公开(公告)号：WO2006020883A1

公开(公告)日：2006-02-23

申请号：PCT/US2005/028765

申请日：2005-08-11

Applicant: HONEYWELL INTERNATIONAL INC. ,  SHIFFER, Stephen, R.

Inventor： SHIFFER, Stephen, R.

IPC: H05K1/18

CPC classification number: H05K1/184 ,  H05K1/182 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09981 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity is disposed within the component mounting surfaces to provide compressive retention of the electronic component when press-fit into the cavity. Preferably, the cavity has a depth such that when the component is press-fit, it does not extend above the surface plane of the cavity. The insertion cavity is further characterized as including at least one conductive trace disposed on an inner surface of said insertion cavity and positioned on the insertion cavity surface such that the conductive trace contacts at least one lead of the electronic device retained within the insertion cavity.

Abstract translation: 一种用于提供一个或多个电子部件的三维载体安装的装置和方法。 根据一个实施例，本发明的装置安装装置包括具有至少两个维度的部件安装表面的弹性弹性塑料基板。 至少一个按压配合部件插入腔设置在部件安装表面内，以在压配合到腔中时提供电子部件的压缩保持。 优选地，空腔具有这样的深度，使得当组件被压配合时，其不延伸到空腔的表面平面之上。 插入腔的特征还在于包括设置在所述插入腔的内表面上并定位在插入腔表面上的至少一个导电迹线，使得导电迹线接触保持在插入腔内的电子器件的至少一个引线。

公开(公告)号：WO2005096683A1

公开(公告)日：2005-10-13

申请号：PCT/JP2005/005811

申请日：2005-03-29

Applicant: 菱星電装株式会社 ,  安保 次雄 ,  藤原 覚 ,  長谷川 佳克 ,  中川 千尋 ,  尾野 武 ,  漆谷 篤 ,  柏岡 亨 ,  島沢 勝次

Inventor： 安保 次雄 ,  藤原 覚 ,  長谷川 佳克 ,  中川 千尋 ,  尾野 武 ,  漆谷 篤 ,  柏岡 亨 ,  島沢 勝次

IPC: H05K1/02

CPC classification number: H05K3/202 ,  H01R9/2466 ,  H01R12/523 ,  H05K3/041 ,  H05K3/222 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4611 ,  H05K13/0061 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T428/24917

Abstract: 　簡易な構造の回路基板を得る。 　回路基板１９は射出成型により成型された合成樹脂製の樹脂プレート２０上に銅箔から成り回路基板１９ごとに異なるパターンの箔回路２１が載置されている。樹脂プレート２０には、複数のアンカピン２０ａが上方に向けて突出され、箔回路２１に設けられたピン孔に挿通され、箔回路２１は樹脂プレート２０に位置決め固定されている。樹脂プレート２０の必要個所には端子挿通孔２０ｃが設けられ、この端子挿通孔２０ｃの必要個所に受端子２２を固定し箔回路２１と接続する。

Abstract translation: 制造具有简单结构的电路板。 电路板（19）上有一个设置在由铜箔制成并具有不同于电路板（19）的图案的注模成型的合成树脂板（20）上的箔片电路（21）。 在树脂板（20）上设置有向上突出的定位销（20a），并通过在箔片电路（21）中形成的销孔。 箔片电路（21）被定位并固定到树脂板（20）上。 在树脂板（20）的所需部分中，设置有端子插入孔（20c），并且接收端子（22）固定到端子插入孔（20c）的所需部分并连接到箔片电路 ）。

公开(公告)号：WO2004095536A2

公开(公告)日：2004-11-04

申请号：PCT/US2004/007067

申请日：2004-03-08

Applicant: PRINCETON UNIVERSITY

Inventor： WAGNER, Sigurd ,  PERICHON LACOUR, Stephanie ,  ZHIGANG, Sue

IPC: H01L

CPC classification number: H05K1/11 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2203/0271

