セラミック回路基板及びこれに用いられる導体ペースト
    102.
    发明申请
    セラミック回路基板及びこれに用いられる導体ペースト 审中-公开
    陶瓷电路板及其使用的导电胶

    公开(公告)号:WO2004077899A1

    公开(公告)日:2004-09-10

    申请号:PCT/JP2004/001898

    申请日:2004-02-19

    Abstract: 平面配線導体及び/又はビア導体と抵抗体との接合部位の接合信頼性が高く、安価なセラミック回路基板及びこれに用いられる導体ペーストを提供する。セラミック基材11の表面に設けた平面配線導体13及び/又はビア導体12に接続される抵抗体14を有するセラミック回路基板10において、抵抗体14が低抵抗値を有するAg−Pd系で形成され、平面配線導体13及びビア導体12がAg系からなり、しかも、抵抗体14と、平面配線導体13及び/又はビア導体12が接合部位15で直接接する部分を有することなく、接合用導体16を介して電気的に接続されている。

    Abstract translation: 公开了一种在平面布线导体和/或通孔导体与电阻元件之间的接合部分具有高结点可靠性的低成本陶瓷电路板。 还公开了用于这种陶瓷电路板的导电浆料。 陶瓷电路板(10)包括连接到形成在陶瓷基体(11)的表面上或其表面上的平面布线导体(13)和/或通孔导体(12)的电阻元件(14)。 电阻元件(14)由具有低电阻的Ag-Pd材料构成,而平面布线导体(13)和通孔导体(12)由Ag材料构成。 电阻元件(14)不与接合部分(15)中的平面布线导体(13)和/或通孔导体(12)直接接触,而是经由接合导体(16)与其电连接。

    CIRCUIT BOARD PRODUCING METHOD AND CIRCUIT BOARD PRODUCING DEVICE
    103.
    发明申请
    CIRCUIT BOARD PRODUCING METHOD AND CIRCUIT BOARD PRODUCING DEVICE 审中-公开
    电路板生产方法和电路板生产设备

    公开(公告)号:WO02047450A1

    公开(公告)日:2002-06-13

    申请号:PCT/JP2001/010572

    申请日:2001-12-04

    Abstract: A multi-layer circuit board producing method comprising a hole-forming step in which a sheet-like board material (1) is formed with through or non-through holes and a filling step in which the through or non-through holes (3) formed in the hole- forming step are filled with a paste (7) by use of a filling means, wherein in the filling step, the paste is supplemented with a second paste (11) for supplementary purposes by using a paste supplementing means, whereby the viscosity of the paste is stabilized to improve the fillability of paste into the through or non-through holes.

    Abstract translation: 一种多层电路板的制造方法,其特征在于,具有通孔或非通孔形成片状基板材料(1)的孔形成工序,以及填充工序,所述贯通孔(3) 通过使用填充装置,在成孔步骤中形成的浆料(7)被填充,其中在填充步骤中,通过使用糊剂补充装置补充第二浆料(11)以补充目的,由此 糊料的粘度得到稳定,从而提高了糊料进入通孔或非通孔的填充性。

    SINGLE-SIDED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    104.
    发明申请
    SINGLE-SIDED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    单面电路板及其制造方法

    公开(公告)号:WO98056220A1

    公开(公告)日:1998-12-10

    申请号:PCT/JP1998/002498

    申请日:1998-06-05

    Abstract: Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed and via holes (36a) are formed by filling up the holes (40a) with a metal (46). After the via holes (36a) are formed, a conductor circuit (32a) is formed by etching the metallic layer (42) and a single-sided circuit board (30A) is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) on the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b). Since single-sided circuit boards (30A, 30B, 30C, and 30D) can be inspected for defective parts before the boards (30A, 30B, 30C, and 30D) are laminated upon one another, only defectless single-sided circuit can be used in the step of lamination.

    Abstract translation: 孔(40a)通过其上形成有金属层(42)的绝缘基板(40)形成激光束,并且通过用金属(46)填充孔(40a)形成通孔(36a)。 在形成通孔(36a)之后,通过蚀刻金属层(42)形成导体电路(32a),通过在表面上形成突出导体(38a)形成单面电路板(30A) 通孔(36a)。 电路板(30A)上的突出导体(38a)被放置在另一单面电路板(30B)的导体电路(32b)上,其中粘合剂层(50)由未固化的树脂组成,并被加热并压靠 电路(32b)。 突出导体(38a)通过推开树脂并与电路(32b)电连接而进入未固化树脂。 由于在板(30A,30B,30C和30D)彼此层叠之前可以检查单面电路板(30A,30B,30C和30D)中的缺陷部件,因此只能使用无缺陷的单面电路 在层压步骤中。

