公开(公告)号：EP0518701A2

公开(公告)日：1992-12-16

申请号：EP92305443.1

申请日：1992-06-12

Applicant: APTIX CORPORATION

Inventor： Osann, Robert, Jr. ,  Shaw, George A., Jr. ,  Mohsen, Amr M.

IPC: G06F15/60 ,  H05K1/00

CPC classification number: H01L23/5382 ,  H01L2224/49171 ,  H01L2924/10253 ,  H05K1/0289 ,  H05K1/112 ,  H05K2201/09945 ,  H05K2201/10689 ,  H05K2203/175 ,  H01L2924/00

Abstract: The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customised pattern of bonding pads is then formed over the one or both surface of the substrate which correspond to the terminal footprints of specific surface mounted packages intended to be mounted on the substrate. A generalised pattern of bonding pads may also be formed on the surface of the substrate for electrically connecting terminals of bare dice thereto by means of thin wire. All bonding pads are electrically connected to one or more vias by direct electrical contact or by a conductive trace extending from the bonding pad to a nearly via.

Abstract translation: 本发明使用具有位于其一个或两个表面上的多个导电和可互连通孔的可编程互连基板。 然后在衬底的一个或两个表面上形成定制的焊盘图案，该表面对应于期望安装在衬底上的特定表面安装封装的端子脚印。 也可以在基板的表面上形成接合焊盘的一般化图案，用于通过细线电连接裸芯片的端子。 所有接合焊盘通过直接电接触或通过从接合焊盘延伸到几乎通孔的导电迹线而电连接到一个或多个通孔。

公开(公告)号：EP0329414A3

公开(公告)日：1991-02-06

申请号：EP89301441.5

申请日：1989-02-15

Applicant: BICC Public Limited Company

Inventor： Lawrence, Howard

IPC: H05K1/00 ,  H05K3/10 ,  H05K3/36 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/326 ,  H05K1/0287 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/4046 ,  H05K3/4611 ,  H05K2201/091 ,  H05K2201/09454 ,  H05K2201/096 ,  H05K2201/09945 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/2009

Abstract: A printed circuit board which is of such a construction that patterns of electrically conductive strips and/or pads of either standard or non-standard form can be readily provided comprises a rigid board 1 of which at least the major surfaces are of electrically insulating material, which has extending through the board a multiplicity of holes 2 arranged in a pattern of rows and columns and which carries on one or each of its major surfaces a multiplicity of annular metal islands 3 each bounding a hole in the board and discrete with respect to the other annular islands. The rigid board 1 may also carry on said one or each of its major surfaces supplementary metal islands 4 and 5 each positioned between and discrete with respect to annular islands bounding adjacent holes in the rigid board. A circuit of either a standard or non-standard pattern can be formed by electrically interconnecting selected adjacent metal islands 3, 4 and 5 with local deposits of material of high electrical conductivity in such a way as to bridge the gap between adjacent islands. The local deposits may be effected manually but are preferably effected automatically using a modified computer aided design plotter or an automatic fluid dispensing machine.

Abstract translation: 具有这样一种结构的印刷电路板，即可容易地提供标准或非标准形式的导电条和/或焊盘的图案，其中至少主表面为电绝缘材料的刚性板1， 其沿着板延伸了多个以行和列的图案布置的孔2，并且在其主表面中的一个或多个表面上具有多个环形金属岛3，每个环形金属岛3围绕板中的孔并且相对于 其他环岛。 刚性板1还可以承载其主要表面中的一个或每个主要附加金属岛4和5，其各自位于相对于限定刚性板中相邻孔的环形岛之间和离散。 标准或非标准图案的电路可以通过将所选择的相邻金属岛3,4和5与当前存在高导电性材料的局部沉积物以互相连接相邻岛之间的间隙的方式形成。 局部沉积可以手动进行，但优选使用改进的计算机辅助设计绘图仪或自动流体分配机器自动实现。

公开(公告)号：EP0074303B1

公开(公告)日：1986-02-26

申请号：EP82401565.5

申请日：1982-08-23

Applicant: Rouge, François

Inventor： Rouge, François

IPC: H05K1/00 ,  H05K3/46

CPC classification number: H05K1/0287 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/09609 ,  H05K2201/09945

公开(公告)号：EP0083503A2

公开(公告)日：1983-07-13

申请号：EP82306966.1

申请日：1982-12-24

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. ,  Berg, James G.

IPC: H01R4/04

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2201/1025 ,  H05K2203/1189 ,  H01L2924/00

Abstract: A sheet material for providing electrical connections is provided which gives the needed degree of stability and low resistance with simplicity of application. Electrically conducted elements are dispersed in a polymeric layer and an adhesive is provided which is either the material of the layer or a coating over the elements which adhesive is non-tacky at room temperature but softens upon heating while reverting to a nonflowable condition on cooling. The electrically conductive elements can protrude above the surface of the polymer in which they are embedded. Electrically conductive layers can be provided over portions of the sheet with the polymeric layer containing electrically conductive elements extending over the whole of the sheet or over only those portions having electrically conductive lower layers.

