公开(公告)号：BR8701784A

公开(公告)日：1988-02-09

申请号：BR8701784

申请日：1987-04-14

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLPH ,  DIVAKARUNI RENUKA SHASTRI ,  DYNYS JOSEPH MICHAEL ,  KANDEZKE STEVEN MICHAEL ,  KIRBY DANIEL PATRICK ,  MASTER RAJ N ,  CASEY JON ALFRED

IPC: H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28 ,  B32B31/24 ,  B32B18/00

Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

公开(公告)号：CA1326789C

公开(公告)日：1994-02-08

申请号：CA534156

申请日：1987-04-08

Applicant: IBM

Inventor： ANDERSON HERBERT R JR ,  DIVAKARUNI RENUKA S ,  DYNYS JOSEPH M ,  KANDETZKE STEVEN M ,  KIRBY DANIEL P ,  MASTER RAJ N ,  CASEY JON A

IPC: H05K3/46 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28

Abstract: METHOD OF FAKING MULTILAYERED CERAMIC STRUCTURES HAVING AN INTERNAL DISTRIBUTION OF COPPER-BASED CONDUCTORS The Present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

公开(公告)号：DE3678634D1

公开(公告)日：1991-05-16

申请号：DE3678634

申请日：1986-07-11

Applicant: IBM

Inventor： HERRON LESTER W ,  KUMAR ANANDA H ,  MASTER RAJ N ,  NUFER ROBERT W

IPC: C03C8/16 ,  B01J23/00 ,  B01J31/00 ,  C03C10/08 ,  C03C10/12 ,  C04B35/638 ,  C04B35/64 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46 ,  C04B35/00

Abstract: A process for removing organic materials from an article formed from a slurry of glass and/or ceramic particles, resin binder, and a solvent for the resin binder, the process involving including in the slurry a particulate catalyst selected from the group consisting of Cu, Cu20, Cu0, Cu2S04, CuCl2, Cu organometallic compounds, and mixtures thereof, the catalyst promoting a rapid and complete removal from the shaped article, when heated, of the organic materials of the slurry.

公开(公告)号：CA1222832A

公开(公告)日：1987-06-09

申请号：CA496160

申请日：1985-11-26

Applicant: IBM

Inventor： HERRON LESTER W ,  KUMAR ANANDA H ,  MASTER RAJ N ,  NUFER ROBERT W

IPC: C03C8/16 ,  B01J23/00 ,  B01J31/00 ,  C03C10/08 ,  C03C10/12 ,  C04B35/638 ,  C04B35/64 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46

Abstract: Method of Making Multilayered Glass-Ceramic Structures Having An Internal Conductive Metallurgy System A process for removing organic materials from an article formed from a slurry of glass and/or ceramic particles, resin binder, and a solvent for the resin binder, the process involving including in the slurry a particulate catalyst selected from the group consisting of Cu, Cu2O, CuO, Cu2SO4, CuCl2, Cu organometallic compounds, and mixtures thereof, the catalyst promoting a rapid and complete removal from the shaped article when heated of the organic materials of the slurry.

公开(公告)号：CA1123115A

公开(公告)日：1982-05-04

申请号：CA343365

申请日：1980-01-09

Applicant: IBM

Inventor： HERRON LESTER W ,  MASTER RAJ N ,  TUMMALA RAO R

IPC: H05K3/46 ,  B32B17/00 ,  C03C10/00 ,  C03C27/00 ,  H01G4/30 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  B32B31/24

Abstract: MULTILAYERED GLASS-CERAMIC STRUCTURES HAVING AN INTERNAL DISTRIBUTION OF COPPER-BASED CONDUCTORS The formation of sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of copper-based conductors obtained by firing in a controlled ambient of hydrogen and H2O at temperatures below the melting point of copper. FI9-78-056