公开(公告)号：EP2851913A1

公开(公告)日：2015-03-25

申请号：EP13803427.7

申请日：2013-06-09

Applicant: Schneider Toshiba Inverter Europe SAS

Inventor： CHEN, Jing

IPC: H01G2/06 ,  H05K1/18

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G2/065 ,  H05K1/111 ,  H05K3/301 ,  H05K3/325 ,  H05K3/4015 ,  H05K5/0239 ,  H05K7/1432 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/06 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: An electrical apparatus, comprising a circuit board, and a capacitor installed on the circuit board; the capacitor is detachably installed on the circuit board. The capacitor can be conveniently detached from the circuit board; therefore, a damaged capacitor can be easily replaced with a new capacitor, saving cost by avoiding the problem in the prior art that the entire electrical apparatus is discarded or causes downtime for repairs due to a damaged capacitor.

Abstract translation: 一种电气设备，包括电路板和安装在电路板上的电容器; 电容器可拆卸地安装在电路板上。 电容器可以方便地从电路板上拆下来; 因此损坏的电容器可以容易地用新电容器替换，通过避免现有技术中由于损坏的电容器而丢弃整个电气设备或导致修复停机的问题，从而节约成本。

公开(公告)号：US20240237190A9

公开(公告)日：2024-07-11

申请号：US18048155

申请日：2022-10-20

Applicant: Dell Products L.P.

Inventor： JOHN R. STUEWE ,  MICHAEL ALBERT PERKS

IPC: H05K1/02 ,  G06F11/30

CPC classification number: H05K1/0212 ,  G06F11/3058 ,  H05K2201/06

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have thermal limitations. To mitigate the impact of the thermal limitations, the data processing system may include host circuit card integrated heating assemblies. The heating assemblies may be used to warm hardware components of devices connected to the host circuit card. When connected to the host circuit card, a thermal conduction path between a device and a heating assembly may be established.

公开(公告)号：US20180116048A1

公开(公告)日：2018-04-26

申请号：US15332659

申请日：2016-10-24

Applicant: Hamilton Sundstrand Corporation

Inventor： David Perley ,  Kenneth J. Trotman

IPC: H05K1/02 ,  H05K7/02 ,  H05K3/30

CPC classification number: H05K1/0272 ,  H01L23/34 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/306 ,  H05K7/02 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2203/17

Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

公开(公告)号：US09955574B2

公开(公告)日：2018-04-24

申请号：US14369909

申请日：2012-01-13

Applicant: Koichiro Tanaka ,  Kazuki Kammuri

Inventor： Koichiro Tanaka ,  Kazuki Kammuri

IPC: B32B15/00 ,  H05K1/03 ,  B32B15/08 ,  H05K1/09 ,  H05K3/02 ,  B32B7/02 ,  B32B15/20 ,  H05K1/05

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1

公开(公告)号：US09888559B2

公开(公告)日：2018-02-06

申请号：US15325550

申请日：2015-06-17

Applicant: Siemens Aktiengesellschaft

Inventor： Ruediger Knofe ,  Bernd Mueller ,  Andrey Prihodovsky

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K1/0212 ,  H05K1/095 ,  H05K1/11 ,  H05K1/167 ,  H05K3/30 ,  H05K3/321 ,  H05K3/325 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/06 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/1115 ,  H05K2203/165

Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

公开(公告)号：US20170245369A1

公开(公告)日：2017-08-24

申请号：US15371212

申请日：2016-12-07

Applicant: HONDA MOTOR CO., LTD.

Inventor： Hironori UJIKE ,  Atsushi KURAUCHI

IPC: H05K1/18 ,  H05K7/20 ,  H05K5/03

CPC classification number: H05K1/181 ,  H05K1/0287 ,  H05K1/029 ,  H05K5/03 ,  H05K7/20409 ,  H05K7/20854 ,  H05K2201/06

Abstract: A printed wiring board includes a first outer surface, a second outer surface, and an electronic circuit. The second outer surface is opposite to the first outer surface. The electronic circuit includes at least one specific design circuit block and at least one common design circuit block. The at least one specific design circuit block is provided on the first outer surface and designed in accordance with a specification of a device to which the printed wiring board is applied. The at least one common design circuit block is for a common use regardless of the specification of the device. The at least one common design circuit block is provided on the second outer surface.

