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111.发明申请
公开(公告)号：WO2006132148A1
公开(公告)日：2006-12-14
申请号：PCT/JP2006/311096
申请日：2006-06-02
IPC: H01L33/00 , F21V19/00 , F21V29/00 , F21Y101/02
CPC classification number: H05K1/0204 , F21K9/00 , F21V29/505 , F21V29/763 , F21V29/83 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H05K1/021 , H05K1/053 , H05K1/183 , H05K3/0061 , H05K2201/09054 , H05K2201/09554 , H05K2201/10106 , H05K2203/135 , H01L2924/00014 , H01L2924/00
Abstract: 発光素子実装用ホーロー基板は、コア金属と、前記コア金属の表面に被覆されたホーロー層と、１つ以上のスルーホールと、を有し、該スルーホール内面で前記コア金属が露出している。
Abstract translation: 公开了一种用于发光装置安装的瓷搪瓷基板，其包括芯金属，覆盖芯金属表面的瓷釉层和一个或多个通孔。 核心金属在通孔的内表面露出。
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公开(公告)号：WO2006030352A2
公开(公告)日：2006-03-23
申请号：PCT/IB2005052936
申请日：2005-09-08
Applicant: KONINKL PHILIPS ELECTRONICS NV , MAES WOUTER
Inventor： MAES WOUTER
CPC classification number: H05K3/44 , H05K1/0393 , H05K3/0061 , H05K3/28 , H05K3/4038 , H05K2201/0305 , H05K2201/09554 , H05K2201/09563 , H05K2201/10977
Abstract: An electronic device comprises a flexible, printed circuit board having an electrically conductive layer (2) on one side of the flexible board, and a conductive metallic stiffener (8) which is attached to the flexible board. Said conductive layer (2) is conductively connected to the metallic stiffener (8) by means of solder. The flexible board is provided with a through-hole (10), the solder connecting the metallic stiffener (8) with the conductive layer (2) being present in said through-hole (10).
Abstract translation: 电子设备包括柔性印刷电路板，该柔性印刷电路板在柔性板的一侧具有导电层（2），以及连接到柔性板的导电金属加强件（8）。 所述导电层（2）通过焊料与金属加强件（8）导电连接。 柔性板设置有通孔（10），该焊料将金属加强件（8）与存在于所述通孔（10）中的导电层（2）连接。
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公开(公告)号：WO1993026146A1
公开(公告)日：1993-12-23
申请号：PCT/CH1993000148
申请日：1993-06-10
Applicant: DYCONEX PATENTE AG , SCHMIDT, Walter , MARTINELLI, Marco
Inventor： DYCONEX PATENTE AG
IPC: H05K07/20
CPC classification number: H05K7/205 , H05K1/0206 , H05K1/0287 , H05K1/0289 , H05K1/0393 , H05K1/05 , H05K1/115 , H05K3/0041 , H05K3/0061 , H05K3/0064 , H05K3/0097 , H05K3/386 , H05K3/427 , H05K3/429 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/0394 , H05K2201/0397 , H05K2201/066 , H05K2201/0909 , H05K2201/09327 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09572 , H05K2201/09609 , H05K2201/09627 , H05K2201/09781 , H05K2201/09836 , H05K2201/09945 , H05K2201/10666 , H05K2203/0554 , H05K2203/0746 , H05K2203/1184 , H05K2203/1545 , H05K2203/1572
Abstract: According to a process for producing a thermal layout, not only massive heat sinks are provided for absorbing heat, but also an optimized number of thermoconductive strips which distribute the heat over the printed circuit board. In the collecting zones are arranged higher capacity sinks into which the heat is transmitted. The thermoconductive strips may be thermoconductors (TL) provided for that purpose and more massive than the conductive strips for the electric connections, or conductive strips for electric connections, the electroconductors (EL), may also be used for heat transfer. An optimum design interconnects the TL'S and EL's into a functional whole, a thermal management network. With a certain technique, which could be called pocket groove technique, "cooling channels" of a type may be created. Such thermoconductors may be included in the electric layout, so that a thermal layout is superimposed on the connection layout (TL/EL network). Heat distribution and transfer may thus be calculated and optimized by a computer in the same way as the electric distribution by the conductive strips, i.e. the known electric layout, which is produced by a computer-assisted process.
