Abstract:
PURPOSE: A semiconductor optical device provided with a current confined structure is provided to secure the reliability by reducing the leakage current at the etched surface with filling an oxide layer or a nitride layer. CONSTITUTION: A semiconductor optical device provided with a current confined structure includes a semiconductor substrate(10), a first semiconductor layer(12), a second semiconductor layer(14), a third semiconductor layer(16). The first semiconductor layer(12) is formed on the semiconductor substrate(10) and made of at least one first conductive type of material. The second semiconductor layer(14) is formed on the first semiconductor layer(12) and is made of at least one material. The third semiconductor layer(16) is formed on the second semiconductor layer(16) and is made of at least one second conductive type of material which is opposite to the first conductive type. The first to third semiconductor layers(12,14,16) form the mesa structure, the side surface of at least one material layer constituting the first to third semiconductor layers(12,14,16) is recessed and the recessed portion is filled with oxide layer or a nitride layer, partially or totally.
Abstract:
PURPOSE: A method for fabricating an intracavity-contacted VCSEL including selective upper mirror layer growth is provided to simplify a heat emission path and a current injection path by using a selective region growth method. CONSTITUTION: A lower mirror layer(200), a laser resonance layer(300), a current injection hole forming layer, and an intracavity-contacted layer are sequentially grown on a substrate(100). An intracavity-contacted layer pattern(500) is formed by wet-etching the current injection hole forming layer. A mask pattern(600) is formed on the intracavity-contacted layer pattern(500). An upper mirror layer(250) is formed on an upper surface of the intracavity-contacted layer pattern(500). The first electrode(700) is formed on the intracavity-contacted layer pattern(500). The second electrode(750) is formed on a back surface of the substrate(100).
Abstract:
PURPOSE: A VCSEL(Vertical-Cavity Surface Emitting Laser) for long wavelength having a current caliber of an oxide layer is provided to minimize the loss of the current and the charges by using the InAlAs oxide layer for restraining the InAlAs current path layer. CONSTITUTION: An n-type lower mirror layer(120) and an active layer(130) are sequentially formed on an n-type InP substrate(110). The n-type lower mirror layer(120) satisfies a Bragg reflection condition. A current path layer(142) and a current limit layer(144) are formed on a part of the active layer(130). The current path layer(142) is surrounded by the current limit layer(144). A p-type internal resonance contact layer(150) is formed on the current path layer(142) and the current limit layer(144). An upper mirror layer(160) is formed on a part of the p-type internal resonance contact layer(150). A p-type electrode(170) is formed on the p-type internal resonance contact layer(150) and the upper mirror layer(160). An n-type electrode(180) is formed on a part of a back side of the n-type InP substrate(110).
Abstract:
PURPOSE: A vertical cavity surface emitting laser and a method of manufacturing the same are provided to minimize a generation of heat and to maximize a discharge of heat, which has a long wavelength and a thick inner resonance contact layer capable of realizing a current injection structure. CONSTITUTION: A lower mirror layer(5) is grown on a semiconductor substrate(6). An ion injection layer(8) is formed on a top of the lower mirror layer(5). An activated layer(3) is coated over the ion injection layer(8) of the mirror layer(5). An inner resonance contact layer(10) is covered on the activated layer(3). An undoped upper mirror layer(9) is formed on the inner resonance contact layer(10). The inner resonance contact layer(10) has a thermal conductivity of at least five times than that of the upper mirror layer(9) and a thickness of 0.7 times than that of the activated layer(3). An electrode(1) is coated on the upper mirror layer(9).
Abstract:
PURPOSE: A surface emitting laser for polarization control is provided to select oscillation light of polarized direction by controlling polarization without changing characteristic. CONSTITUTION: A surface emitting laser has a lower part mirror layer(32), resonance activity layer, upper part mirror layer(36). An insulation layer(37) gets inserted impurities-ion or fills up resonance activity layer after etching. The first upper part metal layer(38) gets supplied with current for lasering and is formed on the upper part mirror layer(36). The second upper part metal layer controls polarization to each vertical direction about the semiconductor board(31) with isolating the first upper part metal layer(38) from the insulating layer(37). The first lower part metal layer(41a) gets supplied with lasering current with the first upper part metal layer(38) at the same time and is formed on bottom of the semiconductor board(31). The second lower part metal layer(41b) gets supplied with polarization control current at the same time with the second upper part metal layer, keeping the fixed intervals with the first lower part metal layer(41a) on bottom of the semiconductor board(31).