公开(公告)号：US20170142858A1

公开(公告)日：2017-05-18

申请号：US15339988

申请日：2016-11-01

Applicant: COVIDIEN LP

Inventor： STEVEN C. RUPP ,  DANIEL A. FRIEDRICHS ,  ROBERT B. SMITH

IPC: H05K7/20 ,  H05K13/04 ,  H05K1/02

CPC classification number: H05K7/205 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3731 ,  H01L23/40 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0213 ,  H05K13/0486 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/10151

Abstract: A thermal management system and method for electronic devices is provided. The system includes an electronic device, a heat sink, and a thermally conducting and electrically insulating thermal bridge that is interposed between the electronic device and the heat sink. The thermal bridge thermally couples the electronic device to the heat sink and electrically isolates the electronic device from the heat sink. The electronic device, the heat sink, and the thermal bridge are mounted on a same planar surface of a printed circuit board.

公开(公告)号：US20170141697A1

公开(公告)日：2017-05-18

申请号：US15322961

申请日：2015-07-08

Applicant: AISIN AW CO., LTD.

Inventor： Shinsuke TSUBAMOTO ,  Keita MUTSUURA

IPC: H02M7/44 ,  H05K1/02 ,  H02M1/14

CPC classification number: H02M7/44 ,  H02M1/14 ,  H02M7/003 ,  H05K1/0204 ,  H05K1/0262 ,  H05K2201/06 ,  H05K2201/09972 ,  H05K2201/10022

Abstract: A control board for a power conversion device, the control board including a board body that is a multilayer board; a first circuit mounted on a first surface of the board body and including a heat generator; a second circuit mounted on the first surface of the board body, the second circuit using a voltage different from a voltage of the first circuit; an insulation region formed on the first surface of the board body, the insulation region performing insulation between the first circuit and the second circuit; and a pattern of a thermal conductive material formed on an internal layer of the board body, extending in a region overlapping with the insulation region as seen from a direction orthogonal to the first surface of the board body, and thermally connected to the heat generator.

公开(公告)号：US20170135207A1

公开(公告)日：2017-05-11

申请号：US15416212

申请日：2017-01-26

Applicant: A.B. Mikroelektronik Gesellschaft mit beschraenkter Haftung

Inventor： Robert Christopher BURNS ,  Wolfgang TUSLER ,  Bernd HAEGELE

IPC: H05K1/05 ,  H05K3/46 ,  H05K1/09 ,  H05K1/02 ,  H05K7/02

CPC classification number: H05K1/05 ,  H01L23/492 ,  H01L25/072 ,  H01L25/18 ,  H01L2924/0002 ,  H02M7/003 ,  H05K1/021 ,  H05K1/0263 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/4644 ,  H05K7/023 ,  H05K7/04 ,  H05K2201/0326 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/10166 ,  H01L2924/00

Abstract: The invention relates to a circuit board (1a, 1b, 1c), particularly for a power-electronic module (2), comprising an electrically-conductive substrate (3) which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface (3a, 3b) of the electrically-conductive substrate (3), at least one conductor surface (4a, 4b) is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface (4a, 4b) being in direct electrical contact with the electrically-conductive substrate (3).

公开(公告)号：US09609738B1

公开(公告)日：2017-03-28

申请号：US14560807

申请日：2014-12-04

Applicant: Flextronics AP, LLC

Inventor： Dennis Willie ,  Richard Loi ,  David Geiger ,  Anwar Mohammed ,  Murad Kurwa ,  Hector Rene Marin Hernandez

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20

CPC classification number: H05K1/0201 ,  H01L23/373 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/181 ,  H05K3/3494 ,  H05K7/20209 ,  H05K7/2039 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/062 ,  H05K2201/10371 ,  H05K2203/304

Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. The formed graphite sheet is shaped to selective direct impinging heat. The heat can be directly away from the entire electronic component. Alternatively, the heat can be selectively directed away from some portions of the electronic component and toward other portions of the electronic component.