公开(公告)号：KR1020170089524A

公开(公告)日：2017-08-04

申请号：KR1020160009848

申请日：2016-01-27

Applicant: 삼성전자주식회사

Inventor： 박정식 ,  전승길 ,  하정수

IPC: H01Q1/24 ,  H01Q1/38 ,  H05K1/02 ,  H05K9/00 ,  H05K3/46

CPC classification number: H01Q1/243 ,  H01P1/20345 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q5/335 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/09754

Abstract: 한실시예에따르면, 전자장치는하우징, 상기하우징내부에배치된통신회로, 상기하우징내부에배치되고, 상기통신회로와전기적으로연결된다층인쇄회로기판(multi-layer PCB) 및상기하우징의내부에배치되거나외부면의적어도일부를형성하고, 상기통신회로및 상기다층인쇄회로기판과전기적으로연결된안테나방사체를포함하고, 상기다층인쇄회로기판은, 상기다층인쇄회로기판의적어도일부층에배치되고, 캐패시턴스를형성하도록구성된제1 도전성패턴, 상기다층인쇄회로기판의적어도다른일부층에배치되고, 인덕턴스를형성하도록구성된제2 도전성패턴및 상기다층인쇄회로기판의적어도일부층 및상기적어도다른일부층 사이에배치되고, 상기제1 도전성패턴및 상기제2 도전성패턴으로부터전기적으로분리된도전성플레이트를포함할수 있다. 이외에다양한실시예가가능할수 있다.

Abstract translation: 根据一个示例性实施例，电子设备包括外壳，布置在外壳内的通信电路，布置在外壳内并电连接到通信电路的多层PCB， 布置或形成至少外表面的一部分，并且包括所述通信电路和所述多层印刷电路板并电连接到所述天线辐射元件，所述多层印刷电路板设置在至少一些所述多层印刷电路板的层， 之间的第一导电图案设置在所述多层印刷电路板的至少一些其他层上，至少第二导电图案和多层印刷电路板的一部分被配置以形成所述电感层和所述至少一些其它层被配置为形成电容 以及与第一导电图案和第二导电图案电分离的导电板。 各种实施例可能是可能的。

公开(公告)号：KR1020110042175A

公开(公告)日：2011-04-25

申请号：KR1020117002729

申请日：2009-06-23

Applicant: 코닌클리케 필립스 엔.브이.

Inventor： 엘징가,마르쿠스,제이.,지.

IPC: F21S2/00 ,  H05K3/34 ,  F21V17/00 ,  F21Y101/02

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: 관통 구멍(5)을 구비하는 도전층(2) 및 관통 구멍(5)과 정렬되는 전기 접촉 패드(4)를 구비하는 고체 광원(3)을 수용하도록 구성되는 수용 표면을 포함하는 지지 모듈(1)이 제공된다. 지지 모듈(1)은 전기 절연부(8) 및 전기 절연부(8)를 통하여 신장하고 관통 구멍(5)을 통하여 돌출하는 적어도 하나의 접촉 핀(9)을 더 포함한다. 부가적으로, 전기 절연부(8)는 접촉 핀(9)의 단부에의 접근을 허용하는 채널(10) 및 도전층(2)의 표면에 의해 수용되는 고체 광원(3)의 전기 접촉 패드(4)를 포함한다. 이러한 채널은 납땜 도구를 이용해 절연부를 통하여 접촉 핀의 단부 및 접촉 패드에 도달하는 것을 가능하게 한다. 따라서 접촉 패드에 접촉 핀을 납땜하여 금속 표면 상에 고체 광원을 부착하는 것이 가능해진다. 금속 표면의 방열 특성이 프린트 배선 회로용 기판의 방열 특성보다 우수하기 때문에, 우수한 방열 특성을 요구하는 어플리케이션의 경우 금속 표면에 고체 조명 장치를 장착하는 것이 유리하다.

