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    Method and apparatus for handling workpieces
    1.
    发明授权
    Method and apparatus for handling workpieces 失效
    处理工作的方法和装置

    公开(公告)号：US3874525A

    公开(公告)日：1975-04-01

    申请号：US37527973

    申请日：1973-06-29

    Applicant: IBM

    Inventor： HASSAN JAVATHU K ,  MACK ALFRED ,  WOJTASZEK MICHAEL R

    IPC: B23Q7/14 ,  B25J15/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B65G65/30

    CPC classification number: H01L21/68707 ,  B23Q7/1431 ,  B25J15/00 ,  B25J15/0052 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67742 ,  Y10S414/139

    Abstract: A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elevator, which is within the vacuum chamber, through an opening, which is vacuum sealed by the elevator at this time, in the top wall of the vacuum chamber. A lid is then placed over the opening from the exterior to cooperate with the elevator to form an ante chamber with the wafer disposed therein. The ante chamber, which is purged prior to the lid being placed over the opening, is then reduced to a vacuum of 5 X 10 2 torr. The elevator then lowers the wafer into a horizontal plane in which a transfer mechanism is located to transfer the wafer from the elevator to an X-Y table on which the wafer is mounted for pattern writing of the chips. The transfer mechanism includes an arm, which is indexed 180* during each activation of an indexing means connected thereto, and gripping means at each end of the arm to simultaneously grasp and release wafers on the elevator and the X-Y table to interchange the wafers between the elevator and the table.

    Abstract translation: 其上形成有芯片的半导体晶片从100级环境移动到真空室中，其中通过电子束对芯片进行图案写入，而不会显着影响真空室中的真空水平。 最初将晶片设置在真空室内的电梯上，该电梯此时由电梯真空密封在真空室的顶壁中。 然后将盖子从外部放置在开口上方以与电梯配合以形成设置在其中的晶片的前室。 然后在盖子被放置在开口之前被清除的前室被减小到5×10 -2托的真空。 然后，电梯将晶片降低到水平平面中，在该水平平面中传送机构位于其中，以将晶片从电梯传送到安装有晶片的X-Y工作台，用于芯片的图案写入。 传送机构包括臂，在连接到其上的分度装置的每个激活期间被分度180度，并且在臂的每个端部处抓握装置，以同时在电梯和XY工作台上抓住并释放晶片，以将晶片在 电梯和桌子。

    POSITIONING SYSTEM
    2.
    发明专利
    POSITIONING SYSTEM 未知

    公开(公告)号：CA1229429A

    公开(公告)日：1987-11-17

    申请号：CA495092

    申请日：1985-11-12

    Applicant: IBM

    Inventor： BEUMER KARL W ,  GASTON CHARLES A ,  LOCKE CHARLES H ,  MACK ALFRED ,  O'NEILL BRIAN C ,  PINCKNEY WARREN J ,  WILSON ALAN D

    IPC: H01L21/30 ,  H01J37/20 ,  H01L21/027 ,  H01L21/68 ,  H01L21/72

    Abstract: POSITIONING SYSTEM A high precision, high throughput submicrometer worpiece positioning system, particularly useful as a workpiece positioning means in electron beam lithography tools, is disclosed. The positioning system increases mechanical stability by essentially eliminating mechanical hysteresis, which allows state of the art electron beam lithograpny systems to provide the repeatable, accurate and dense circuit patterns that modern semiconductor trends demand. The positioning system comprises a movable positioning table, a workpiece supporting superstructure which is elastically joined to the movable positioning table by three geometrically distinct kinematic support means and a two-stage coupling means which mounts a workpiece to the workpiece supporting superstructure. A laser interferometer locating-positioning system is used to position the workpiece. The interferometer mirrors are integral with the workpiece supporting superstructure. The coupling means mounts a workpiece to the workpiece supporting superstructure with a minimum of mechanical distortion. Three two-stage coupling means are used. The first stage is removable from the positioning, and allows for workpiece loading and unloading outside of the positioning system. The removable stage comprises an integral unit which includes two opposing arms with large radii spherical ends and a tab member. The spherical end center lines are colinear, providing for vertical clamping of the workpiece. The second stage is stationary and integral with the workpiece supporting superstructure. The stationary stage comprises two opposing arms with large radii spherical ends and clamps the tab of the removable stage by vertical clamping.

