soldering is performed and the back face on a side opposite to the front face, and the metallic film is not formed on a sidewall forming the first hole, and where the sub-land is constructed with a metallic film configured to cover a sidewall formed by a second hole piercing the printed wiring board and a peripheral region of the second hole in both the front face and the back face of the printed wiring board.

Abstract translation: 一种印刷电路板，包括通过焊接连接到外部构件的突出部分的连接部分，所述连接部分包括突出部分被插入的第一孔，突出部分被焊接到的主区域，金属 以及通过金属图案连接到主焊盘的子地面，其中主焊盘构造有金属膜，该金属膜被构造成至少覆盖第一孔的周边区域 印刷电路板的前表面包括正面和背面，执行焊接的正面和与正面相反的一侧的背面，金属膜不形成在形成 第一孔，并且其中子区域被构造成金属膜，金属膜被构造成覆盖由穿过印刷线路板的第二孔和第二孔的外围区域形成的侧壁 e正面和印刷电路板的背面。

公开(公告)号：US20140332261A1

公开(公告)日：2014-11-13

申请号：US14270403

申请日：2014-05-06

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Isamu FUJIMOTO ,  Kazuo HATTORI

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/111 ,  H01G4/248 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/2045 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A circuit board includes a wiring board on which is mounted first and second laminated ceramic capacitors near or adjacent to each other, arranged along a direction parallel or substantially parallel to a main surface of the wiring board, and electrically connected in series or in parallel via a conductive pattern provided on the wiring board. One width direction side surface of the first laminated ceramic capacitor and one length direction end surface of the second laminated ceramic capacitor oppose each other perpendicularly or approximately perpendicularly.

Abstract translation: 电路板包括布线板，第一和第二层叠陶瓷电容器彼此靠近或相邻地布置，沿着平行或基本上平行于布线板的主表面的方向布置，并且串联或并联电连接 设置在布线板上的导电图案。 第一层叠陶瓷电容器的宽度方向侧表面和第二层叠陶瓷电容器的一个长度方向端面垂直或大致垂直地彼此相对。

公开(公告)号：US08804367B2

公开(公告)日：2014-08-12

申请号：US13837432

申请日：2013-03-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Min Cheol Park ,  Sang Soo Park ,  Young Ghyu Ahn ,  Byoung Hwa Lee

IPC: H05K7/00

CPC classification number: H01G4/12 ,  H01G2/06 ,  H01G4/012 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of electrodes formed to be alternately exposed to both end surfaces of the ceramic body; an upper cover layer; a lower cover layer having a thickness greater than that of the upper cover layer; and external electrodes, wherein when a distance from an end portion of the lowermost internal electrode of the active layer to an end portion of the external electrode covering a portion of a lower surface of the ceramic body is E, the shortest distance from the end portion of the external electrode to the lowermost internal electrode of the active layer is T, and a margin of the ceramic body in the length direction is F, 1.2≦E/T and 30 μm≦F are satisfied.

Abstract translation: 提供了一种多层陶瓷电容器，包括：陶瓷体; 包括形成为交替地暴露于陶瓷体的两个端面的多个电极的有源层; 上盖层; 下覆盖层，其厚度大于上覆盖层的厚度; 以及外部电极，其中当从活性层的最内部电极的端部到覆盖陶瓷体的下表面的一部分的外部电极的端部的距离为E时，距离端部的最短距离 的外部电极与有源层的最内部电极之间的距离为T，陶瓷体的长度方向的余量为F，1.2＆nlE; E / T，30μm＆nlE; F。

公开(公告)号：US20140138136A1

公开(公告)日：2014-05-22

申请号：US13764131

申请日：2013-02-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ghyu AHN ,  Tae Hyeok KIM ,  Min Cheol PARK ,  Byoung Hwa LEE ,  Sang Soo PARK

IPC: H01G4/30

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/12 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.

Abstract translation: 提供了一种多层陶瓷电容器，包括：陶瓷体，其中层压有多个电介质层; 包括多个内部电极的有源层，所述多个内部电极具有介于其间的各个介电层; 上盖层; 下覆盖层; 外部电极; 以及多个虚拟电极，其中当A定义为陶瓷体的总厚度的1/2时，B定义为下覆盖层的厚度，C定义为有源层的总厚度的1/2， 和D定义为上覆盖层的厚度，有源层的中心部分和陶瓷体的中心部分（B + C）/ A之间的偏差比满足1.063＆nlE;（B + C ）/A≦̸1.745。

公开(公告)号：US20140098509A1

公开(公告)日：2014-04-10

申请号：US14048788

申请日：2013-10-08

Applicant: FUJITSU LIMITED

Inventor： Atsushi TOMOE ,  HIROSHI KUBO ,  Hiroyuki TAKITA

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H04M1/0214 ,  H04M1/0277 ,  H05K3/368 ,  H05K9/0032 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y10T29/49126

Abstract: An electronic device includes a first substrate, a second substrate that is disposed to be superposed over the first substrate, a connector that connects the first substrate to the second substrate, an inter-substrate frame that is disposed between the first substrate and the second substrate and includes a wall portion, and a wall member that is disposed on at least one of the first substrate and the second substrate to be opposed to the wall portion and locks the wall portion of the inter-substrate frame in response to displacement that is generated between the first substrate and the second substrate.

Abstract translation: 电子设备包括：第一基板，设置成叠置在第一基板上的第二基板，将第一基板连接到第二基板的连接器;设置在第一基板和第二基板之间的基板间框架 并且包括壁部分和壁构件，所述壁构件设置在所述第一基板和所述第二基板中的至少一个上以与所述壁部相对并且响应于所产生的位移而锁定所述基板间框架的壁部分 在第一基板和第二基板之间。

公开(公告)号：US20130319741A1

公开(公告)日：2013-12-05

申请号：US13588696

申请日：2012-08-17

Applicant: Young Ghyu AHN ,  Sang Soo Park ,  Min Cheol Park ,  Se Hwa Jeong

Inventor： Young Ghyu AHN ,  Sang Soo Park ,  Min Cheol Park ,  Se Hwa Jeong

IPC: H01G4/12 ,  H05K7/00 ,  H05K1/18

CPC classification number: H01G4/005 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Abstract translation: 层叠芯片电子部件包括：陶瓷体，其包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入电介质层的有源层以形成电容; 以及在有源层的厚度方向的上部和下部形成的上部和下部覆盖层，所述下部覆盖层的厚度大于上部覆盖层的厚度。