Abstract translation: 一种支撑模块（1），包括具有槽孔（5）的导电层（2）和适于接收固态光源（3）的接收表面，所述电接触焊盘（4）与所述通孔 （5）。 支撑模块（1）还包括电绝缘元件（8）和延伸穿过电绝缘元件（8）并且穿过通孔（5）突出的至少一个接触销（9）。 此外，电绝缘元件（8）包括通道（10），允许接触到接触销（9）的端部和由固态光源（3）的表面接收的固态光源（3）的电接触焊盘（4） 导电层（2）。 这样的通道使得可以用焊接工具通过绝缘元件到达接触针和接触垫的端部。 因此，可以通过将接触销焊接到接触焊盘来将固态光源附着在金属表面上。 由于金属表面的散热性优于印刷电路板，所以在金属表面上安装固态照明装置在需要良好散热的应用中是有利的。

公开(公告)号：KR1020060111404A

公开(公告)日：2006-10-27

申请号：KR1020060036152

申请日：2006-04-21

Applicant: 가부시키가이샤 덴소

Inventor： 스기모또게이이찌 ,  나까가와미쯔루

IPC: H05K1/18

CPC classification number: B29C45/14065 ,  B29C45/14639 ,  H05K3/284 ,  H05K3/3405 ,  H05K5/0034 ,  H05K5/065 ,  H05K2201/09754 ,  H05K2201/1034 ,  H05K2203/1316

Abstract: An electronic circuit device and a method for manufacturing the same are provided to reduce a cost of a forming die by making a circuit board maintain close adhesion to the forming die within a cavity of the forming die. In an electronic circuit device, a circuit unit(3) is mounted on a circuit board(2). A terminal(5) mounted on the circuit board(2) is connected to the circuit board(2) electrically. A casing is made of a resin. The casing seals a whole of the circuit unit(3), a mounting part(21) of the circuit board(2) where the circuit unit(3) is mounted, and a portion of the terminal(5) by the resin and makes a remaining area of the terminal(5) exposed. And, a rear side of the mounted part(21) of the circuit board(2) is designated as a portion of an outer surface of the casing.

Abstract translation: 提供一种电子电路器件及其制造方法，通过使电路板在成形模具的空腔内保持与成形模具的密合性，降低成形模具的成本。 在电子电路装置中，电路单元（3）安装在电路板（2）上。 安装在电路板（2）上的端子（5）电连接到电路板（2）。 外壳由树脂制成。 壳体将电路单元（3）的整体，安装电路单元（3）的电路板（2）的安装部分（21）和端子（5）的一部分用树脂密封， 终端（5）的剩余区域暴露。 并且，电路板（2）的安装部分（21）的后侧被指定为壳体的外表面的一部分。

公开(公告)号：US11870169B2

公开(公告)日：2024-01-09

申请号：US17262967

申请日：2019-07-26

Applicant: IMS CONNECTOR SYSTEMS GMBH

Inventor： Christoph Müllinger-Bausch ,  Roland Baumgärtner ,  Michael Regenbrecht

IPC: H01R12/72 ,  H05K1/18

CPC classification number: H01R12/721 ,  H05K1/18 ,  H05K2201/09754 ,  H05K2201/10189

Abstract: The present invention relates to an edge connector (1) for a printed circuit board (50), comprising an at least two-part housing (10) with a first housing part (20) and a second housing part (30), wherein the first housing part (20) has a recess (25) in which at least one conductor (15) is arranged, said at least one conductor (15) having a first limb (16) with a first end (17) and a second limb (18) with a second end (19), wherein the housing (10) comprises a first region (12) in a first plane (11), in which each first end (17) protrudes out of the housing (10) in an assembly direction (5) in order to connect to a conductor track (54) of the printed circuit board (50), and the housing (10) has a second region (14) in a second plane (13) which is arranged parallel and at a distance to the first plane (11) in the assembly direction (5), wherein the second limb (18) is arranged at an angle of 90° to the first limb (16), and the second limb (18) protrudes into a mating plug recess (35) in the second housing part (30) in a plug-in direction (6). The present invention additionally relates to a printed circuit board assembly (2) with at least one such edge connector.

