公开(公告)号：US20220399179A1

公开(公告)日：2022-12-15

申请号：US17805663

申请日：2022-06-06

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ ,  Alexander SORKIN ,  Trevor Jason FRENCH ,  Ian JONES ,  Paul GAGNON

IPC: H01J37/08 ,  H01J37/32

Abstract: Described are various embodiments of an ion beam chamber fluid delivery system and method for delivering a fluid onto a substrate in an ion beam system during operation. In one embodiment, the system comprises: a chamber comprising an ion beam gun oriented so as to cause ions to impinge the substrate, said chamber having a fluid delivery conduit therein for delivering the fluid into the chamber; a transferable substrate stage for holding the substrate, the transferable stage further configured to move between an operating position and a payload position during non-operation, said payload position for receiving and removing said substrate; and a fluid delivery nozzle being in a fixed location relative to the transferable stage, at least during operation, with an outlet position that is configured to deliver a fluid to a predetermined location on said transferable stage.

公开(公告)号：US20230196581A1

公开(公告)日：2023-06-22

申请号：US17917872

申请日：2021-04-06

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ ,  Michael GREEN ,  Alexander SORKIN ,  Christopher Kumar ANAND ,  Nabil David BASSIM ,  Yasamin SARTIPI

IPC: G06T7/11 ,  G06V10/24 ,  G06V10/74 ,  G01N23/04

CPC classification number: G06T7/11 ,  G06V10/242 ,  G06V10/761 ,  G01N23/04 ,  G06T2207/10061

Abstract: Described are systems and methods for segmenting images which comprise impinging a substrate surface with a particle beam at each of a plurality of sensing locations which define a subset of locations within an area of interest of the substrate surface. An intensity value associated with post-impingement particles resulting from the impinging is measured and the measured intensity based on the intensity value of the sensing location is calculated. For each of a plurality of estimated locations which define a further subset of said area of interest and a corresponding estimated intensity based on at least one of the following corresponding to one or more locations proximal to the estimated location is calculated. The plurality of estimated locations is each segmented based on the corresponding estimated intensity, each of the sensing locations, and based on the corresponding measured intensity, to correspond to one of the plurality of features.

公开(公告)号：US20220122805A1

公开(公告)日：2022-04-21

申请号：US17425280

申请日：2020-01-21

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ

IPC: H01J37/304 ,  H01J37/305 ,  C23F4/00 ,  H01L21/3213 ,  H01L21/66 ,  G01N19/06

Abstract: Described are various embodiments of an ion beam delayering system and method, and endpoint monitoring system and method. One embodiment includes a method for monitoring an ion beam de-layering process for an unknown heterogeneously layered sample, the method comprising: grounding the sample to allow an electrical current to flow from the sample, at least in part, as a result of the ion beam de-layering process; milling a currently exposed layer of the sample using the ion beam, resulting in a given measurable electrical current to flow from the sample as said currently exposed layer is milled, wherein said given measurable electrical current is indicative of an exposed surface material composition of said currently exposed layer; detecting a measurable change in said measureable electrical current during said milling as representative of a corresponding exposed surface material composition change; and associating said measurable change with a newly exposed layer of the sample.

公开(公告)号：US20220005669A1

公开(公告)日：2022-01-06

申请号：US17309372

申请日：2019-11-20

Applicant: TechInsights Inc.

Inventor： Christopher PAWLOWICZ ,  Alexander SORKIN

IPC: H01J37/304 ,  G01N1/28 ,  G01N1/32 ,  G01N23/2251 ,  G01R31/28 ,  H01J37/31

Abstract: Described are various embodiments of an ion beam delayering system and method, topographically enhanced sample produced thereby, and imaging methods and systems related thereto. In one embodiment, a method comprises: identifying at least two materials in an exposed surface of the sample and predetermined operational characteristics of an ion beam mill that correspond with a substantially different ion beam mill removal rate for at least one of the materials; operating the ion beam mill in accordance with the predetermined operational characteristics to simultaneously remove the materials and introduce or enhance a topography associated with the materials and surface features defined thereby; acquiring surface data; and repeating the operating and acquiring steps for at least one more layer.

公开(公告)号：US20160282287A1

公开(公告)日：2016-09-29

申请号：US15174260

申请日：2016-06-06

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ ,  Alexander SORKIN ,  Michael W. PHANEUF ,  Alexander KRECHMER ,  Ken G. LAGAREC

IPC: G01N23/225

CPC classification number: G01N23/2255 ,  G01R31/303 ,  H01J37/222 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/2803 ,  H01J2237/2809 ,  H01J2237/31749 ,  H01L22/12

Abstract: Methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. A first component or node on an integrated circuit is coupled to a second component or node on the same integrated circuit. After an external bias is applied to the first component or node, a focused ion beam is applied to the integrated circuit and an image is taken using an electron detector. The features or components on the integrated circuit which are coupled to the second component or node will show up in high contrast on the resulting image. The method may also involve applying a bias to a node or component and then using focused ion beam imaging techniques (through an electron detector) to arrive at an image of the integrated circuit. Components coupled to the node will appear in high contrast in the resulting image.

