Abstract:
An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.
Abstract:
A multi-layer circuit board producing method comprising a hole-forming step in which a sheet-like board material (1) is formed with through or non-through holes and a filling step in which the through or non-through holes (3) formed in the hole- forming step are filled with a paste (7) by use of a filling means, wherein in the filling step, the paste is supplemented with a second paste (11) for supplementary purposes by using a paste supplementing means, whereby the viscosity of the paste is stabilized to improve the fillability of paste into the through or non-through holes.
Abstract:
Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed and via holes (36a) are formed by filling up the holes (40a) with a metal (46). After the via holes (36a) are formed, a conductor circuit (32a) is formed by etching the metallic layer (42) and a single-sided circuit board (30A) is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) on the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b). Since single-sided circuit boards (30A, 30B, 30C, and 30D) can be inspected for defective parts before the boards (30A, 30B, 30C, and 30D) are laminated upon one another, only defectless single-sided circuit can be used in the step of lamination.
Abstract:
A method of testing and mounting electronic components that are to be surface-mounted. The components include on one side a plurality of contact pads that shall be connected electrically to contact pads on one side of a test board, particularly BGA components and corresponding components. The invention is characterized by applying to the component contact pads (2) a metal (5) which is liquid at room temperature or at an elevated room temperature, in a first method step; lifting the component (1) away from the surface of the metal (5) in a second method step, wherewith part (7) of the liquid metal remains on the component contact pads (2); and bringing the component contact pads (2) provided with the liquid metal into abutment with corresponding contact pads (3) on the test board (4), in a third method step.
Abstract:
The invention relates to a method of manufacturing an electronic device. The method comprises the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent, and 0.07 to 3 parts by weight of a branched higher fatty acid; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component. The invention also provides the conductive paste.
Abstract:
The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.
Abstract:
A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of binder particles and filler particles, or a solder paste. As an example, the heater spreader may be configured to increase a cross-sectional area of a portion of the trace, thereby improving heat flow along that portion of the trace. Alternatively, the heater spreader may be configured to increase the surface area of the trace, thereby increasing heat dissipation from the circuit board. As another example, the heat spreader may be disposed between the trace and a semiconductor device and thereby function as a heat sink for the device.