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公开(公告)号：WO2018195568A1
公开(公告)日：2018-11-01
申请号：PCT/AT2018/000028
申请日：2018-04-19
Applicant: ZKW GROUP GMBH
Inventor： KIESLINGER, Dietmar , EDLINGER, Erik
CPC classification number: H05K1/053 , H05K1/056 , H05K1/115 , H05K3/0035 , H05K3/0038 , H05K3/0047 , H05K3/421 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563
Abstract: Ein Verfahren zur Herstellung zumindest einer elektrisch leitenden Verbindung (6a, 6b, 6c) in einem Schaltungsträger (1), der eine Aluminiumbasisschicht (2), eine darüber angeordnete Isolierschicht (3) sowie eine auf der Isolierschicht angeordnete Leiterbahnstruktur (4) aufweist, wobei die elektrisch leitende Verbindung zwischen der Aluminiumbasisschicht und zumindest einer Leiterbahn (4a, 4b, 4c) der Leiterbahnstruktur (4) hergestellt wird, wobei zumindest eine Bohrung (5a, 5b, 5c) hergestellt wird, welche die Leiterbahn (4a, 4b, 4c) und die Isolierschicht (3) durchsetzt und zumindest bis zu der Aluminiumbasisschicht (2) reicht und zur Herstellung der zumindest einen elektrisch leitenden Verbindung (6a, 6b, 6c) diese Bohrung mit einem elektrisch leitfähigen Stoff gefüllt wird, welcher daraufhin einem Verfestigungsprozess unterworfen wird, sowie ein dementsprechend ausgebildeter Schaltungsträger.
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公开(公告)号：WO2007130870A3
公开(公告)日：2008-08-28
申请号：PCT/US2007067674
申请日：2007-04-27
Applicant: FLEXTRONICS AP LLC , GRAYDON BHRET , FRANDRUP STEVE
Inventor： GRAYDON BHRET , FRANDRUP STEVE
IPC: H01L23/34
CPC classification number: H05K1/118 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0218 , H05K1/0393 , H05K3/0061 , H05K3/321 , H05K3/386 , H05K2201/09554 , H05K2201/10977 , H05K2201/2009 , Y10T428/13 , Y10T428/28 , H01L2924/00
Abstract: A structure is disclosed for connecting an electrically-connectable metal stiffener (402) to a ground connection within a flexible substrate (102), the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non- conducting adhesive (110) which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy (302). A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.
Abstract translation: 公开了用于将可电连接的金属加强件（402）连接到柔性基底（102）内的接地连接件的结构，所述加强件包括镀镍的不锈钢。 在一个实施例中，加强件通过非导电粘合剂（110）固定到柔性基底上，所述非导电粘合剂（110）包括在接地连接上的开口，所述粘合剂开口由导电环氧树脂（302）填充。 用于应用所公开的材料的顺序公开了一种将加强结构附接到柔性基底的方法。
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Patent Agency Ranking
公开(公告)号：WO2007130870A2
公开(公告)日：2007-11-15
申请号：PCT/US2007/067674
申请日：2007-04-27
Applicant: FLEXTRONICS AP, LLC , GRAYDON, Bhret , FRANDRUP, Steve
Inventor： GRAYDON, Bhret , FRANDRUP, Steve
CPC classification number: H05K1/118 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0218 , H05K1/0393 , H05K3/0061 , H05K3/321 , H05K3/386 , H05K2201/09554 , H05K2201/10977 , H05K2201/2009 , Y10T428/13 , Y10T428/28 , H01L2924/00
Abstract: A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non-conducting adhesive which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy. A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.
Abstract translation: 公开了用于将可电连接的金属加强件连接到柔性基板内的接地连接件的结构，该加强件包括镀镍的不锈钢。 在一个实施例中，加强件通过非导电粘合剂固定到柔性基底上，该非导电粘合剂包括在接地连接上的开口，粘合剂开口由导电环氧树脂填充。 用于应用所公开的材料的顺序公开了一种将加强结构附接到柔性基底的方法。
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公开(公告)号：WO2007026945A1
公开(公告)日：2007-03-08
申请号：PCT/JP2006/317605
申请日：2006-08-30
CPC classification number: H01L25/162 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H05K1/056 , H05K1/142 , H05K3/284 , H05K3/4046 , H05K2201/09554 , H05K2201/10287 , H05K2201/1034 , H05K2201/10924 , Y10T29/5313 , H01L2924/00 , H01L2224/48247 , H01L2924/00014 , H01L2924/00012
Abstract: 組み込まれる電気回路の動作が安定化された回路装置を提供する。混成集積回路装置10は、略同一平面上に配置された複数の回路基板11A、11B、11Cを具備する。そして、これらの回路基板の各々の上面に、導電パターンおよび回路素子から成る電気回路が構成されている。更に、これらの回路基板は、封止樹脂14によりー体に支持されている。また、回路基板の表面に形成された電気回路と接続されたリード25は、封止樹脂14から外部に導出している。
Abstract translation: 提供了一种电路装置，其中内置电路的操作是稳定的。 混合集成电路装置（10）设置有布置在基本上相同的平面上的多个电路板（11A，11B，11C）。 在每个电路板的上平面上，构成由导电图案和电路元件组成的电路。 此外，电路板由密封树脂（14）一体地支撑。 连接到形成在电路板表面上的电路的引线（25）从密封树脂（14）引出到外部。
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公开(公告)号：WO2004004433A1
公开(公告)日：2004-01-08
申请号：PCT/US2003/020362
申请日：2003-06-27
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： WANG, Alan E. , OLSON, Kevin C.
