公开(公告)号：US20160096724A1

公开(公告)日：2016-04-07

申请号：US14506037

申请日：2014-10-03

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： CHAD S. DAWSON ,  STEPHEN R. HOOPER

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B7/007 ,  B81B2203/0118 ,  B81C1/00301 ,  B81C1/00325

Abstract: A microelectromechanical systems (MEMS) die includes a substrate having a recess formed therein and a cantilevered platform structure. The cantilevered platform structure has a platform and an arm extending from the platform, wherein the platform and arm are suspended over the recess. The arm is fixed to the substrate and is a sole attachment point of the platform to the substrate. A MEMS device resides on the platform. Fabrication methodology entails forming the recess in the substrate, with the recess extending inwardly from a surface of the substrate, and attaching a structural layer over the recess and over the surface of the substrate. The MEMS device is formed on the structural layer and the structural layer is removed around a perimeter of the platform and the arm to form the cantilevered platform structure.

Abstract translation: 微机电系统（MEMS）模具包括其中形成有凹部的基板和悬臂平台结构。 悬臂式平台结构具有从平台延伸的平台和臂，其中平台和臂悬挂在凹部上。 臂固定到基底上，并且是平台与基底的唯一附着点。 MEMS设备驻留在平台上。 制造方法需要在衬底中形成凹部，其中凹部从衬底的表面向内延伸，并且将结构层附着在凹部上并在衬底的表面上方。 MEMS器件形成在结构层上，并且围绕平台和臂的周边移除结构层以形成悬臂平台结构。

公开(公告)号：US20160130136A1

公开(公告)日：2016-05-12

申请号：US14537529

申请日：2014-11-10

Applicant: Freescale Semiconductor, Inc.

Inventor： AKHILESH K. SINGH ,  DWIGHT L. DANIELS ,  DARREL R. FREAR ,  STEPHEN R. HOOPER

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00309 ,  B81B2201/0264 ,  B81B2207/012 ,  H01L23/26 ,  H01L23/29 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2924/00014

Abstract: A device in which an electronic circuit positioned within a cavity of a package housing is encased by a bubble restrictor material, with a media resistant material overlaying the bubble restrictor material. The bubble restrictor material functions to inhibit the formation and growth of moisture-related bubbles within the material, including at the interfaces of the material and surfaces within the package housing. The media resistant material is resistant to physical and chemical alterations by media within an external environment to which the device is exposed. The media resistant material and bubble resistant material function to transfer a sensed characteristic of the media to the electronic circuit.

Abstract translation: 一种装置，其中位于封装壳体的空腔内的电子电路由气泡限制器材料封装，覆盖着气泡限制器材料的耐介质材料。 气泡限制器材料用于抑制材料内的水分相关气泡的形成和生长，包括材料和包装壳体内表面的界面。 介质耐受材料在设备暴露于外部环境中的介质抵抗物理和化学变化。 耐介质材料和耐气泡材料的功能是将感测到的介质特性传递到电子电路。

公开(公告)号：US20170081179A1

公开(公告)日：2017-03-23

申请号：US14861550

申请日：2015-09-22

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： CHAD S. DAWSON ,  STEPHEN R. HOOPER ,  FENGYUAN LI ,  ARVIND S. SALIAN

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0392 ,  B81B2207/012 ,  B81B2207/097 ,  B81C1/00865 ,  B81C2203/0109 ,  H01L2224/48145 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A MEMS sensor package comprises a MEMS die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. A port extends between the cavity and a side wall of the MEMS die and enables admittance of fluid into the cavity. Fabrication methodology entails providing a substrate structure having sensors formed thereon, providing a cap layer structure having inwardly extending cavities, and forming a channel between pairs of the cavities. The cap layer structure is coupled with the substrate structure and each channel is interposed between a pair of cavities. A singulation process produces a pair of sensor packages, each having a port formed by splitting the channel, where the port is exposed during singulation and extends between its respective cavity and side wall of the sensor package.

公开(公告)号：US20150329352A1

公开(公告)日：2015-11-19

申请号：US14806481

申请日：2015-07-22

Applicant: FREESCALE SEMICONDUCTOR INC.