Abstract: The present invention relates to stretchable interconnects which can be made in various geometric configurations, depending on the intended application. The stretchable interconnects can be formed of an electrically conducting film or an elastomer material to provide elastic properties in which the interconnects can be reversibly stretched in order to stretch and relax the elastomer material to its original configuration. Alternatively, stretchable interconnects can be formed of an electrically conducting film or a plastic material to provide stretching of the material to a stretched position and retaining the stretched configuration. The stretchable interconnect can be formed of a flat 2-dimensional conductive film covering an elastomeric or plastic substrate. When this structure is stretched in one or two dimensions, it retains electrical conduction in both dimensions. Alternatively, the stretchable and/or elastic interconnects can be formed of a film or stripe that is formed on an elastomeric or plastic substrate such that it is buckled randomly, or organized in waves with long-range periodicity. The buckling or waves can be induced by various techniques, including: release of built-in stress of the conductive film or conductive stripe; pre-stretching the substrate prior to the fabrication of the conductive film or conductive stripe; and patterning of the surface of the substrate prior to the fabrication of the metal film. The stretchable interconnect can be formed of a plurality of conductive films or conductive stripes embedded between a plurality of layers of a substrate formed of an elastomer or plastic.

Abstract translation: 本发明涉及根据预期应用可以制成各种几何构型的可拉伸互连。 可拉伸互连可以由导电膜或弹性体材料形成，以提供弹性，其中互连可以可逆地拉伸，以便将弹性体材料拉伸和松弛到其初始构型。 或者，可拉伸互连可以由导电膜或塑料材料形成，以将材料拉伸到拉伸位置并保持拉伸构型。 可拉伸互连可以由覆盖弹性体或塑料基底的平坦的二维导电膜形成。 当这种结构在一个或两个维度上被拉伸时，它在两个维度上保持电传导。 或者，可拉伸和/或弹性互连可以由形成在弹性体或塑料基底上的膜或条形成，使得其随机屈曲，或者组织成具有长范围周期性的波浪。 屈曲或波浪可以通过各种技术引起，包括：释放导电膜或导电条纹的内在应力; 在制造导电膜或导电条之前预拉伸基板; 以及在制造金属膜之前对衬底的表面进行图案化。 可拉伸互连可以由嵌入在由弹性体或塑料形成的基底的多个层之间的多个导电膜或导电条形成。

公开(公告)号：WO02049403A1

公开(公告)日：2002-06-20

申请号：PCT/EP2001/014351

申请日：2001-12-06

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H05K1/0393 ,  H05K3/005 ,  H05K2201/091 ,  H05K2203/0126 ,  H05K2203/0221

Abstract: The invention relates to a method for interconnecting flexible printed boards (1). To this end, electroconductive layers (2, 3) that are disposed on two opposite sides are conductively interconnected by piercing a hole into the printed board (1) with a simple burring tool (10), thereby producing a through-hole (4), and then injecting a defined amount of a conductive adhesive (5) into said through-hole (4) by means of a dosing needle (20). During piercing, the material of the printed board is stretched to such an extent that on the through-hole (4), on the side of the printed board (1), a funnel-shaped recess (7), and on the opposite side an elevated bulge (6) is produced. The conductive adhesive (5) filling the through-hole (4) is fed from the bulge side and wets the surface of the bulge (6) and the surface of the funnel-shaped recess (7).

Abstract translation: 在经由所述柔性印刷电路板（1），两个位于由电导电层相对的表面上（2，3）导电地由所述印刷电路板连接的孔（1）首先通过一个简单的穿刺工具（10），用于通过孔产生的装置（4） 被刺破，然后在通过计量针（20）限定的导电性粘接剂（5）的量的装置的通孔（4）被注入。 使得形成在印刷电路板的一侧上时刺穿所述电路板材料被拉伸，例如通孔（4）（1）具有一个漏斗状的凹陷（7）和在相对侧上的凸起凸缘（6），其中，所述通道开口（4）填充导电性粘接剂 （5）被供应和（6），并且在另一方面（7）润湿一方面珠珠的表面上的漏斗状的凹陷的表面上。