公开(公告)号：US10057989B1

公开(公告)日：2018-08-21

申请号：US15483417

申请日：2017-04-10

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Antti Keränen ,  Jarmo Sääski ,  Ronald H. Haag

IPC: H05K1/00 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/185 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/112 ,  H05K1/142 ,  H05K1/148 ,  H05K1/184 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/368 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Multilayer structure, including a substrate film having a first and second opposite side, said substrate film including electrically insulating material, conductive traces on the first side of the substrate film for establishing a predetermined circuit design, a connector element laid upon the first side of, said substrate film, one side of the connector element facing the structure internals and the other, opposite side facing the environment on the second side of the substrate film including a number of electrically conductive contact members electrically connected to the circuit on the first side of the substrate film and configured to contact one or more electrical contact members of an external element responsive to mating the external element with the connector element, and a plastic layer molded onto the substrate film and the connector element so as to cover said one side of the connector element and the circuit.

公开(公告)号：US09837738B2

公开(公告)日：2017-12-05

申请号：US15648593

申请日：2017-07-13

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H01R12/00 ,  H01R12/71 ,  H01R12/91 ,  H01R12/70 ,  B33Y80/00 ,  B33Y10/00

CPC classification number: H01R12/714 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/4853 ,  H01L23/49811 ,  H01R12/52 ,  H01R12/7005 ,  H01R12/91 ,  H01R13/2428 ,  H05K1/144 ,  H05K3/4007 ,  H05K2201/042 ,  H05K2201/09754

Abstract: An exemplary miniature support has upper and lower spaced-apart engagement surfaces each having at least a portion that are parallel to each other. Two supports each with an end supporting the upper engagement surface and another end supporting the lower engagement surface. The two supports have a spring-like property so that the upper and lower engagement surfaces can repeatedly move between an uncompressed state when not engaged to provide an interconnection and a compressed state when engaged between two opposing boards to provide an interconnection between the boards. The connector is preferably made using 3-D printing and may be integrally made as part of a board also made using the same 3-D printing. The support may have upper and lower engagement surfaces and at least one of the at least two supports that are conductive to establish connectivity between the upper and lower engagement surfaces.

公开(公告)号：US09825382B2

公开(公告)日：2017-11-21

申请号：US15140428

申请日：2016-04-27

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： Xue-Yuan Xiao ,  Zi-Qiang Zhu

IPC: H05K1/00 ,  H01R13/41 ,  H01R13/428 ,  H01R12/70 ,  H01R43/02 ,  H01R12/57 ,  H01R12/72 ,  H05K1/18

CPC classification number: H01R12/707 ,  H01R12/57 ,  H01R12/72 ,  H01R13/41 ,  H01R43/0256 ,  H05K1/182 ,  H05K1/184 ,  H05K2201/09754

Abstract: A connector (100) and assembly of the same, the connector comprises an insulative housing (1) and a plurality of contacts (2) assembled onto the insulative housing (1), the insulative housing (1) defining a mating surface (11) and a mounting surface (12) opposite to the mating surface (11). Each contact (2) including a contact portion (21) arranged in the insulative housing (1) and a mounting portion (22) locating at the mounting surface (12) and protruding sidewardly beyond said insulative housing, the mounting portion (22) defines a soldering surface (222) for being soldered onto to said printed circuit board (200), said soldering surface (222) face toward the mounting surface (12). Therefore, when the connector (100) assembled to the printed circuit board (200), we could make full use of the height space at the up and down direction of the printed circuit board (200), thus greatly reducing the height space occupied by the connector (100).

公开(公告)号：US09525222B2

公开(公告)日：2016-12-20

申请号：US14250811

申请日：2014-04-11

Applicant: Apple Inc.

