Abstract:
The memory device (10) comprises a memory array (2) having an organisation of the type comprising global word lines (4) and local word lines (6), a global row decoder (8) addressing the global word lines (4), a local row decoder (12) addressing the local word lines (6), a global power supply stage (22) supplying the global row decoder (8), and a local power supply stage (24) supplying the local row decoder (12).
Abstract:
A voltage regulating circuit for a capacitive load, being connected between first and second terminals of a supply voltage generator (VDD,GND) and having an input terminal (IN) and an output terminal (OUT), comprises an operational amplifier (OP) having an inverting (-) input terminal connected to the input terminal (IN) of the regulating circuit and a non-inverting (+) input terminal connected to an intermediate node of a voltage divider (R1,R2) which is connected between an output node connected to the output terminal (OUT) of the regulating circuit and the second terminal (GND) of the supply voltage generator, and having an output terminal connected, for driving a first field-effect transistor (MPU), between the output node and the first terminal (VDD) of the supply voltage generator, the output terminal of the operational amplifier being further connected to the output node through a compensation network (COMP), and comprises a second field-effect transistor (MPD1) connected between the output node and the second terminal of the supply voltage generator (GND) and having its gate terminal connected to a constant voltage generating circuit means (RB,CB,MB,IB).
Abstract:
Flash NAND memory electronic device comprising non-volatile cells and having a high integration density and relative programming method. Memory device (1) of the type integrated on a semiconductor substrate (3) and comprising one matrix (6) with rows or Word lines (4) and columns or Bit lines (5) organised in sectors (7) of memory cells (2). The device (1) comprising between said cells (2) of said opposite Word lines (4) belonging to at least one of said sectors (7) of said matrix (6) a lateral coating (15) along the direction of the Bit lines (5) having at least one conductive layer (16) with a contact terminal (9) being selectively biased or floating during each program, read or erase operation, each cell belonging to said sector (7).
Abstract:
A charge pump circuit, connected between a first voltage reference and an output terminal, comprises at least two stages consisting of an elementary charge pump circuit connected between said first voltage reference and said output terminal, and adjustment circuitry connected between said output terminal and respective control terminals of said at least two stages. This circuitry is arranged to select for actuation an appropriate combination of these elementary stages according to the current absorbed from a load connected to the output terminal.
Abstract:
The invention relates to an analog-to-digital conversion method and relevant device, in high-density multilevel non-volatile memory devices. The method applies to multilevel memory cells comprising a floating gate transistor with drain and source terminals; the cell to be read is subjected to a reading operation by applying predetermined bias voltage values to its drain and source terminals, while to its drain terminal is applied a predetermined current value (Iref), and by measuring the value of its gate voltage (Vg). The method of the invention comprises a first conversion phase the most significant bits (MSB) contained in the memory cell, followed by a second conversion phase of the least significant bits (LSB). The first step is completed within a time gap (T1-T0) which corresponds to the rise transient of the gate voltage signal (Vg), while the second step is started at the end of the transient.
Abstract:
Electronic memory device with non-volatile memory cells, high density and reduced interference cell-to-cell, of the type integrated on a semiconductor substrate (3) and organised in matrix with rows or Word lines (4) and columns or Bit lines (5) of memory cells (2). Each of said cells (2) comprises at least one floating gate transistor having a floating gate region (9) projecting from said substrate (3) and a control gate region (12) capacitively coupled to said floating gate region (9). Between the cells (2) of said opposite Word lines (4) a lateral coating (15) is provided comprising at least one conductive layer (16) floating along the direction of said Bit lines (5).