Abstract translation: 使用聚焦离子束成像技术在集成电路上跟踪电路的方法和系统。 集成电路上的第一组件或节点耦合到同一集成电路上的第二组件或节点。 在将外部偏压施加到第一部件或节点之后，将聚焦离子束施加到集成电路，并且使用电子检测器拍摄图像。 耦合到第二组件或节点的集成电路上的特征或组件将在所得到的图像上呈现高对比度。 该方法还可以包括向节点或部件施加偏压，然后使用聚焦离子束成像技术（通过电子检测器）来获得集成电路的图像。 耦合到节点的组件将在所得到的图像中以高对比度出现。

公开(公告)号：US20250148185A1

公开(公告)日：2025-05-08

申请号：US18837085

申请日：2023-02-09

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ ,  Michael GREEN ,  Alexei IOUDOVSKI ,  Bruno MACHADO TRINDADE

IPC: G06F30/398 ,  G06T7/00

Abstract: Described are various embodiments of a system and method for automatic extraction of integrated circuit component data. In one embodiment, a method is provided for automatically extracting transistor data from a digital representation of an integrated circuit that comprises digitally defining at least one diffusion space corresponding to a respective spatial region of the IC that comprises at least one diffusion feature. For each discrete diffusion space, diffusion space circuit features that intersect with each diffusion feature are incrementally assessed by assigning a current state value to each diffusion space circuit feature based on an identified feature characteristic associated therewith and an identified feature characteristic of an electrically adjacent feature in the diffusion space.

公开(公告)号：US20250014323A1

公开(公告)日：2025-01-09

申请号：US18709249

申请日：2022-11-14

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ ,  Michael GREEN ,  Bruno MACHADO TRINDADE ,  Sneha PULLELA ,  Zifan YU ,  Fengbo REN

IPC: G06V10/82 ,  G06V10/26 ,  G06V10/774 ,  G06V20/69

Abstract: Described are various embodiments of a machine learning system and method for object-specific recognition.

公开(公告)号：US20180054575A1

公开(公告)日：2018-02-22

申请号：US15560935

申请日：2016-03-22

Applicant: TechInsights Inc.

Inventor： Christopher PAWLOWICZ ,  Alexander SORKIN ,  Vladimir MARTINCEVIC

IPC: H04N5/357

Abstract: Devices, systems and methods relating to a distortion-correcting imaging for collecting image-related data of a substrate are disclosed, comprising: a beam emitter for directing an emission at an intended location on the substrate, and a signal detector for determining 5 a signal intensity value associated with the emission; wherein the signal intensity value is associated with a corrected substrate location, said corrected substrate location determined from the intended substrate location and a correction factor, said correction factor being a function of said intended substrate location.

公开(公告)号：US20160187419A1

公开(公告)日：2016-06-30

申请号：US14811549

申请日：2015-07-28

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ ,  Alexander SORKIN ,  Alexander KRECHMER

IPC: G01R31/303 ,  G01R31/28

CPC classification number: G01R31/303 ,  G01N23/2255 ,  G01R31/2896 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/2803 ,  H01J2237/2809 ,  H01J2237/31749 ,  H01L22/12

Abstract: Described are various embodiments of methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. In one such embodiment, a method is provide for identifying functional componentry associated with a switchable power interface on an integrated circuit, wherein the switchable power interface comprises a source and a drain with a control switch therebetween, said control switch being controllable by a control signal during operation of the integrated circuit. The method comprises connecting, with deposited conductive material, the source and the drain; applying an external voltage bias to a power input of the switchable power interface via one of the source and the drain; exposing the integrated circuit to a focused ion beam; and gathering an image of the integrated circuit during exposure to determine areas of high contrast indicating functional componentry in operative connection with the switchable power interface.

Abstract translation: 描述了使用基于聚焦离子束的成像技术在集成电路上跟踪电路的方法和系统的各种实施例。 在一个这样的实施例中，提供了一种用于识别与集成电路上的可切换电力接口相关联的功能组件的方法，其中所述可切换电力接口包括其间具有控制开关的源极和漏极，所述控制开关由控制信号 在集成电路运行期间。 该方法包括用沉积的导电材料连接源极和漏极; 通过源极和漏极中的一个将外部电压施加到可切换电力接口的功率输入; 将集成电路暴露于聚焦离子束; 以及在曝光期间收集集成电路的图像，以确定与可切换电源接口可操作连接的功能组件的高对比度区域。