Abstract:
Bei einem Verfahren zum Herstellen einer aus mehreren Leiterplattenbereichen bestehenden Leiterplatte (14) sowie einer derartigen Leiterplatte, wobei die einzelnen Leiterplattenbereiche aus wenigstens einer Lage aus einem insbesondere isolierenden Basismaterial und einem auf bzw. in dem Basismaterial befindlichen leitenden bzw. leitfähigen Muster ausgebildet sind, sind vorgesehen: - ein Trägermaterial (1), - wenigstens eine in dem Trägermaterial (1) ausgebildete Registrierungsmarkierung (2), - einen auf dem Trägermaterial angeordneten ersten Leiterplattenbereich (4) unter Ausrichtung dieses ersten Leiterplattenbereichs (4) relativ zu der Registrierungsmarkierung (2), - wenigstens einen an den ersten Leiterplattenbereich (4) im Wesentlichen angrenzenden bzw. diesen wenigstens teilweise überlappenden weiteren Leiterplattenbereich (5, 6) unter Ausrichtung relativ zu der Registrierungsmarkierung (2), und - eine Mehrzahl von Verbindungen der leitenden bzw. leitfähigen Muster des ersten Leiterplattenbereichs (4) mit dem leitenden bzw. leitfähigen Muster des wenigstens einen weiteren Leiterplattenbereichs (5, 6). Dadurch lässt sich eine verbesserte Registrierung und Ausrichtung bei einer Kopplung von Leiterplattenbereichen (4, 5, 6) erzielen.
Abstract:
A microwave or radio frequency (RF) device (100) includes a first substrate (105) having a top surface, the top surface having a ground terminal (122) and a signal terminal (126) and a second substrate (102) disposed over the top surface of the first substrate, the second substrate having a through-hole (120). A conductive material (104) covers sidewalls (196) of the through-hole, at least a portion of the first surface (192) and at least a portion of the second surface (194) at rim edges of the through-hole, the conductive material on the first surface is in electrical contact with the ground terminal. A microwave component (112) is disposed within the through-hole and on the top surface of the first substrate, the microwave component having a ground terminal (128) in electrical contact with the ground terminal of the first substrate, and a signal terminal (130) in electrical contact with the signal terminal. A conductive cover (132) is mounted on the second substrate covering the through-hole, the cover including a conductive surface in electrical contact with the conductive material covering the second surface of the second substrate.
Abstract:
A strap band including a flexible wire bus having electrodes and wires coupled with the electrodes is described. The wire bus may be include in a strap band formed by molding an inner strap, mounting the wire bus in the inner strap, and injection molding an outer strap over the inner strap and wire bus to form a strap band. The electrodes may be positioned on the inner strap to accommodate a target range of a body portion the strap band may be worn on. A material of the strap band and a material the wire bus may be selected to allow a low coefficient of friction between the wire bus and strap band so that loads applied to the strap band may not be coupled with the wire bus or cause damage to wires due to pull and/or torsional load forces applied to the strap band.
Abstract:
본 발명의 일 실시예는 디스플레이 소자에서 기판 상에 설치된 연성인쇄회로기판의 구조에 관한 것으로, 상부 연성인쇄회로 기판 중 하부 연성인쇄회로기판과 겹치는 부분에 형성된 홀에 채워진 전도성 물질에 의해서 겹쳐진 상부 연성인쇄회로기판의 양극 패드 및 음극 패드와 하부 연성인쇄회로기판의 양극 패드 및 음극 패드가 각각 통전되는 것이다.
Abstract:
본 명세서의 실시예는 디스플레이 소자에서 기판 상에 설치된 연성인쇄회로기판의 구조에 있어서, 양극 패드 및 음극 패드가 실장된 2 이상의 연성인쇄회로 기판 및 연성인쇄회로 기판들의 서로 이웃하는 단부에 실장된 양극 패드 및 음극 패드들을 각각 통전하는 납땜부 및 와이어 본딩부 중 어느 하나 이상을 포함하는 것을 제공한다.
Abstract:
L'invention concerne un capteur radiologique dentaire dont la partie électronique est conçue pour minimiser l'encombrement global du capteur. Pour cela, le capteur comporte, dans un boîtier (22, 24), un empilement comprenant une puce de circuit intégré (12) et un scintillateur (13), la puce étant reliée électriquement à des plots d'un premier ruban de circuit imprimé flexible (40) qui est constitué à une extrémité à la manière d'un connecteur mâle apte à coopérer avec un connecteur femelle (44) à force d'insertion nulle. Le connecteur femelle est soudé sur un deuxième ruban de circuit imprimé flexible (50). Le premier et le deuxième rubans flexibles sont repliés à 180° vers le haut, le deuxième portant des plots de connexion (56) qui se trouvent vers le haut après repliement. Un câble de connexion avec l'extérieur est soudé sur ces plots.
Abstract:
A method of manufacturing a mutual connection structure between multi-layer baseboards includes following steps: separating at least the end of a dielectric layer and a corresponding metal layer of each multi-layer baseboard from the end of other dielectric layer and corresponding metal layer; and, adhering at least one of the end of the separated dielectric layer of one multi-layer baseboard to the separated end of a metal layer of another multi-layer baseboard so as to obtain a mutual connection structure between the multi-layer baseboards. The mutual connection structure includes at least a first multi-layer baseboard (300) and a second multi-layer baseboard (400). At least one first metal layer (12,15,18) of the first baseboard adheres to each other with a second metal layer (22 25 28) of the second baseboard to form a connection portion between the two multi-layer baseboards.