公开(公告)号：WO98051137A1

公开(公告)日：1998-11-12

申请号：PCT/FI1998/000374

申请日：1998-04-30

IPC: H01L23/367 ,  H05K1/02 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L23/3672 ,  H01L2924/0002 ,  H05K3/3421 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10204 ,  H01L2924/00

Abstract: The invention pertains to a method for coupling a cooling element to an apparatus or its part including electronic components to be cooled. The cooling element (1) according to the invention is preferably surface mounted to a thermally conductive printed circuit board (5). The invention also pertains to a cooling element comprising a cooling jacket (2) and connector part (3; 3a, 3b). The cooling element (1) is surface mountable by its connector part (3; 3a, 3b) to a printed circuit board (5).

Abstract translation: 本发明涉及一种用于将冷却元件连接到包括要冷却的电子部件的装置或其部件的方法。 根据本发明的冷却元件（1）优选地表面安装到导热印刷电路板（5）。 本发明还涉及一种包括冷却套（2）和连接件（3; 3a，3b）的冷却元件。 冷却元件（1）通过其连接器部分（3; 3a，3b）可表面安装到印刷电路板（5）。

公开(公告)号：WO1993020560A1

公开(公告)日：1993-10-14

申请号：PCT/US1993003130

申请日：1993-03-30

Applicant: DIGITAL EQUIPMENT CORPORATION

Inventor： DIGITAL EQUIPMENT CORPORATION ,  WU, Andrew, L. ,  DA COSTA, Derrick, Donald ,  COE, Stephen, R. ,  PIERCE, Donald, C. ,  BRUCE, E., William, II

IPC: G11C05/00

CPC classification number: H05K1/141 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/181 ,  H05K3/30 ,  H05K3/366 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10204 ,  H05K2203/1572

Abstract: A high-density memory module has thirty-two memory integrated circuit chips, sixteen decoupling capacitors, and two resistors mounted on a double-sided multi-layer printed wiring board having a series of edge terminals for connection to a motherboard. One side of the board has a first 2 x 8 rectangular matrix of the chips, and the other side of the board has a second 2 x 8 matrix of the chips. The chips are grouped into four 'strings', (sharing a common bus) each of which includes eight chips which receive the same row address strobe and column address strobe. Each string is selected by a unique row address strobe. Address, data, power, and ground terminals are distributed and dispersed along a series of edge terminals. One of two resistors is used for indicating the type of the memory chips in the memory module, and the other resistor is interconnected with similar resistors in other memory modules on the motherboard to provide a combined resistance indicating the number of memory modules on the motherboard.

公开(公告)号：EP2893618A1

公开(公告)日：2015-07-15

申请号：EP13745121.7

申请日：2013-08-06

Applicant: Robert Bosch GmbH

Inventor： STIEFEL, Tobias

IPC: H02K11/00

CPC classification number: H05K1/0259 ,  H02K11/26 ,  H05K2201/10204

Abstract: Surge arrester for a an electric machine, comprising a dummy component (2) which is, compared to components on a circuit board (1) of the electric machine, mounted at the shortest distance from a discharge element (4) of the electric machine, the dummy component (2) being connected to earth potential in at least one terminal.

公开(公告)号：EP1558064B1

公开(公告)日：2014-07-09

申请号：EP03809438.9

申请日：2003-09-26

Applicant: Panasonic Corporation

Inventor： KUMAGAI, Jun, MATSUSHITA ELECTRIC WORKS LTD. ,  KISHIMOTO, Akihiro, MATSUSHITA ELECTRIC WORKS LTD. ,  KONISHI, Hirofumi, MATSUSHITA ELECTRIC WORKS LTD.

IPC: H02M1/42 ,  H02M7/5387 ,  H05B41/288 ,  H05K1/02 ,  H05K3/30 ,  H05K3/36

CPC classification number: H02M1/4208 ,  H02M7/53871 ,  H05B41/2883 ,  H05B41/2888 ,  H05K1/0254 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09645 ,  H05K2201/09972 ,  H05K2201/10196 ,  H05K2201/10204 ,  Y02B20/202 ,  Y02B20/204 ,  Y02B70/126

公开(公告)号：EP2283718B1

公开(公告)日：2012-03-28

申请号：EP09757213.5

申请日：2009-05-28

Applicant: Sartorius Weighing Technology GmbH

Inventor： WEITEMEIER, Swen ,  OLDENDORF, Christian

IPC: H05K1/02 ,  G01R31/3163

CPC classification number: G01R31/2815 ,  G01R31/2839 ,  G06F21/86 ,  H05K1/0275 ,  H05K2201/10151 ,  H05K2201/10204

Abstract: The invention relates to an electronic device comprising a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The invention is characterised in that the controller carries out a real-time test of the circuit board by means of a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive source-specific, or individual circuit board network with at least two separate partial circuits (18', 18' '), wherein the separate partial circuits are electrically connected in the assembled state by cooperation with one or more device and/or assembly components (181).