Abstract:
PURPOSE: Photoelectric devices using negative resistance diodes are provided to perform a function of an all-optical oscillator by tying two diodes with a direct metal line without an external electrical source, and to exchange an electro-optical signal and to process a wire/wireless signal by exchanging a binary optical signal, modulating optical input with regular intensity and an electro-circuit self vibrating signal from the negative resistance of an optical composition as an electro-optical oscillator. CONSTITUTION: Photoelectronic devices using diodes in negative resistance comprises a semi-insulation compound semiconductor substrate(10), a semiconductor mirror(20), two-Positive Intrinsic Negative(PIN) diodes. The semiconductor mirror has a hetero semiconductor layer which is repeatedly stacked thereon to raise optical-absorption of an optical PIN diode on the substrate. Opposite polarity of the two PIN diodes is formed in parallel for an external electrical source on the same area of the semiconductor mirror. The PIN diodes induce N-shaped negative resistance characteristics by two exposure beams from outside, and output the exposure beams as optical-modulation which reversed the exposure beams by an electric vibrating signal, which the external electrical source is applied and induced when inducing the negative resistance characteristics.
Abstract:
본 발명은 다중양자우물구조 PIN다이오드를 이용한 광-유기 전기-광학 오실레이터에 관한 것으로서, 전기-광흡수(electro-absorption)를 갖는 반도체 다중양자우물(multiple quantum well) 구조를 중간층(intrinsic layer)으로 하는 반도체 PIN다이오드에서 광 흡수에 의한 광전류-전압(photocurrent-voltage)의 부저항(negative resistance) 특성을 이용하며, 이 다이오드구조에 강한 연속 레이져 빔(continuous laser beam)을 조사하여 다이오드의 부저항특성을 크게 증가시키므로써 발생된 다이오드의 광전류-전압의 부저항 지역에 정전압 (dc voltage)을 인가하여 다이오드의 진동(oscillation)을 유발시켜 전기적 교류 신호(electrical ac-signal) 및 다이오드의 진동에의해 연속-조사빔의 변조-광신호(modulated optical signal) 발생을 유발 시킨다. 이러한 본 발명에서는 전기-광흡수를 갖는 다중양자우물 구조를 PIN다이오드의 중간층으로 이용하여 고출력의 전기적 교류 신호 뿐만 아니라 변조- 광신호를 생성할 수 있으며, PIN 다이오드 및 구성 회로요소(electrical elements)들의 조절로 전기적 교류 신호의 주파수 및 신호 진폭(amplitude)을 조절할 수 있으며, 다중양자우물 구조의 조절로 변조광신호의 신호 주파수 및 변조신호의 크기차(signal difference) 및 명암비(extinction ratio)를 조절할 수 있어, 고출력 고주파수의 전기 및 광 신호를 생성할 수 있다.
Abstract:
본 발명은 공명 투과 광전소자를 이용한 다중 피크 발생 방법에 관한 것으로, 특히 이중장벽 구조를 갖는 공명 투과 소자의 측면에 간격층의 밴드 갭보다 큰 에너지의 빛을 조사함으로써, 공명 투과 조건이 이중장벽 구조의 일부분만 변조되어 다중 피크 특성이 나타나도록 하는 방법에 관한 것이다. 본 발명에서는 공명 투과 소자의 측면에서 광원을 조사하여, 공명 투과 소자에 흐르는 전류가 빛이 흡수된 영역과 빛이 흡수되지 않은 영역이 병렬로 연결된 것과 같은 특성을 보이도록 함으로써 다중 피크 특성이 발생하게 하는 방법을 제시한다. 본 발명에 의한 측면 수광 공명 투과 소자는 간격층에 직접 빛이 조사되므로 약한 광 신호에서도 전기적 신호의 변조가 가능하게 된다.
Abstract:
본 발명은 외부전원 인가없이도 광 쌍안정을 크게 증가시켜 일반적인 역방향 전압을 필요로 하는 광 논리소자에서의 문제점을 제거할 수 있는 AFP ESQW S-SEED(AE-SEED)또는 AFP ACQW SEED(AA-SEED)등의 무전압 광 쌍안정 논리장치의 제작을 매우 간결하면서도 효율적으로 할수 있는 소자구조(lay-out)를 제시하였다. 종래의 S-SEED및 2차원 배열은 전압인가를 위하여 따로 금속선과 금속패드를 필요로 하였다. 그러나 충분히 큰 무전압 광 쌍안정이 가능한 AE-SEED또는 AA-SEED및 그들의 2차원 배열에서는 무전안 광 쌍안정 S-SEED를 구성하는 데에 필요한 금속선 연결을 제외한 일반적인 구조에서 필요로 하는 나머지 금속선과 금속패드를 제거하고 쉽게 제작될 수 있다는 것을 본 발명은 보이고 있다. 이러한 구조를 더욱 효율적으로 하기 위해서 본 발명에서 제시하는 구도는 두개의 PIN 다이오드 SEED를 서로 반대방향으로 마주보게 하여 각 SEED의 p-층과 n-층의 거리를 극소화하여 2차원 배열의 집적도를 증가시킬 수 있고,불필요한 수동요소를 극소화시킨 구조도 포함되어 있다.