Inventor： PHILIP H. BOWLES ,  STEPHEN R. HOOPER

IPC: B81B7/00

CPC classification number: B81B7/0074 ,  B81B7/0041 ,  B81B7/007 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81B2207/096 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Methods for fabricating multi-sensor microelectronic packages and multi-sensor microelectronic packages are provided. In one embodiment, the method includes positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die. The magnetometer wafer is bonded to the accelerometer wafer to produce a bonded wafer stack. The bonded wafer stack is then singulated to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die.

Abstract translation: 提供了制造多传感器微电子封装和多传感器微电子封装的方法。 在一个实施例中，该方法包括将由非单一化磁力计阵列阵列组成的磁力计晶片定位在由非单一加速度计模具阵列组成的加速度计晶片上。 磁强计晶片结合到加速度计晶圆上以产生键合晶片叠层。 然后将键合的晶片堆叠单个以产生多个多传感器微电子封装，每个多传感器微电子封装包括结合到单个加速度计管芯的单个磁力计管芯。

公开(公告)号：US20150061106A1

公开(公告)日：2015-03-05

申请号：US14527421

申请日：2014-10-29

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： STEPHEN R. HOOPER ,  PHILIP H. BOWLES

IPC: B81B7/00

CPC classification number: B81B7/0064 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L23/04 ,  H01L23/053 ,  H01L23/10 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/16152 ,  H01L2924/00014

Abstract: A method (30) of forming a semiconductor package (20) entails applying (56) an adhesive (64) to a portion (66) of a bonding perimeter (50) of a base (22), with a section (68) of the perimeter (50) being without the adhesive (64). A lid (24) is placed on the base (22) so that a bonding perimeter (62) of the lid (24) abuts the bonding perimeter (50) of the base (22). The lid (24) includes a cavity (25) in which dies (38) mounted to the base (22) are located. A gap (70) is formed without the adhesive (64) at the section (68) between the base (22) and the lid (24). The structure vents from the gap (70) as air inside the cavity (25) expands during heat curing (72). Following heat curing (72), another adhesive (80) is dispensed in the section (68) to close the gap (70) and seal the cavity (25).

Abstract translation: 形成半导体封装（20）的方法（30）需要将粘合剂（64）施加到基座（22）的接合周边（50）的部分（66）上，其中部分（68）为 周边（50）没有粘合剂（64）。 盖（24）被放置在基座（22）上，使得盖（24）的粘合周边（62）邻接基部（22）的粘合周边（50）。 盖（24）包括一个空腔（25），其中安装在基座（22）上的模具（38）位于该空腔中。 在基部（22）和盖（24）之间的部分（68）处形成没有粘合剂（64）的间隙（70）。 当热固化（72）期间空腔（25）内的空气膨胀时，结构从间隙（70）排出。 在热固化（72）之后，将另一粘合剂（80）分配在部分（68）中以封闭间隙（70）并密封空腔（25）。

公开(公告)号：US20150048462A1

公开(公告)日：2015-02-19

申请号：US14527567

申请日：2014-10-29

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： PHILIP H. BOWLES ,  PAIGE M. HOLM ,  STEPHEN R. HOOPER ,  RAYMOND M. ROOP

IPC: B81B7/00

CPC classification number: B81B7/0006 ,  B81B7/0077 ,  B81B2201/02 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on an opposing side (40). The bonding perimeters (46) of the controller wafer (82) are bonded to corresponding bonding perimeters (36) of the sensor wafer (74) to form a stacked wafer structure (48) in which the control circuitry (42) faces outwardly. The controller wafer (82) is sawn to reveal bond pads (32) on the sensor wafer (74) which are wire bonded to corresponding bond pads (44) formed on the same side (38) of the wafer (82) as the control circuitry (42). The structure (48) is encapsulated in packaging material (62) and is singulated to produce the sensor packages (20).

Abstract translation: 形成传感器封装（20）的方法（70）需要提供传感器晶片（74），传感器晶片（74）具有形成在位于通过接合周边（36）所描绘的区域（34）内的侧面（26）上的传感器（30），并且提供控制器 具有在一侧（38）处的控制电路（42）和在相对侧（40）上的接合周边（46）的晶片（82）。 控制器晶片（82）的接合周边（46）被接合到传感器晶片（74）的对应的接合周边（36），以形成其中控制电路（42）面向外的堆叠的晶片结构（48）。 锯切控制器晶片（82）以露出传感器晶片（74）上的接合焊盘（32），该接合焊盘被引线连接到形成在晶片（82）的同一侧（38）上的对应接合焊盘（44） 电路（42）。 结构（48）被封装在包装材料（62）中，并被分割以产生传感器封装（20）。