IPC: H05K3/44
CPC classification number: H05K3/44 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0909 , H05K2201/0919 , H05K2201/09554 , H05K2203/135 , Y10T29/49126 , Y10T29/49156 , Y10T29/49167 , Y10T428/12361 , Y10T428/24322
Abstract: Provided is a process for creating vias for a circuit assembly including the steps of (a) applying a curable coating composition to a substrate, some or all of which is electrically conductive, to form an uncured coating thereon; (b) applying a resist over the uncured coating; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the uncured coating; (e) removing the exposed areas of the uncured coating; and (f) heating the coated substrate of step (e) to a temperature and for a time sufficient to cure the coating. Also disclosed is a process of fabricating a circuit assembly.
Abstract translation: 提供了一种用于创建电路组件的通孔的方法，包括以下步骤：（a）将可固化涂料组合物施加到基底上，其中一些或全部导电，以在其上形成未固化的涂层; （b）在未固化的涂层上涂覆抗蚀剂; （c）在预定位置对抗蚀剂进行成像; （d）显影抗蚀剂以暴露未固化涂层的预定区域; （e）去除未固化涂层的暴露区域; 和（f）将步骤（e）的涂覆的基材加热到足以固化涂层的温度和时间。 还公开了一种制造电路组件的工艺。
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119.发明申请SINGLE OR MULTI-LAYER PRINTED CIRCUIT BOARD WITH RECESSED OR EXTENDED BREAKAWAY TABS AND METHOD OF MANUFACTURE THEREOF 审中-公开单层或多层印刷电路板，带有延伸或延伸的断裂面板及其制造方法
公开(公告)号：WO2004004432A1
公开(公告)日：2004-01-08
申请号：PCT/US2003/020361
申请日：2003-06-27
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： WANG, Alan E. , OLSON, Kevin C. , DI STEFANO, Thomas H.
IPC: H05K3/44
CPC classification number: H05K1/0231 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/44 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/0919 , H05K2201/09309 , H05K2201/09554 , H05K2201/10446 , H05K2203/135 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
Abstract: A circuit board layer (2) in accordance with the present invention includes a conductive sheet (4) sandwiched between an insulating top layer (10) and an insulating bottom layer (14). The top and bottom layers (10) and (14) and the conductive sheet (4) define the circuit board layer (2) having an edge that includes an edge (20) of the conductive sheet (4). An insulating edge layer (18) covers substantially all of the edge (20) of the conductive sheet (4).
Abstract translation: 根据本发明的电路板层（2）包括夹在绝缘顶层（10）和绝缘底层（14）之间的导电片（4）。 顶层和底层（10）和（14）和导电片（4）限定具有包括导电片（4）的边缘（20）的边缘的电路板层（2）。 绝缘边缘层（18）几乎覆盖导电片（4）的所有边缘（20）。
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公开(公告)号：WO2003086038A1
公开(公告)日：2003-10-16
申请号：PCT/US2003/008835
申请日：2003-03-21
Applicant: INTEL CORPORATION
Inventor： COOMER, Boyd , WALK, Michael
IPC: H05K3/46
CPC classification number: H01L21/4857 , H05K3/107 , H05K3/386 , H05K3/44 , H05K3/4614 , H05K3/4641 , H05K2201/0195 , H05K2201/09554 , H05K2203/0315 , H05K2203/1142 , Y10T29/49126 , Y10T29/49128
Abstract: Adhesive material is applied to a surface of a metallic core layer. The adhesive material is removed from a conductive region of the metallic core layer. A metallic contact is provided over the conductive region of the metallic core layer. The metallic core layer is laminated to an imprinted buildup layer, the buildup layer having a dielectric region and a conductive region, wherein a nonconductive region of the metallic core layer is bonded to the dielectric region of the buildup layer and the conductive region of the metallic core layer is bonded to the conductive region of the imprinted-buildup layer.
Abstract translation: 将粘合材料施加到金属芯层的表面。 从金属芯层的导电区域去除粘合材料。 金属接触件设置在金属芯层的导电区域上。 金属芯层层压到压印堆积层上，积层层具有电介质区域和导电区域，其中金属芯层的非导电区域结合到堆积层的电介质区域和金属芯层的导电区域 芯层结合到印迹堆积层的导电区域。
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