公开(公告)号：US06909055B2

公开(公告)日：2005-06-21

申请号：US10301990

申请日：2002-11-22

Applicant: Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H01L23/495 ,  H05K1/02 ,  H05K1/09 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.

Abstract translation: 一种装置，包括电路，具有连接到所述电路并具有第二端的第一端的引线和连接到所述引线的第二端的可变形结构。 本发明可以实现在电路板上，使得电路板包括基板和连接到所述基板的可变形结构。

公开(公告)号：US06836003B2

公开(公告)日：2004-12-28

申请号：US09819874

申请日：2001-03-28

Applicant: David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

Inventor： David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

IPC: H01L23495

CPC classification number: G01R31/2851 ,  G01R1/0408 ,  G01R31/2884 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Abstract translation: 提供了具有与引线框一体的对准特征的集成电路。 集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。 引线框架具有其中的对准特征。 对准特征包括在引线框架上切割出半圆形，突起，孔或槽的形式。 或者，对准特征包括可移除地耦合的突片。 集成电路测试完成后，对准标签从集成电路中取出。 对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

公开(公告)号：US06781839B2

公开(公告)日：2004-08-24

申请号：US10457122

申请日：2003-06-09

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefore including a heat sink.

Abstract translation: 因此，高密度垂直表面安装封装和热载体包括散热器。

公开(公告)号：US20020008310A1

公开(公告)日：2002-01-24

申请号：US09939849

申请日：2001-08-27

Inventor： Larry D. Kinsman ,  Walter L. Moden ,  Warren M. Farnworth

IPC: H01L023/02

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicular from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract translation: 一种可垂直安装的半导体器件，包括从其底部边缘垂直延伸的多个短截线触头。 互补对准装置包括用于接收垂直安装的半导体器件的插座。 对准装置可附接到载体基板。 在将对准装置附接到载体基板并将可垂直安装的半导体装置插入到插座中时，接触元件向垂直安装的半导体器件施加向下的力，以建立并保持可垂直安装的半导体器件与 载体衬底。

公开(公告)号：US20020003694A1

公开(公告)日：2002-01-10

申请号：US09944232

申请日：2001-08-30

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K007/20

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片

公开(公告)号：US06330158B1

公开(公告)日：2001-12-11

申请号：US09587610

申请日：2000-06-05

Applicant: Salman Akram

Inventor： Salman Akram

IPC: H05K720

CPC classification number: H01L24/73 ,  H01L23/4334 ,  H01L23/4951 ,  H01L24/29 ,  H01L24/33 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83805 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15763 ,  H01L2924/181 ,  H05K1/18 ,  H05K2201/10151 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10696 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01032 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0665 ,  H01L2924/0695 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A semiconductor package includes a semiconductor die, a lead frame wire bonded to the die, and a plastic body encapsulating the die. The package also includes a first heat sink attached to a face of the die, and a second heat sink attached to a back side of the die. Thermally conductive adhesive layers attach the heat sinks to the die, and provide a thermal path therebetween. In addition, the heat sinks project from the plastic body, and have end portions that are sized and shaped to interlock with heat sinks on an adjacent package to form an electronic assembly. In the electronic assembly, the interlocking heat sinks maintain contact surfaces on the heat sinks in physical contact and improve heat dissipation from the packages. An alternate embodiment package includes a thermally conductive encapsulant which attaches a pair of heat sinks, and encapsulates the die.

Abstract translation: 半导体封装包括半导体管芯，结合到管芯的引线框架引线和封装管芯的塑料体。 该包装还包括附接到模具的表面的第一散热器和附接到模具的背面的第二散热器。 导热粘合剂层将散热器附接到模具，并且在它们之间提供热路径。 此外，散热器从塑料体突出，并且具有尺寸和形状的端部，以与相邻封装上的散热器互锁以形成电子组件。 在电子组件中，互锁散热器保持物理接触的散热器上的接触表面并改善封装的散热。 替代实施例包装包括附接一对散热器并封装管芯的导热密封剂。

公开(公告)号：US20010011762A1

公开(公告)日：2001-08-09

申请号：US09819874

申请日：2001-03-28

Inventor： David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

IPC: H01L023/495 ,  H01L023/48 ,  H01L023/52 ,  H01L023/28

CPC classification number: G01R31/2851 ,  G01R1/0408 ,  G01R31/2884 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Abstract translation: 提供了具有与引线框一体的对准特征的集成电路。 集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。 引线框架具有其中的对准特征。 对准特征包括在引线框架上切割成半圆形，突起，孔或槽的形式。 或者，对准特征包括可移除地耦合的突片。 集成电路测试完成后，对准标签从集成电路中取出。 对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

公开(公告)号：US06246108B1

公开(公告)日：2001-06-12

申请号：US09374176

申请日：1999-08-12

Applicant: David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

Inventor： David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

IPC: H01L2348

CPC classification number: G01R31/2851 ,  G01R1/0408 ,  G01R31/2884 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Abstract translation: 提供了具有与引线框一体的对准特征的集成电路。 集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。 引线框架具有其中的对准特征。 对准特征包括在引线框架上切割成半圆形，突起，孔或槽的形式。 或者，对准特征包括可移除地耦合的突片。 集成电路测试完成后，对准标签从集成电路中取出。 对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

公开(公告)号：US6048744A

公开(公告)日：2000-04-11

申请号：US929843

申请日：1997-09-15

Applicant: David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

Inventor： David J. Corisis ,  Tracy Reynolds ,  Michael Slaughter ,  Daniel Cram ,  Leland R. Nevill ,  Jerrold L. King

IPC: G01R1/04 ,  G01R31/28 ,  H01L23/495 ,  H01L23/544 ,  H05K3/30 ,  G01R31/26 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/66

CPC classification number: G01R31/2851 ,  H01L23/4951 ,  H01L23/544 ,  H05K3/303 ,  G01R1/0408 ,  G01R31/2884 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

Abstract: An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Abstract translation: 提供了具有与引线框一体的对准特征的集成电路。 集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。 引线框架具有其中的对准特征。 对准特征包括在引线框架上切割成半圆形，突起，孔或槽的形式。 或者，对准特征包括可移除地耦合的突片。 集成电路测试完成后，对准标签从集成电路中取出。 对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

公开(公告)号：US5728601A

公开(公告)日：1998-03-17

申请号：US441595

申请日：1995-05-15

Applicant: Mitsutaka Sato ,  Masanori Yoshimoto

Inventor： Mitsutaka Sato ,  Masanori Yoshimoto

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H05K1/18 ,  H05K3/30 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60

CPC classification number: H01L23/3107 ,  H01L23/49555 ,  H01L25/105 ,  H05K3/301 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K1/181 ,  H05K2201/10454 ,  H05K2201/10606 ,  H05K2201/10696

Abstract: A process for manufacturing semiconductor package of a single in-line type including a semiconductor chip, a package body for accommodating the semiconductor chip and a plurality of leads held by the package body to extend substantially perpendicularly to a bottom edge surface of the package body. The package body carries a cutout part at a predetermined position of a side edge that surrounds the package body such that the cutout part is adapted for engagement with a support leg for supporting the package body substantially upright on a substrate.

Abstract translation: 一种用于制造包括半导体芯片，用于容纳半导体芯片的封装主体和由封装体保持的多个引线的单个直列式的半导体封装的工艺，其基本上垂直于封装体的底部边缘表面延伸。 包装体在围绕包装主体的侧边缘的预定位置处携带切口部分，使得切口部分适于与用于将包装体基本上直立支撑在基板上的支撑腿接合。