公开(公告)号：JPS5935393A

公开(公告)日：1984-02-27

申请号：JP14582582

申请日：1982-08-23

Applicant: Canon Kk

Inventor： MATSUMURA TAKASHI ,  SHIMODA ISAMU

IPC: G03B27/72 ,  G01J1/42 ,  G05D25/00 ,  H03G3/00 ,  H05B37/02

CPC classification number: Y02B20/42

公开(公告)号：JP2551765B2

公开(公告)日：1996-11-06

申请号：JP19186486

申请日：1986-08-15

Applicant: CANON KK

Inventor： NAKAMURA KENJI ,  KAN FUMITAKA ,  TAKENOCHI MASANORI ,  HAYAKAWA NAOJI ,  SHIMODA ISAMU ,  OKUNUKI MASAHIKO

IPC: H03K19/08 ,  G11C11/21 ,  H01J31/00 ,  H01L27/10

公开(公告)号：JP2551764B2

公开(公告)日：1996-11-06

申请号：JP19186386

申请日：1986-08-15

Applicant: CANON KK

Inventor： NAKAMURA KENJI ,  KAN FUMITAKA ,  HAYAKAWA NAOJI ,  TAKENOCHI MASANORI ,  SHIMODA ISAMU ,  OKUNUKI MASAHIKO

IPC: H01J31/00 ,  G11C11/21 ,  H01L27/10

公开(公告)号：JP2551763B2

公开(公告)日：1996-11-06

申请号：JP19186286

申请日：1986-08-15

Applicant: CANON KK

Inventor： NAKAMURA KENJI ,  KAN FUMITAKA ,  HAYAKAWA NAOJI ,  TAKENOCHI MASANORI ,  SHIMODA ISAMU ,  OKUNUKI MASAHIKO

IPC: H01L27/14 ,  G06F12/00 ,  G11C11/21 ,  G11C11/34 ,  G11C11/401 ,  H01J31/00 ,  H01L27/10 ,  H03K19/08

公开(公告)号：JP2514196B2

公开(公告)日：1996-07-10

申请号：JP1614987

申请日：1987-01-28

Applicant: CANON KK

Inventor： TSUKAMOTO TAKEO ,  SHIMIZU AKIRA ,  SUZUKI AKIRA ,  SUGATA MASAO ,  SHIMODA ISAMU ,  OKUNUKI MASAHIKO

IPC: H01J37/073 ,  H01J1/308 ,  H01L21/027 ,  H01L21/30 ,  H01L29/74 ,  H01J1/30 ,  H01J37/06

公开(公告)号：JPH03230513A

公开(公告)日：1991-10-14

申请号：JP2507190

申请日：1990-02-06

Applicant: CANON KK

Inventor： SHIMODA ISAMU ,  KARIYA TAKUO ,  MIZUSAWA NOBUTOSHI ,  OZAWA KUNITAKA ,  UZAWA SHUNICHI

IPC: H01L21/30 ,  G03F7/20 ,  H01L21/027

Abstract: PURPOSE:To obtain desired precision by measuring M/W interval matching error for each of integer times as many exposure regions as those of a first aligner at the time of exposure with a second aligner, and adjusting the equipment so as to minimize the error over the whole exposure region of the second aligner. CONSTITUTION:At the time of exposure with a second aligner, M/W interval matching error is measured for each of the same exposure regions as those of a first aligner or for each of integer times as many exposure regions as those thereof. The equipment is adjusted so as to minimize the error over the whole exposure region of the second aligner. Hence all of the semiconductor device M/W interval matching errors contained in the exposure region of the second aligner can be minimized, and the precision of M/W interval matching of each semiconductor device can be grasped. Thereby minimum line width, productivity, alignment precision, etc., can be optimized when the aligners whose exposure regions are different are used together.

公开(公告)号：JPH0388318A

公开(公告)日：1991-04-12

申请号：JP22329289

申请日：1989-08-31

Applicant: CANON KK

Inventor： SHIMODA ISAMU ,  OZAWA KUNITAKA ,  UDA KOJI ,  UZAWA SHUNICHI ,  KARIYA TAKUO

IPC: G03F7/20 ,  G03F9/00 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE:To make it possible to perform highly accurate position alignment and exposure without decreasing throughput by aligning the positions of a mask and a wafer, exposing and transferring a mask pattern on a wafer, increasing the distance between the mask and the wafer larger than the distance in said exposure and transfer, and exposing the vicinities, of position aligning marks. CONSTITUTION:Position aligning marks 3 and 7 of a mask 5 and a wafer 1 are used, and the positions of the mask 5 and the wafer 1 are aligned. A pattern 6 of the mask 5 is exposed and transferred on the wafer 1. Thereafter, the distance between the mask 5 and the wafer 1 is made larger than the distance at the time of exposure and transfer. Then the vicinities of the position aligning marks 3 and 7 of the mask 5 and the wafer 1 are exposed. Since resolution is decreased in this way, the transfer of the mask mark 7 is prevented, and resist 4 at the upper part of the wafer mark 3 is exposed. Thus, the wafer mark 3 can be exposed without the transfer of the mask mark 7 in the position aligning region. In this way, the highly accurate exposure and the position alignment can be performed.

