클리닝 방법 및 성막 방법
    1.
    发明公开
    클리닝 방법 및 성막 방법 无效
    清洁方法和薄膜沉积方法

    公开(公告)号:KR1020120112054A

    公开(公告)日:2012-10-11

    申请号:KR1020120029164

    申请日:2012-03-22

    Abstract: PURPOSE: A cleaning method and a film depositing method are provided to prevent the carbonization of polyimide by heating a deposition container at 360°C to 540 deg;C in the state creating oxygen atmosphere. CONSTITUTION: A first source gas and a second source gas are provided within a deposition container. The first source gas is comprised of acid anhydride. The second source gas is comprised of diamine. Oxygen atmosphere is created within the deposition container(S12). The deposition container is heated at 360°C to 540 deg;C in the state of the oxygen atmosphere(S13). Polyimide is eliminated by oxidizing the polyimide remaining within the deposition container(S18). [Reference numerals] (AA) Start; (BB) Treatment process; (CC) End; (S11) Carrying a wafer in a deposition container(carry-in process); (S12) Decompressing the inner side of the deposition container(decompression process); (S13) Raising the temperature of the wafer to a deposition temperature(recovery process); (S14) Forming a polyimide film(film forming process); (S15) Purging the inner side of the deposition container(purge process); (S16) Restoring the pressure of the inner side of the deposition container to atmospheric pressure(pressure restoration process); (S17) Carrying out the wafer from the deposition container(carry-out process); (S18) Oxidizing and removing polyimide remaining in the deposition container

    Abstract translation: 目的:提供清洁方法和膜沉积方法,以在产生氧气氛的状态下,通过在360℃至540℃下加热沉积容器来防止聚酰亚胺的碳化。 构成:第一源气体和第二源气体设置在沉积容器内。 第一源气由酸酐组成。 第二源气由二胺构成。 在沉积容器内产生氧气(S12)。 在氧气氛中,沉积容器在360℃加热至540℃(S13)。 通过氧化保留在沉积容器内的聚酰亚胺来除去聚酰亚胺(S18)。 (附图标记)(AA)开始; (BB)治疗过程; (CC)结束; (S11)在沉积容器中携带晶片(进入工艺); (S12)解压缩沉积容器的内侧(减压处理); (S13)将晶片的温度提高至沉积温度(恢复处理); (S14)形成聚酰亚胺膜(成膜法); (S15)清洗沉积容器的内侧(吹扫处理); (S16)将沉积容器的内侧的压力恢复到大气压(压力恢复处理); (S17)从沉积容器进行晶片(进行处理); (S18)保留在沉积容器中的氧化和除去聚酰亚胺

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