    ANTECHAMBER MECHANISM FOR ELECTRON BEAM WRITING APPARATUS
    4.
    发明专利
    ANTECHAMBER MECHANISM FOR ELECTRON BEAM WRITING APPARATUS 未知

    公开(公告)号：DE3171231D1

    公开(公告)日：1985-08-08

    申请号：DE3171231

    申请日：1981-09-16

    Applicant: IBM

    Inventor： MACK ALFRED ,  O'NEILL BRIAN COLLINS ,  PENZETTA FRED L

    IPC: H01J37/20 ,  H01J37/18 ,  H01L21/027 ,  H01L21/66

    Abstract: This invention is directed to mechanisms for sealing off a small volume antechamber (36) from a main vacuum chamber (10) forming a component of an electron beam writing system. The mechanisms eliminate shock and vibration transmission to an electron beam column (4) to permit electron beam writing in parallel with and simultaneously with a load/unload operation involving the antechamber. The mechanism comprise mechanical override means (62) for dampening impact during sealing and means (84, 136) for preventing vibration transfer.

    6.
    发明专利
    未知

    公开(公告)号：DE2430462A1

    公开(公告)日：1975-01-16

    申请号：DE2430462

    申请日：1974-06-25

    Applicant: IBM

    Inventor： HASSAN JAVATHU KUTTIKARAN ,  MACK ALFRED ,  WOITASZEK MICHAEL RICHARD

    IPC: B23Q7/14 ,  B25J15/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B65G49/00

    Abstract: A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elevator, which is within the vacuum chamber, through an opening, which is vacuum sealed by the elevator at this time, in the top wall of the vacuum chamber. A lid is then placed over the opening from the exterior to cooperate with the elevator to form an ante chamber with the wafer disposed therein. The ante chamber, which is purged prior to the lid being placed over the opening, is then reduced to a vacuum of 5 x 10 2 torr. The elevator then lowers the wafer into a horizontal plane in which a transfer mechanism is located to transfer the wafer from the elevator to an X-Y table on which the wafer is mounted for pattern writing of the chips. The transfer mechanism includes an arm, which is indexed 180 DEG during each activation of an indexing means connected thereto, and gripping means at each end of the arm to simultaneously grasp and release wafers on the elevator and the X-Y table to interchange the wafers between the elevator and the table.

    8.
    发明专利
    未知

    公开(公告)号：DE3582404D1

    公开(公告)日：1991-05-08

    申请号：DE3582404

    申请日：1985-11-12

    Applicant: IBM

    Inventor： BEUMER KARL WILLI ,  GASTON CHARLES ARDEN ,  MACK ALFRED ,  O'NEILL BRIAN COLLINS ,  PINCKNEY WARREN JOHN ,  LOCKE CHARLES HENRY ,  WILSON ALAN DICKSON

    IPC: H01L21/30 ,  H01J37/20 ,  H01L21/027 ,  H01L21/68 ,  H05K13/02 ,  H01L21/00

    Abstract: A high precision, high throughput submicrometer workpiece positioning system, particularly useful as a workpiece positioning means in electron beam lithography tools. The positioning system increases mechanical stability by essentially eliminating mechanical hysteresis, which allows state of the art electron beam lithography systems to provide the repeatable, accurate and dense circuit patterns that modern semiconductor trends demand.The positioning system comprises a movable positioning table (12), a workpiece supporting superstructure (14) which is elastically joined to the movable positioning table (12) by three geometrically distinct kinematic support means (16. 18, 20) and a two-stage coupling means (24) which mounts a workpiece (32) (i.e., semiconductor mask or wafer) to the workpiece supporting superstructure (14). A laser interferometer locating-positioning system is utilized to position the workpfece. The interferometer mirrors (28) are integral with the workpiece supporting superstructure (14).The coupling means (24) mounts a workpiece (22) to the workpiece supporting superstructure (14) with a minimum of mechanical distortion. Three two-stage coupling means (24) are utilized in preferred form. The first stage (34) is removable from the positioning, and allows for workpiece loading and unloading outside of the positioning system. The removable stage (34) comprises an integral unit (33) which includes two opposing arms (42, 44) with large radii spherical ends and a tab member. The spherical end center lines are collinear, providing for vertical clamping of the workpiece (32). The second stage (36) is stationary and integral with the workpiece supporting superstructure (14). The stationary stage (36) comprises two opposing arms (38, 40) with large radii spherical ends and clamps the tab (46) of the removable stage by verticai clamping.

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