Focused electron and ion beam systems
    1.
    发明授权
    Focused electron and ion beam systems 失效
    聚焦电子和离子束系统

    公开(公告)号:US06768120B2

    公开(公告)日:2004-07-27

    申请号:US10232502

    申请日:2002-08-30

    CPC classification number: H01J37/08 H01J27/18 H01J37/077

    Abstract: An electron beam system is based on a plasma generator in a plasma ion source with an accelerator column. The electrons are extracted from a plasma cathode in a plasma ion source, e.g. a multicusp plasma ion source. The beam can be scanned in both the x and y directions, and the system can be operated with multiple beamlets. A compact focused ion or electron beam system has a plasma ion source and an all-electrostatic beam acceleration and focusing column. The ion source is a small chamber with the plasma produced by radio-frequency (RF) induction discharge. The RF antenna is wound outside the chamber and connected to an RF supply. Ions or electrons can be extracted from the source. A multi-beam system has several sources of different species and an electron beam source.

    Abstract translation: 电子束系统基于具有加速器柱的等离子体离子源中的等离子体发生器。 电子从等离子体离子源中的等离子体阴极中提取出来。 多级等离子体离子源。 可以在x和y方向上扫描光束,并且系统可以用多个子束进行操作。 紧凑的聚焦离子或电子束系统具有等离子体离子源和全静电束加速度和聚焦柱。 离子源是具有通过射频(RF)感应放电产生的等离子体的小室。 RF天线缠绕在室外,并连接到RF电源。 可以从源中提取离子或电子。 多光束系统具有不同物种的几种来源和电子束源。

    PLASMA SOURCE ENHANCED WITH BOOSTER CHAMBER AND LOW COST PLASMA STRENGTH SENSOR

    公开(公告)号:US20170294290A1

    公开(公告)日:2017-10-12

    申请号:US15596937

    申请日:2017-05-16

    Applicant: Ximan Jiang

    Inventor: Ximan Jiang

    Abstract: A method to improve plasma discharge efficiency by attaching one or more booster chambers to the main discharge chamber is disclosed here. The booster chamber functions as a plasma discharge amplification device for the main discharge chamber. It improves plasma density significantly, especially at pressure below 50 mTorr. Compared with traditional inductively coupled plasma (ICP) source, the strength of the plasma source enhanced with booster chamber has been improved several folds at low pressure conditions. Booster chamber can also be used as a convenient high speed plasma etching and deposition processing chamber for small samples. A method to gauge plasma strength by measuring plasma emission intensity has also been disclosed in this application.

    Plasma source enhanced with booster chamber and low cost plasma strength sensor

    公开(公告)号:US09997335B2

    公开(公告)日:2018-06-12

    申请号:US15596937

    申请日:2017-05-16

    Applicant: Ximan Jiang

    Inventor: Ximan Jiang

    Abstract: A method to improve plasma discharge efficiency by attaching one or more booster chambers to the main discharge chamber is disclosed here. The booster chamber functions as a plasma discharge amplification device for the main discharge chamber. It improves plasma density significantly, especially at pressure below 50 mTorr. Compared with traditional inductively coupled plasma (ICP) source, the strength of the plasma source enhanced with booster chamber has been improved several folds at low pressure conditions. Booster chamber can also be used as a convenient high speed plasma etching and deposition processing chamber for small samples. A method to gauge plasma strength by measuring plasma emission intensity has also been disclosed in this application.

    Plasma source enhanced with booster chamber and low cost plasma strength sensor

    公开(公告)号:US09691592B2

    公开(公告)日:2017-06-27

    申请号:US15092625

    申请日:2016-04-07

    Applicant: Ximan Jiang

    Inventor: Ximan Jiang

    Abstract: A method to improve plasma discharge efficiency by attaching one or more booster chambers to the main discharge chamber is disclosed here. The booster chamber functions as a plasma discharge amplification device for the main discharge chamber. It improves plasma density significantly, especially at pressure below 50 mTorr. Compared with traditional inductively coupled plasma (ICP) source, the strength of the plasma source enhanced with booster chamber has been improved several folds at low pressure conditions. Booster chamber can also be used as a convenient high speed plasma etching and deposition processing chamber for small samples. A method to gauge plasma strength by measuring plasma emission intensity has also been disclosed in this application.

    PLASMA SOURCE ENHANCED WITH BOOSTER CHAMBER AND LOW COST PLASMA STRENGTH SENSOR
    5.
    发明申请
    PLASMA SOURCE ENHANCED WITH BOOSTER CHAMBER AND LOW COST PLASMA STRENGTH SENSOR 审中-公开
    等离子体源与增压器和低成本等离子体强度传感器

    公开(公告)号:US20160300696A1

    公开(公告)日:2016-10-13

    申请号:US15092625

    申请日:2016-04-07

    Applicant: Ximan Jiang

    Inventor: Ximan Jiang

    Abstract: A method to improve plasma discharge efficiency by attaching one or more booster chambers to the main discharge chamber is disclosed here. The booster chamber functions as a plasma discharge amplification device for the main discharge chamber. It improves plasma density significantly, especially at pressure below 50 mTorr. Compared with traditional inductively coupled plasma (ICP) source, the strength of the plasma source enhanced with booster chamber has been improved several folds at low pressure conditions. Booster chamber can also be used as a convenient high speed plasma etching and deposition processing chamber for small samples. A method to gauge plasma strength by measuring plasma emission intensity has also been disclosed in this application.

    Abstract translation: 这里公开了通过将一个或多个增压室附接到主放电室来提高等离子体放电效率的方法。 增压室用作主放电室的等离子体放电放大装置。 它显着提高血浆密度,特别是在低于50mTorr的压力下。 与传统的电感耦合等离子体(ICP)源相比,增压室等离子体源的强度在低压条件下提高了数倍。 增压室也可以用作小样品的方便的高速等离子体蚀刻和沉积处理室。 通过测量等离子体发射强度来测量等离子体强度的方法也在本申请中公开。

    Method and apparatus for detecting buried defects
    6.
    发明授权
    Method and apparatus for detecting buried defects 有权
    检测埋藏缺陷的方法和装置

    公开(公告)号:US08723115B2

    公开(公告)日:2014-05-13

    申请号:US13431659

    申请日:2012-03-27

    Abstract: One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.

    Abstract translation: 一个实施例涉及一种检测目标微观金属特征中的埋入缺陷的方法。 成像装置被配置为以带有电荷的颗粒撞击着陆能量,使得带电粒子平均达到目标微观金属特征内的深度。 此外,成像装置被配置为滤除二次电子并检测反向散射电子。 然后操作成像装置以收集由于带电粒子的撞击而从目标微观金属特征发射的背散射电子。 将目标微观金属特征的背散射电子(BSE)图像与参考微观金属特征的BSE图像进行比较,以检测和分类埋藏缺陷。 还公开了其它实施例,方面和特征。

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