公开(公告)号：KR101429095B1

公开(公告)日：2014-08-12

申请号：KR1020130080427

申请日：2013-07-09

Applicant: 피에스아이 주식회사

Inventor： 도영락

IPC: F21S2/00 ,  F21Y101/02

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: The present invention relates to an LED lamp using a subminiature LED electrode assembly and, more specifically, to an LED lamp having flexible structure and shape using a subminiature LED electrode assembly. By resolving the problem that a subminiature LED element cannot stand straight when connecting the LED element to an electrode in a three-dimensional shape and the problem that the quality is deteriorated when a subminiature LED element is combined to another subminiature electrode one on one, nano-sized subminiature LED elements can be connected to the two different electrodes without defects and the light extraction efficiency can be improved because of the directionality of the subminiature LED elements connected to the electrodes. Furthermore, performance deterioration of an LED lamp due to defects of partial subminiature LEDs included in the LED lamp can be minimized, and the shape can be partially adjusted according to the purpose or position of the LED lamp.

Abstract translation: 本发明涉及使用超小型LED电极组件的LED灯，更具体地，涉及使用超小型LED电极组件的具有柔性结构和形状的LED灯。 通过解决在将LED元件连接到三维形状的电极时，超小型LED元件不能直立的问题，以及当将超小型LED元件一体接合到另一个微型电极时质量劣化的问题，纳米 尺寸超小型LED元件可以连接到两个不同的电极而没有缺陷，并且由于连接到电极的超小型LED元件的方向性，可以提高光提取效率。 此外，LED灯中包括的部分超小型LED的缺陷导致的LED灯的性能劣化可以最小化，并且可以根据LED灯的目的或位置来部分地调节形状。

公开(公告)号：KR1019960003200B1

公开(公告)日：1996-03-06

申请号：KR1019920019127

申请日：1992-10-17

Applicant: 미쓰비시 마테리알 가부시키가이샤

Inventor： 이케다후지오 ,  아라이카즈유키

IPC: H02H3/22

CPC classification number: H02H9/042 ,  H01H37/761 ,  H01H2037/763 ,  H05K1/0201 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/026 ,  H05K3/3442 ,  H05K2201/10181 ,  H05K2201/10583 ,  H05K2203/176

Abstract: 내용 없음.

公开(公告)号：US12004298B2

公开(公告)日：2024-06-04

申请号：US17392817

申请日：2021-08-03

Applicant: Shinkawa Electric Co., Ltd.

Inventor： Kotaro Matsumoto ,  Hiroyuki Matsuda ,  Hiroshi Aoki ,  Masaru Terada ,  Ovel Emerson ,  Paul A. Lowe

IPC: H05K1/18 ,  H05K5/00 ,  H05K5/03

CPC classification number: H05K1/181 ,  H05K5/0073 ,  H05K5/03 ,  H05K2201/09827 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10583

Abstract: Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

公开(公告)号：US20180294585A1

公开(公告)日：2018-10-11

申请号：US15950340

申请日：2018-04-11

Applicant: HARWIN PLC

Inventor： Robert Webber ,  Sam Bennett ,  Kevin Hunt ,  Robert Coldrick ,  Graham Cunningham ,  Mark Plested ,  Andrew Mcquilken

IPC: H01R12/70 ,  H01R12/71 ,  H01R43/16 ,  H01R13/11 ,  H05K1/18

CPC classification number: H01R12/7035 ,  H01R12/57 ,  H01R12/718 ,  H01R13/11 ,  H01R13/111 ,  H01R43/16 ,  H01R43/205 ,  H05K1/184 ,  H05K2201/10325 ,  H05K2201/10583

Abstract: A female electrical socket for receiving an electrical pin and for connection to a PCB is provided. The socket provides a body having a first end and a second end, each having an opening, wherein either opening is configured to receive a male electrical pin to form a connection with the female socket, and wherein the body has a central longitudinal axis. The socket further provides a plurality of contact fingers on the body, wherein a first end of each of the fingers is attached to the body and a second end of each of the fingers is radially directed inwards relative to the first end towards the central longitudinal axis to provide a retention force to engage with the electrical pin. At least one wing extends outwardly from the first end of the body. A corresponding method of manufacturing the socket is also provided.

公开(公告)号：US09788436B2

公开(公告)日：2017-10-10

申请号：US14939761

申请日：2015-11-12

Applicant: The United States of America as Represented by the Secretary of the Army

Inventor： Bruce V. Hughes

IPC: H05K3/10 ,  H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K3/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/4682 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/10583 ,  Y10T29/49155

Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

公开(公告)号：US20170222338A1

公开(公告)日：2017-08-03

申请号：US15399317

申请日：2017-01-05

Applicant: BIOTRONIK SE & Co. KG

Inventor： Martin Henschel

IPC: H01R11/01 ,  A61N1/375 ,  H01M2/20 ,  H01R4/02 ,  B23K26/242

CPC classification number: H01R11/01 ,  A61N1/3758 ,  B23K26/22 ,  B23K26/242 ,  B23K26/28 ,  B23K26/32 ,  B23K2101/36 ,  B23K2101/38 ,  H01M2/204 ,  H01R4/029 ,  H01R43/0221 ,  H05K1/0293 ,  H05K3/222 ,  H05K3/328 ,  H05K3/4015 ,  H05K2201/10053 ,  H05K2201/10181 ,  H05K2201/10242 ,  H05K2201/10363 ,  H05K2201/10583 ,  H05K2203/107 ,  H05K2203/173