公开(公告)号：WO01002149A1

公开(公告)日：2001-01-11

申请号：PCT/FR2000/001843

申请日：2000-06-30

IPC: B60R7/06 ,  B29C70/70 ,  B29C70/72 ,  B60K37/00 ,  B60R16/02 ,  H05K1/11 ,  H05K3/28 ,  B29C45/14 ,  H01H13/70

CPC classification number: B29C70/70 ,  B29C70/72 ,  B60K37/00 ,  B60R16/0215 ,  H05K1/118 ,  H05K3/284 ,  H05K2201/091 ,  H05K2201/10053 ,  H05K2203/1327

Abstract: The invention concerns a method for making a dashboard subassembly comprising electrical and/or electronic components (1) connected to conductors (2) and attached to a rigid support (3). The invention is characterised in that it consists in: providing a flexible mat (4) provided with said conductors (2); mounting said components (1) on said mat (4), connected to said electrical conductors (2); rigidising said mat (4) by overmoulding it with a material designed to form said support (3). The invention also concerns a dashboard subassembly, in particular a motor vehicle dashboard console, obtained by said method.

Abstract translation: 本发明涉及一种用于制造仪表板子组件的方法，其包括连接到导体（2）并连接到刚性支撑件（3）的电和/或电子部件（1）。 本发明的特征在于：提供设置有所述导体（2）的柔性垫（4）; 将所述部件（1）安装在所述垫（4）上，连接到所述电导体（2）; 通过用设计成形成所述支撑件（3）的材料将其模制成硬化所述垫（4）。 本发明还涉及通过所述方法获得的仪表板子组件，特别是机动车辆仪表板控制台。

公开(公告)号：WO1996009746A1

公开(公告)日：1996-03-28

申请号：PCT/US1995011933

申请日：1995-09-20

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  KOVAC, Zlata ,  MITCHELL, Craig ,  DISTEFANO, Thomas

IPC: H05K01/02

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

Abstract: A method and an apparatus for providing a planar and compliant interface between a semiconductor chip (120) and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads (110) defining channels (117) between adjacent pads. The pads are typically compressed between a flexible film chip carrier (100) and the chip. A compliant filler (170) is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

Abstract translation: 一种用于在半导体芯片（120）和其支撑衬底之间提供平面和柔性界面的方法和装置，以适应其之间的热膨胀系数不匹配。 兼容接口由在相邻焊盘之间限定通道（117）的多个柔性焊盘（110）组成。 垫通常在柔性膜芯片载体（100）和芯片之间被压缩。 进一步在通道内设置顺应填料（170）以形成具有受控厚度的均匀包封层。

公开(公告)号：WO1993012560A1

公开(公告)日：1993-06-24

申请号：PCT/SE1992000852

申请日：1992-12-10

Applicant: KATONA, Sandor

IPC: H01R04/06

CPC classification number: H01R12/69 ,  H01R4/06 ,  H01R43/0484 ,  H05K1/118 ,  H05K3/326 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: The present invention relates to a method of securing connection tags to electrical conductors in thermal foils and the like in which a contact plate is riveted in place near a hole passing through plastic layers (1, 2) and a metal part (3). In this method the contact plate (9) is riveted in place near a hole (4) passing through the plastic layers and a metal foil (3) arranged adjacent to the layers (1, 2), by means of a hollow rivet (6) which is passed through the hole. On the opposite side of the hole the rivet has been bent around an upset (8) at the lower edge of the hole, the hole (4) having been made with the aid of a mandrel (5), suitably hot and at least partly conical in shape, so that the upper edge of the hole is flanged to a recessed sealing surface for the rivet (6), the central part has been formed to an exposed cylindrical metal contact surface (7) against the rivet (6), and the lower side to a sealing upset (8), preferably reinforced at the edge, increasing the contact pressure and hermetically sealing the area around the contact surface.

