Abstract:
Provided herein are approaches for in-situ plasma cleaning of one or more components of an ion implantation system. In one approach, the component may include a beam-line component having one or more conductive beam optics. The system further includes a power supply for supplying a first voltage and first current to the component during a processing mode and a second voltage and second current to the component during a cleaning mode. The second voltage and current may be applied to the conductive beam optics of the component, in parallel, to selectively (e.g., individually) generate plasma around one or more of the one or more conductive beam optics. The system may further include a flow controller for adjusting an injection rate of an etchant gas supplied to the component, and a vacuum pump for adjusting pressure of an environment of the component.
Abstract:
Methods of reducing glitch rates within an ion implanter are described. In one embodiment, a plasma-assisted conditioning is performed, wherein the bias voltage to the extraction electrodes is modified so as to inhibit the formation of an ion beam. The power supplied to the plasma generator in the ion source is increased, thereby creating a high density plasma, which is not extracted by the extraction electrodes. This plasma extends from the ion source chamber through the extraction aperture. Energetic ions then condition the extraction electrodes. In another embodiment, a plasma-assisted cleaning is performed. In this mode, the extraction electrodes are moved further from the ion source chamber, and a different source gas is used to create the plasma. In some embodiments, a combination of these modes is used to reduce glitches in the ion implanter.
Abstract:
This disclosure describes systems, methods, and apparatus for operating a plasma processing chamber. In particular, a periodic voltage function combined with an ion current compensation can be provided as a bias to a substrate support as a modified periodic voltage function. This in turn effects a DC bias on the surface of the substrate that controls an ion energy of ions incident on a surface of the substrate. A peak-to-peak voltage of the periodic voltage function can control the ion energy, while the ion current compensation can control a width of an ion energy distribution function of the ions. Measuring the modified periodic voltage function can provide a means to calculate an ion current in the plasma and a sheath capacitance of the plasma sheath. The ion energy distribution function can be tailored and multiple ion energy peaks can be generated, both via control of the modified periodic voltage function.
Abstract:
An ion implantation system and method are disclosed in which glitches in voltage are minimized by use of a modulated power supply system (230) in the implanter. The modulated power supply system includes a traditional power supply (300) and a control unit (310) associated with each power supply, where the control unit is used to isolate the power supply from an electrode by opening a source switch (321) if a glitch or arc is detected, and to quickly dissipate any charge on the electrode to ground by closing a discharge switch (331). The control unit then restores connectivity between power supply and electrode after the glitch condition has been rectified.
Abstract:
Apparatuses, methods, kits, and systems relating to applying electromagnetic energy to an object located at least partially in an energy application zone are disclosed. Some apparatuses may include a processor configured to determine a preliminary amount of energy to be dissipated in the object and determine a corrected amount of energy based on the preliminary amount of energy and calibration information. The processor may be further configured to cause a source to transfer energy to the energy application zone and determine an amount of dissipated energy, based on an amount of energy returned from the energy application zone and an amount of energy supplied to the energy application zone. The processor may also be configured to cause the source to transfer energy to the energy application zone at least until the amount of dissipated energy equals the corrected amount of energy.
Abstract:
An ion implantation system (200) and method are disclosed in which glitches in voltage are minimised by modifications to the power system of the implanter. These power supply modifications include faster response time, output filtering, improved glitch detect ion and removal of voltage blanking. By minimizing glitches, it is possible to produce solar cells with acceptable dose uniformity without having to pause the scan each time a voltage glitch is detected. For example, by shortening the duration of a voltage to about 20-4:0 milliseconds, dose uniformity within about 3% can be maintained.
Abstract:
The invention relates to a method for regulating the electron beam output of electron sources in the rated power range of 0 to 1200 kW. The aim of the invention is to produce automatically continuous power regulation within the entire power range resulting in good focusing properties of the electron beams and minimalising internal electron beam losses. This is achieved by regulating at least two independent actuators which respectively modify one of the following parameters such as cathode temperature, cathode voltage, focusing electrode voltage or cathode-anode-distance, acting as an adjusting parameter.
Abstract:
A grounded metallic shield (31) which comprises an electrode enclosing the filament leads (21, 22) and emitters (26, 27) of an e-Gun in a high vacuum chamber (11) of the type used in melting and casting metals and other materials and evaporation sources. The shield is spaced from the filament leads and emitters a distance in the order of the electron mean free path for the pressure uses within the high vacuum chamber. The structure and method of use thereof suppresses or eliminates arc-downs or glow discharges.
Abstract:
A power generator with partial sinusoidal waveform includes a resonance module circuit and a pulse module circuit. The resonance module circuit includes a plurality of resonance control switches, and generates a first output voltage by selectively turning on and off the plurality of resonance control switches based on a plurality of resonance control signals. The pulse module circuit includes a plurality of pulse control switches, and generates a second output voltage by selectively turning on and off the plurality of pulse control switches based on a plurality of pulse control signals. The power generator generates a bias power based on the plurality of resonance control signals, the plurality of pulse control signals, the first output voltage and the second output voltage. The bias power has a non-sinusoidal voltage waveform during an entire time interval and a sinusoidal voltage waveform during a partial time interval.