公开(公告)号：EP2283716B1

公开(公告)日：2012-03-28

申请号：EP09757211.9

申请日：2009-05-28

Applicant: Sartorius Weighing Technology GmbH

Inventor： WEITEMEIER, Swen ,  OLDENDORF, Christian

IPC: H05K1/02 ,  G01R31/3163

CPC classification number: G01R31/2815 ,  G01R31/2839 ,  G06F21/86 ,  H05K1/0275 ,  H05K2201/10151 ,  H05K2201/10204

Abstract: The invention relates to an electronic device comprising a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The invention is characterised in that the controller carries out a real-time test of the circuit board by means of a test signal introduced into the electrical circuit. the electrical circuit (18) being designed as a passive source-specific, or individual circuit board network with at least one element with an inductive action, the element with inductive action being formed by a conductor wire (201) wound through a break (202) in the circuit board (10) to give a coil which in the assembled position has a ferromagnetic bar of the electronic device or a ferromagnetic fixing pin (203) running therethrough, such that the inductive value of the element with an inductive action in the assembled state is different from the inductive value thereof in the disassembled state.

公开(公告)号：EP1098368B1

公开(公告)日：2011-12-21

申请号：EP00915469.1

申请日：2000-04-11

Applicant: Panasonic Corporation

Inventor： KIMURA, Suzushi ,  HIMORI, Tsuyoshi ,  HASHIMOTO, Koji

IPC: H01L25/00 ,  H01L23/12 ,  H01L21/56 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/184 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/161 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

Abstract: A module component in which chip parts are embedded in a circuit board and a method of manufacturing of the same. The module component can have desired circuit characteristics and functions stably even if the size of a part is miniaturized, is produced with high efficiency, and suitable for mechanical mounting. Since a desired circuit is formed by arranging a prescribed number of parts according to a prescribed rule, no heat treatment of embedded parts is required when making a module. Since each chip part has values conforming to the specifications, the circuit characteristic, functions and dimensional accuracy or the like can be stably obtained as designed. Since the chip parts are arranged according to the prescribed rule, insertion of the chip parts can be easily automated and speeded up, and miniaturization of the chip parts is coped with sufficiently. Moreover, the circuit structure can be changed flexibly and easily only by changing the insertion positions and types of chip parts.

公开(公告)号：EP2307895A2

公开(公告)日：2011-04-13

申请号：EP09757872.8

申请日：2009-06-03

Applicant: Eles Semiconductor Equipment S.P.A.

Inventor： DI LELLO, Stefano

IPC: G01R31/319 ,  G01R31/28

CPC classification number: G01R31/2891 ,  G01R1/0483 ,  G01R3/00 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10204 ,  H05K2201/10393 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0108 ,  H05K2203/162

Abstract: A test board (115;115') is proposed for testing electronic devices (105;105'), each one of them having a plurality of terminals (220;220') for electrically contacting the electronic device. The test board includes a support substrate (205;205!). A set of banks of electrically conductive receptacles (210;210') are arranged on the substrate each one for resting a corresponding electronic device; each receptacle (250,255;250',255') is adapted to receive a terminal of the corresponding electronic device. Locking means (225) are further arranged on the substrate for mechanically locking the electronic devices on the test board. The test board further includes assembly means (230-245) for mounting the locking means on the substrate independently of the receptacles.

公开(公告)号：EP2019574A2

公开(公告)日：2009-01-28

申请号：EP08013360.6

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu ,  Ohkawa, Hiroshige ,  Kawabata, Kenichi

IPC: H05K3/28

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K3/0052 ,  H05K3/4644 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and electronic components 41 and chip-like dummy parts 51 primarily made from the same material as the primary material of the electronic component 41 are embedded into the insulating layer 21. Chip-like dummy parts 51 are disposed in an unmounted portion of the electronic components 41 in, for example, a frame-like arrangement so as to surround the plurality of electronic components (groups) 41.

Abstract translation: 提供一种制造电子部件嵌入式板的方法，其能够在不需要以低成本进行复杂的工艺的情况下抑制翘曲并且提供高生产率和经济效率。 工作片100在近似矩形的基板11的一个表面上包括绝缘层21和31，并且主要由与电子部件41的主要材料相同的材料制成的电子部件41和芯片状的虚拟部分51嵌入绝缘层 芯片状的虚拟部件51以例如框状的方式设置在电子部件41的未安装部分中，以围绕多个电子部件（组）41。

公开(公告)号：EP1566995B1

公开(公告)日：2007-08-15

申请号：EP04003951.3

申请日：2004-02-20

Applicant: Research In Motion Limited

Inventor： Connell, David James ,  Christian, Beverley Howard

IPC: H05K13/08 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/111 ,  G01N2013/0225 ,  H05K1/0269 ,  H05K3/341 ,  H05K3/3436 ,  H05K13/046 ,  H05K13/08 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10204 ,  Y02P70/611