公开(公告)号：US20170081178A1

公开(公告)日：2017-03-23

申请号：US14860976

申请日：2015-09-22

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： THOMAS C. SPEIGHT ,  STEPHEN R. HOOPER ,  NHAT D. VO

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B2201/0264 ,  B81C1/00238 ,  B81C2203/019 ,  B81C2203/0792 ,  H01L2224/48247 ,  H01L2224/49171

Abstract: A packaged semiconductor device includes a first semiconductor die including interconnect pads and a seal ring pad surrounding at least some of the interconnect pads, a first portion of an plated seal ring structure formed on the seal ring pad, and a second semiconductor die including a second portion of the plated seal ring structure formed on a major surface of the second semiconductor die. The second portion of the plated seal ring structure is coupled to the first portion of the plated seal ring structure to form a seal around a cavity between the first and second semiconductor die. A plurality of interconnect pillars are on the first major surface of the second semiconductor die. The interconnect pillars are coupled to the interconnect pads on the second semiconductor die.

公开(公告)号：US20160169758A1

公开(公告)日：2016-06-16

申请号：US14569068

申请日：2014-12-12

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： STEPHEN R. HOOPER ,  CHAD S. DAWSON

IPC: G01L9/00 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0061 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2203/0154 ,  G01L9/0073 ,  G01L13/025 ,  G01L15/00 ,  H01L2224/48137

Abstract: A package includes a MEMS die and a cap element coupled to and stacked with the MEMS die. The MEMS die includes at least two physically isolated pressure sensors, each of which resides on its individual cantilevered platform structure. A first pressure sensor is vented to a first external environment via a first vent extending through the bottom of the MEMS die and is adapted to detect a first pressure of the first external environment. The MEMS die can be coupled to a lead frame having an opening that is aligned with the first vent. A second sensor is vented to a second external environment via a second vent extending through the cap element and is adapted to detect a second pressure of the second external environment. A difference between the first and second pressures is the differential pressure.

Abstract translation: 封装包括MEMS管芯和耦合到MEMS管芯并与其堆叠的帽元件。 MEMS管芯包括至少两个物理隔离的压力传感器，每个压力传感器位于其单独的悬臂平台结构上。 第一压力传感器经由延伸穿过MEMS管芯的底部的第一通气孔排放到第一外部环境，并适于检测第一外部环境的第一压力。 MEMS管芯可以连接到具有与第一通气口对准的开口的引线框架。 第二传感器经由延伸穿过盖元件的第二通风孔排放到第二外部环境，并适于检测第二外部环境的第二压力。 第一和第二压力之间的差值是差压。

公开(公告)号：US20160159642A1

公开(公告)日：2016-06-09

申请号：US14564340

申请日：2014-12-09

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： STEPHEN R. HOOPER ,  CHAD S. DAWSON

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0061 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2203/0154 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A package includes a MEMS die and an integrated circuit (IC) die coupled to and stacked with the MEMS die. The MEMS die includes a substrate having a recess formed therein. A cantilevered platform structure of the MEMS die has a platform and an arm suspended over the recess, where the arm is fixed to the substrate. A MEMS device resides on the platform. The IC die is coupled to the MEMS die to serve as a protective cap for MEMS device. The MEMS die may be a pressure sensor die, and the MEMS device residing on the platform may be a sensor diaphragm. Thus, the IC die can include access vents extending through it for passage of a fluid from an external environment so that the sensor diaphragm can detect the pressure of the fluid.

Abstract translation: 封装包括MEMS管芯和耦合到MEMS管芯并与其堆叠的集成电路（IC）管芯。 MEMS管芯包括其中形成有凹部的基板。 MEMS模具的悬臂平台结构具有悬挂在凹部上的平台和臂，其中臂固定到基板。 MEMS设备驻留在平台上。 IC芯片耦合到MEMS管芯以用作MEMS器件的保护盖。 MEMS管芯可以是压力传感器管芯，并且驻留在平台上的MEMS器件可以是传感器隔膜。 因此，IC芯片可以包括延伸穿过它的通路，用于使流体从外部环境通过，使得传感器隔膜可以检测流体的压力。