Abstract: A battery bridge for an electronic device, preferably for an electronic implant, has an electrically conductive first contact element, an electrically conductive second contact element and an insulator. The first contact element and the second contact element comprise a weldable material. In a first state of the battery bridge, the first contact element is distanced from the second contact element via a predefined air gap and the first contact element is electrically insulated from the second contact element by the air gap and the insulator. The battery bridge is formed in such a way that it can be transferred, by welding the first contact element and the second contact element together, into a second state, in which the air gap between the first contact element and the second contact element is closed electrically conductively, at least in part. A method for activating such an electronic device is also disclosed.

公开(公告)号：US20170042032A1

公开(公告)日：2017-02-09

申请号：US15302769

申请日：2015-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Yong Joo ,  Jin Hyung Lee ,  Gil Yong Chang

IPC: H05K1/18 ,  H05K7/12

CPC classification number: H05K1/182 ,  G02F1/133308 ,  G02F1/133385 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  H01G2/06 ,  H05K3/301 ,  H05K3/306 ,  H05K7/12 ,  H05K2201/10128 ,  H05K2201/10393 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/2036

Abstract: According to an embodiment of the present disclosure, since the electronic components are fixed on the PCB by the clamp, post processing, such as soldering or application of an adhesive, may be not needed. Also, since the PCB can be spaced from the adjacent configurations by the clamp, the efficient layout of the PCB is possible, resulting in an improvement of productivity of the PCB. In accordance with an aspect of the present disclosure, there is provided a clamp comprises a fixing part configured to surround at least one part of the outer surface of an electronic component, a connection part extending from the fixing part, and penetrating a Printed Circuit Board (PCB), an interference part provided in at least one of the fixing part or the connection part, and configured to be interfered by the PCB and a spacing part protruding from at least one of the connection part or the fixing part.

Abstract translation: 根据本公开的实施例，由于电子部件通过夹具固定在PCB上，因此可能不需要诸如焊接或粘合剂的后处理。 此外，由于PCB可以通过夹具与相邻配置间隔开，所以PCB的有效布局是可能的，从而提高PCB的生产率。 根据本公开的一个方面，提供了一种夹具，其包括被构造成围绕电子部件的外表面的至少一部分的固定部，从固定部延伸并且穿透印刷电路板 （PCB），设置在固定部分或连接部分中的至少一个中的干涉部分，并且被构造成被PCB干涉，以及从连接部分或固定部分中的至少一个突出的间隔部分。

公开(公告)号：US20160163613A1

公开(公告)日：2016-06-09

申请号：US14900651

申请日：2014-06-24

Applicant: DENSO CORPORATION

Inventor： Shinya UCHIBORI ,  Norihisa IMAIZUMI ,  Masayuki TAKENAKA

IPC: H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/3157 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3415 ,  H05K2201/09436 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10583 ,  H05K2201/10757 ,  H05K2201/2036 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.

Abstract translation: 电子设备包括板，第一电子部件，模具树脂和第二电子部件。 板具有与第一表面相对的第一表面和第二表面。 第一电子部件安装在板的第一表面上。 模具树脂密封第一电子部件和板的第一表面。 第二电子部件布置在模制树脂上。

公开(公告)号：US09307628B2

公开(公告)日：2016-04-05

申请号：US13868575

申请日：2013-04-23

Applicant: KING SHING INDUSTRIAL CO., LTD.

Inventor： Chun-Chin Shin

IPC: H05K7/20 ,  H05K1/03 ,  H05K1/16 ,  B23P19/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/20 ,  G06F1/20 ,  H05K1/14

CPC classification number: H05K1/02 ,  G06F1/20 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/202 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/10583

Abstract: A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.

Abstract translation: 电路板组件包括用作导电介质的金属板，封装有金属板的封装，并且在封装中设置有限定在孔中的孔，以允许将金属板延伸出用于电连接的封装以及牢固地安装在其上的电子部件 封装并电连接到金属板以形成闭环。

公开(公告)号：US09204547B2

公开(公告)日：2015-12-01

申请号：US13864656

申请日：2013-04-17

Applicant: United States of America as Represented by the Secretary of the Army

Inventor： Bruce V. Hughes

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K3/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/4682 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/10583 ,  Y10T29/49155

Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

Abstract translation: 非平面印刷电路板具有内表面和外表面。 在内表面和外表面之间是导电和介电材料层。 被动和主动的电气部件嵌入在内部和外部表面。 中空区域由非平面电路板的内表面限定。 非平面印刷电路板在具有非平面形状，诸如，例如，圆柱形或球形，以便形成中空的，弯曲的非平面结构的心轴来制造。