Abstract translation: 本发明涉及一种将连接标签固定在热箔等中的电导体的方法，其中接触板在通过塑料层（1,2）和金属部件（3）的孔附近被铆接就位。 在该方法中，接触板（9）通过穿过塑料层的孔（4）和邻近层（1,2）布置的金属箔（3）铆接在中空铆钉（6） ）通过孔。 在孔的相对侧，铆钉已经在孔的下边缘处的镦锻（8）周围弯曲，孔（4）已经借助于心轴（5）制成，适当地热并且至少部分地 使得孔的上边缘与铆钉（6）的凹入的密封面法兰连接，中心部分已经形成为暴露的圆柱形金属接触表面（7）抵靠铆钉（6），并且 优选在边缘加强的密封镦粗（8）的下侧增加接触压力并气密地密封接触表面周围的区域。

公开(公告)号：WO1992022996A1

公开(公告)日：1992-12-23

申请号：PCT/DE1992000381

申请日：1992-05-12

Applicant: ROBERT BOSCH GMBH ,  MAYER, Rolf ,  SIEGEL, Heinz ,  DERINGER, Helmut ,  SCHURR, Volker

Inventor： ROBERT BOSCH GMBH

IPC: H05K03/34

CPC classification number: H01R12/67 ,  B60T8/3675 ,  H01R4/02 ,  H01R4/2404 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3447 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10878 ,  H05K2203/1189

Abstract: The aim of the invention is to produce a mechanically and electrically secure solder bond between a contact pin and a solder eyelet on a conductor track sheet. With respect to its end (29), the contact pin (14) has a reduced section, in the form of a constriction (32) for instance, in which lodge sheet sections (28) which protrude out from the plane of the conductor track sheet (18) and which are formed when the contact pin pierces the initially virgin solder eyelet (23). The solder (25) connects the conducting film (21) of the solder eyelet (23) and sheet sections (28) with the contact pin (14).

公开(公告)号：WO2018202331A1

公开(公告)日：2018-11-08

申请号：PCT/EP2018/025128

申请日：2018-04-25

Applicant: SARALON GMBH

Inventor： ALI, Moazzam ,  BHUIE, Manpreet, Singh

IPC: H01M2/10 ,  H05K1/18

CPC classification number: H01M2/1038 ,  H01M2/105 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/091 ,  H05K2201/10037

Abstract: A battery holder made of a flexible substrate is taught. A first part of the flexible substrate is folded over a second part of the flexible substrate at a first folding line. An adhesive layer is provided on the flexible substrate to fix a first portion of the first part onto the second part and hence to create a housing. The housing is defined by a first side wall, a second side wall, a top wall, a bottom wall and at least one opening. The at least one opening is perpendicular to the walls. The at least one battery is inserted into and removed from the housing through the at least one opening. A first electrical contact layer, to contact a first terminal of the battery, is provided on at least one of the first side wall, the second side wall, the bottom wall and the top wall. A second electrical contact layer, to contact a first terminal of the battery, is provided on at least one of the first side wall, the second side wall, the top wall and the bottom wall. A first conducting layer and a second conducting layer are provided on the flexible substrate to electrically connect the first electrical contact layer and the second contact layer, respectively.

公开(公告)号：WO2016074792A1

公开(公告)日：2016-05-19

申请号：PCT/EP2015/002267

申请日：2015-11-12

Applicant: HÄUSERMANN GMBH

Inventor： HACKL, Johann ,  HOERTH, Stefan ,  REDL, Norbert

IPC: H05K1/02

CPC classification number: H05K1/0207 ,  H05K1/0206 ,  H05K1/0265 ,  H05K1/0278 ,  H05K2201/066 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10272 ,  H05K2201/10416

Abstract: Mehrlagen-Leiterplatte umfassend mindestens ein abwinkelbares Segmentteil, wobei in einem Biegeabschnitt des Segmentteils mindestens ein biegbar ausgebildetes funktionales Element integriert ist und mindestens eine Kerbkante angeordnet ist und die Leiterplatte zumindest in diesem Bereich teilweise biegbar ausgebildet ist, wobei im Biegeabschnitt des mindestens einen abwinkelbaren Segmentteils als funktionales Element mindestens ein Dickkupfer-Profil angeordnet ist, das bei einer Biegung bleibend verformbar ist.

Abstract translation: 印刷电路板的多层，其包含至少一个可弯曲段部，其中，在至少一个可弯曲形成功能元件的段部的弯曲部被集成和至少一个凹口的边缘被布置和电路板部分地形成可弯曲的在该区域中至少在所述至少一个成角度的段构件的作为弯曲部 一个厚的铜型材的功能元件被布置在至少，其永久地弯曲变形。