    A METHOD OF TESTING AND FITTING ELECTRONIC SURFACE-MOUNTED COMPONENTS
    105.
    发明申请
    A METHOD OF TESTING AND FITTING ELECTRONIC SURFACE-MOUNTED COMPONENTS 审中-公开
    电子表面安装组件的测试和接线方法

    公开(公告)号:WO1997050001A1

    公开(公告)日:1997-12-31

    申请号:PCT/SE1997001124

    申请日:1997-06-23

    Abstract: A method of testing and mounting electronic components that are to be surface-mounted. The components include on one side a plurality of contact pads that shall be connected electrically to contact pads on one side of a test board, particularly BGA components and corresponding components. The invention is characterized by applying to the component contact pads (2) a metal (5) which is liquid at room temperature or at an elevated room temperature, in a first method step; lifting the component (1) away from the surface of the metal (5) in a second method step, wherewith part (7) of the liquid metal remains on the component contact pads (2); and bringing the component contact pads (2) provided with the liquid metal into abutment with corresponding contact pads (3) on the test board (4), in a third method step.

    Abstract translation: 一种测试和安装待表面安装的电子元件的方法。 这些部件在一侧包括多个接触焊盘,这些接触焊盘应与测试板一侧的接触焊盘电连接,特别是BGA部件和相应部件。 本发明的特征在于,在第一方法步骤中,在室温或室温下,向组件接触垫(2)施加液体的金属(5) 在第二方法步骤中将部件(1)从金属(5)的表面提升,其中液体金属的部分(7)保留在部件接触焊盘(2)上; 并且在第三方法步骤中使设置有液态金属的部件接触焊盘(2)与测试板(4)上的对应接触焊盘(3)邻接。

    CONDUCTIVE PASTE FOR BONDING AND METHOD FOR ITS USE IN MANUFACTURING AN ELECTRONIC DEVICE

    公开(公告)号:WO2019089728A1

    公开(公告)日:2019-05-09

    申请号:PCT/US2018/058408

    申请日:2018-10-31

    Inventor: MATSUURA, Yumi

    CPC classification number: H01B1/22 H01L21/4867 H05K1/092 H05K2201/035

    Abstract: The invention relates to a method of manufacturing an electronic device. The method comprises the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent, and 0.07 to 3 parts by weight of a branched higher fatty acid; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component. The invention also provides the conductive paste.

    実装基板及びその製造方法
    109.
    发明申请
    実装基板及びその製造方法 审中-公开
    安装板及其制造方法

    公开(公告)号:WO2009081929A1

    公开(公告)日:2009-07-02

    申请号:PCT/JP2008/073401

    申请日:2008-12-24

    Abstract:  本発明の実装基板は、絶縁性基材と;この絶縁性基材の一面に複数配され、ランドを有した第一導体と;このランド上に配された第二導体と;前記第二導体上にそれぞれ個別に設けられた半田と;前記半田とそれぞれ独立して接する電極部を有する電子部品と;を備え、前記第一導体は少なくとも銀を含む第一部材から、前記第二導体は少なくとも銅を含む第二部材から、前記半田は少なくとも錫を含む第三部材からそれぞれ構成される。

    Abstract translation: 公开了一种安装板,其包括绝缘基座,布置在绝缘基座的一个表面上并且各自具有平台的多个第一导体,布置在平台上的第二导体,分别设置在相应的第二导体上的焊料,以及电子部件, 独立地与各个焊料连接的电极部分。 第一导体由至少含有银的第一构件组成; 第二导体由至少含有铜的第二构件构成; 并且焊料由至少含有锡的第三构件组成。

    THE USE OF SOLDER PASTE FOR HEAT DISSIPATION
    110.
    发明申请
    THE USE OF SOLDER PASTE FOR HEAT DISSIPATION 审中-公开
    焊膏用于散热的使用

    公开(公告)号:WO2006116225A2

    公开(公告)日:2006-11-02

    申请号:PCT/US2006/015326

    申请日:2006-04-20

    Abstract: A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of binder particles and filler particles, or a solder paste. As an example, the heater spreader may be configured to increase a cross-sectional area of a portion of the trace, thereby improving heat flow along that portion of the trace. Alternatively, the heater spreader may be configured to increase the surface area of the trace, thereby increasing heat dissipation from the circuit board. As another example, the heat spreader may be disposed between the trace and a semiconductor device and thereby function as a heat sink for the device.

    Abstract translation: 电路板包括至少一个具有设置在其上的至少一个散热器的迹线,加热器撒布机由固化糊剂形成,例如包含粘合剂颗粒和填料颗粒的混合物的糊料或焊膏。 作为示例,加热器撒布机可以被配置为增加痕迹的一部分的横截面面积,从而改善沿该迹线的该部分的热流。 或者,加热器吊具可以被配置为增加迹线的表面积,从而增加从电路板的散热。 作为另一示例,散热器可以设置在轨迹和半导体器件之间,从而用作该器件的散热器。

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