Inventor： Anna-Katrina Shedletsky ,  Nathan Guide

IPC: H01R13/648 ,  H01R12/61 ,  H05K3/28 ,  H05K3/36

CPC classification number: H01R12/613 ,  H05K3/284 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09754 ,  H05K2201/10424 ,  H05K2203/025

Abstract: Embodiments of the present disclosure provide a method for creating a connection mechanism for a circuit board. The method includes securing a plurality of electrical conductors to a sleeve. Once the electrical conductors have been coupled to the sleeve, the sleeve and the plurality of conductors are coupled to, and molded with, the circuit board. At least one side of the circuit board, such as, for example, the molding over the plurality of electrical conductors, is subsequently reduced to expose at least a portion of at least one of the plurality of electrical conductors. An electrical connector is then coupled to the at least the portion of the one or more of the plurality of electrical conductors that was exposed when the first side of the printed circuit board was reduced.

Abstract translation: 本公开的实施例提供了一种用于创建电路板的连接机构的方法。 该方法包括将多个电导体固定到套筒上。 一旦电导体已经耦合到套筒，套管和多个导体被耦合到电路板并且与其成型。 电路板的至少一侧，例如多个电导体上的模制件，随后被减少以露出多个电导体中的至少一个电导体的至少一部分。 然后，电连接器被耦合到当印刷电路板的第一面减小时暴露的多个电导体中的一个或多个的至少一部分。

公开(公告)号：US09337919B2

公开(公告)日：2016-05-10

申请号：US13697210

申请日：2011-05-11

Applicant: Hidekazu Kikuchi ,  Takayuki Mogi ,  Yoshiyuki Akiyama ,  Hirofumi Kawamura

Inventor： Hidekazu Kikuchi ,  Takayuki Mogi ,  Yoshiyuki Akiyama ,  Hirofumi Kawamura

IPC: H04B7/00 ,  H04B7/24 ,  H01P3/12 ,  H01P5/107 ,  H04B3/56 ,  H01R13/66 ,  H01R103/00 ,  H01R13/6461 ,  H01R24/28 ,  H01R24/76 ,  H05K1/02

CPC classification number: H01P5/02 ,  H01P1/208 ,  H01P3/12 ,  H01P3/121 ,  H01P3/165 ,  H01P5/024 ,  H01P5/082 ,  H01P5/087 ,  H01P5/1022 ,  H01P5/107 ,  H01P5/18 ,  H01P5/182 ,  H01P5/188 ,  H01R13/6461 ,  H01R13/665 ,  H01R24/28 ,  H01R24/76 ,  H01R2103/00 ,  H04B3/56 ,  H04B7/24 ,  H05K1/0225 ,  H05K1/0239 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09754

Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

Abstract translation: 一种信号传输系统，包括：第一连接器装置和与第一连接器装置耦合的第二连接器装置。 第一连接器装置和第二连接器装置耦合在一起以形成电磁场耦合单元，并且传输对象信号被转换成无线电信号，然后通过电磁场耦合单元在第一连接器装置和 第二连接器装置。

公开(公告)号：US20150313003A1

公开(公告)日：2015-10-29

申请号：US14263749

申请日：2014-04-28

Applicant: Apple Inc.

Inventor： Darshan R. Kasar

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H01Q1/243 ,  H01Q1/42 ,  H05K1/189 ,  H05K3/284 ,  H05K9/0024 ,  H05K2201/09754 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1476

Abstract: Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.

Abstract translation: 诸如电气部件和电线以及柔性印刷电路上的迹线的电路可以嵌入注射成型的塑料结构内。 电气元件可以包括集成电路，连接器和系统级封装电路模块。 系统级封装电路模块可以包括安装在基板上并被塑料覆盖的部件。 连接器可以包括用于与电子设备或电池上的相应连接器配合的连接器。 注射成型的塑料结构可以形成外壳。 壳体可以形成电子设备的一部分，接收电子设备的外部壳体或其他结构。 近场通信天线可以嵌入在塑料外壳内。 信号线和塑料纤维可以交织以形成嵌入在塑料外壳或其它注模塑料结构中的网状物。