Abstract translation: 提供一种用于提供电连接的片材，其提供了所需的稳定性和低电阻，并且应用简单。 电导体元件分散在聚合物层中，并且提供粘合剂，其是层的材料或元件上的涂层，所述粘合剂在室温下是非粘性的，但在加热时软化，同时在冷却时还原为不可流动的状态。 导电元件可以突出在其嵌入其中的聚合物的表面之上。 可以在片材的一部分上提供导电层，聚合物层包含在整个片材上延伸的导电元件，或仅在具有导电下层的那些部分上。

公开(公告)号：US20180287275A1

公开(公告)日：2018-10-04

申请号：US16002004

申请日：2018-06-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Chu XU ,  Takahiro BABA

IPC: H01R12/52 ,  H05K1/03 ,  H05K1/14 ,  H05K1/02 ,  H05K3/36

CPC classification number: H01R12/52 ,  H01R12/62 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/113 ,  H05K1/144 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09263 ,  H05K2201/09945 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10522

Abstract: A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.

公开(公告)号：US20170290151A1

公开(公告)日：2017-10-05

申请号：US15625924

申请日：2017-06-16

Applicant: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY

Inventor： Hanqing JIANG ,  Cheng LV ,  Hongyu YU

IPC: H05K1/11 ,  H05K1/09 ,  H01M2/20 ,  H05K1/14

CPC classification number: H05K1/11 ,  H01L23/145 ,  H01L23/49866 ,  H01L23/5387 ,  H01M2/202 ,  H05K1/0283 ,  H05K1/09 ,  H05K1/14 ,  H05K2201/0314 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945 ,  H05K2201/10037

Abstract: The invention provides an electronic device that includes a first functional body, a second functional body, and at least one connection member connecting the first functional body to the second functional body. The at least one connection member has a spiral pattern, and is suspended in air to allow tor stretching, flexing or compressing.

公开(公告)号：US09706647B2

公开(公告)日：2017-07-11

申请号：US14276413

申请日：2014-05-13

Applicant: MC10, INC.

Inventor： Yung-Yu Hsu ,  John Work ,  Kevin J. Dowling

IPC: H05K1/02 ,  A61B5/00 ,  H01L23/538 ,  H05K1/18 ,  H01L23/14

CPC classification number: H05K1/0283 ,  A61B5/0059 ,  A61B5/6846 ,  A61B2562/164 ,  H01L23/145 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2924/15791 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.

公开(公告)号：US20160272132A1

公开(公告)日：2016-09-22

申请号：US15034446

申请日：2014-10-15

Applicant: SUMITOMO WIRING SYSTEMS, LTD. ,  AutoNetworks Technologies, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Yoshikazu HACHIYA

IPC: B60R16/03 ,  H02G3/08

CPC classification number: B60R16/03 ,  B60R16/0239 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K1/0265 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617 ,  H05K3/4626 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272

Abstract: Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box includes a bus bar circuit unit obtained by arranging a plurality of bus bars including a power source-side bus bar to be connected to a power source line and a ground-side bus bar to be connected to a ground line on insulated boards. In the electrical junction box, the power source-side bus bar and the ground-side bus bar are arranged adjacent to each other, and an oxide deposition inhibiting structure is provided in exposed portions of the insulated board exposed through a gap between the power source-side bus bar and the ground-side bus bar.

Abstract translation: 本发明提供一种具有新颖结构的电接线盒，其能够在不依赖于电接线盒的防水结构的情况下防止水渗透后的车辆起火。 电接线盒包括汇流条电路单元，其通过布置多个汇流条而获得，所述汇流条包括要连接到电源线的电源侧汇流条和要与绝缘的地线连接的接地侧汇流条 董事会 在电接线盒中，电源侧汇流条和接地侧汇流条彼此相邻布置，并且在绝缘板的暴露部分中设置氧化物沉积抑制结构，该绝缘板通过电源 旁边的巴士酒吧和地面侧的巴士吧。

公开(公告)号：US09173302B2

公开(公告)日：2015-10-27

申请号：US12439576

申请日：2007-05-28

Applicant: Takehiro Shimizu ,  Kaoru Okaniwa ,  Naoki Fukushima

Inventor： Takehiro Shimizu ,  Kaoru Okaniwa ,  Naoki Fukushima

IPC: H01L31/042 ,  H05K3/32 ,  H01L31/18 ,  H01L31/05

CPC classification number: H05K3/323 ,  H01L31/0512 ,  H01L31/18 ,  H05K2201/09945 ,  Y02E10/50 ,  Y10T428/25

Abstract: The conductive adhesive film of the invention is a conductive adhesive film for electrical connection between photovoltaic cell surface electrodes and wiring members, which comprises an insulating adhesive 2 and conductive particles 1 and has a (t/r) value in the range of 0.75-17.5, where r (μm) is the mean particle size of the conductive particles 1 and t (μm) is the thickness of the conductive adhesive film, wherein the content of the conductive particles 1 is 1.7-15.6 vol % based on the total volume of the conductive adhesive film.

Abstract translation: 本发明的导电性粘接膜是在光电池用表面电极与布线部件之间进行电连接的导电性粘合膜，其包含绝缘性粘合剂2和导电性粒子1，（t / r）的值在0.75〜17.5的范围内 ，其中r（μm）是导电粒子1的平均粒径，t（μm）是导电性粘接膜的厚度，导电性粒子1的含量相对于导电性粒子1的总体积为1.7〜15.6体积％ 导电胶膜。

公开(公告)号：US08638542B2

公开(公告)日：2014-01-28

申请号：US12833185

申请日：2010-07-09

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01G4/06 ,  H01G4/005 ,  H01G7/00

CPC classification number: H05K1/162 ,  H01G4/012 ,  H01G4/232 ,  H01G4/302 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09263 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09945

Abstract: A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.

Abstract translation: 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。