公开(公告)号：JPH0273616A

公开(公告)日：1990-03-13

申请号：JP22471188

申请日：1988-09-09

Applicant: CANON KK

Inventor： KAWAKAMI EIGO ,  OZAWA KUNITAKA ,  UDA KOJI ,  SHIMODA ISAMU ,  UZAWA SHUNICHI

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE:To prevent an improper chip from occurring due to a vibration by inhibiting the operation of a driver which does not contribute to the operation of an alignment or exposure at the time of the alignment or the exposure. CONSTITUTION:When a wafer 1 is conveyed to a wafer stage 5 and a stage 5 is moved to a position where a first shot is opposed to a pattern on a mask, an operation inhibit flag for inhibiting the operation of a conveyor system is set. Then, it is waited until all the drivers of the system are finished to drive, and then exposed. Thereafter, when all the exposure are finished, the flag is reset. In the system, the flag is checked at the time points before or after the water wafer 1 is conveyed to be placed on an orientation flat detecting base 4 by a supply hand 3, after the orientation flat, after it is conveyed to the stage 5, before or after the hand 3 is turned to a home position. If it is set, it becomes a standby state until it is reset. Thus, it can prevent an improper chip due to a vibration and to improve its yield.

公开(公告)号：JPH0272611A

公开(公告)日：1990-03-12

申请号：JP22348288

申请日：1988-09-08

Applicant: CANON KK

Inventor： MOCHIZUKI NORITAKA ,  EBINUMA RYUICHI ,  WATANABE YUTAKA ,  UNO SHINICHIRO ,  KARIYA TAKUO ,  SHIMODA ISAMU ,  UZAWA SHUNICHI

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE:To enable the positional relation of an optical axis to be adjusted highly accurately by detecting the radiated light which passed two fine pores of pin hole member which is installed in the specific positional relation to the main body. CONSTITUTION:Two plates 101 and 102 having pin holes are arranged with space between, and these are processed so that the straight line connecting each center and the chucking face 303 may be vertical. In this condition, the posture of the mask mounting face 503 to illumination flux 6 is adjusted by a posture adjusting device 11 so that the illumination flux 6 may pass the two pin holes of a pin hole 10 and enter a radiation detector 9. At this time, the radiation detector 9 detects the illumination flux 6, and it is confirmed that the illumination flux 6 enters the mask mounting face 503 vertically the specified accuracy, and the posture of an exposing device is monitored using a displacement sensor 12. Hereby, also after removing a pin hole member 10, the incident angle of the illumination flux 6 can be maintained in high accuracy at all times.

公开(公告)号：JPH0271188A

公开(公告)日：1990-03-09

申请号：JP22225188

申请日：1988-09-07

Applicant: CANON KK

Inventor： AMAMIYA MITSUAKI ,  OZAWA KUNITAKA ,  EBINUMA RYUICHI ,  UDA KOJI ,  SHIMODA ISAMU ,  UZAWA SHUNICHI

IPC: G01T1/29 ,  G03F7/20 ,  G21K5/02 ,  G21K5/04 ,  H01L21/027 ,  H01L21/30 ,  H05H13/04

Abstract: PURPOSE:To measure X-ray intensity with high accuracy even if synchrorotron radiation light (SOR) is used by measuring X-ray intensity after electrons for generating SOR is injected into an SOR ring. CONSTITUTION:When a shutter 7 is closed, electrons are supplied to an SOR ring 1 from an injector 10 and accelerated. Then, with an instruction from a CPU 16, an X-ray detector driving device 12 brings out, via an X-ray detector controller 14, an X-ray detector 6 into an exposed area to measure X-ray intensity. The measured X-ray intensity is sent to the CPU 16 via a signal processor 11. From the measurement result and an attenuation curve of the injected electrons, the X-ray intensity being exposed is calculated. This enables estimation of X-ray intensity during shot exposure from one or more measurements of X-ray intensity after orbit electron injection and the attenuation curve of the orbit electrons.