公开(公告)号：DE102008039388A1

公开(公告)日：2009-04-16

申请号：DE102008039388

申请日：2008-08-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PRESSEL KLAUS ,  BEER GOTTFRIED

IPC: H01L21/50 ,  H01L21/98 ,  H01L23/14 ,  H01L25/04

Abstract: Stacked semiconductor chips are disclosed. One embodiment provides an array of first semiconductor chips, covering the array of the first semiconductor chips with a mold material, and placing an array of second semiconductor chips over the array of the first semiconductor chips. The thicknesses of the second semiconductor chips is reduced. The array of the first semiconductor chips are singulated by dividing the mold material.

公开(公告)号：DE102008045735A1

公开(公告)日：2009-04-09

申请号：DE102008045735

申请日：2008-09-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  SEZI RECAI ,  MEYER THORSTEN ,  BEER GOTTFRIED

IPC: H01L25/04 ,  H01L21/58 ,  H01L21/98 ,  H01L23/14

Abstract: Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

公开(公告)号：DE102006005419A1

公开(公告)日：2007-08-16

申请号：DE102006005419

申请日：2006-02-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  BEER GOTTFRIED

IPC: H01L23/055 ,  B81B7/02 ,  B81C1/00 ,  H01L21/50 ,  H01L23/50 ,  H03H3/007

Abstract: A semiconductor component comprises active semiconductor chip(s) (3) with a microelectromechanical structure (4) and a wiring structure on its top side (6); walls (7, 8, 9) of at least one cavity (10, 11) surrounding the structure; and a cavity covering arranged on the walls. The walls include a photolithographically patterned polymer and the covering includes a polymer layer (13) of identical type. Molecular chains of the polymer of the walls are crosslinked together with molecular chains of the polymer layer of the covering to form a dimensionally stable cavity housing (15). An independent claim is included for a method for producing semiconductor components.

公开(公告)号：DE102006023123A1

公开(公告)日：2007-01-11

申请号：DE102006023123

申请日：2006-05-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  SIMBUERGER WERNER ,  KIENMAYER CHRISTOPH ,  PRESSEL KLAUS

IPC: H01L25/04 ,  G01S7/03 ,  H01L23/36 ,  H01L23/498 ,  H01L23/66 ,  H01L49/02 ,  H01P3/08 ,  H01P11/00 ,  H01Q1/38

Abstract: A semiconductor module with components (6) for high-frequency operation in a plastic housing comprises a main surface (8) on top of a housing mass (10) and at least one active side (11) of a semiconductor chip with a multilayer connection rail structure (13) on the main surface comprising alternating insulation (16,17) and structured metal (14,15) layers. At least one of the insulation and/or housing mass comprises a highest frequency isolation region. Independent claims are also included for the following: (A) A module as above having a cooling body; (B) Production processes for the modules as above; (C) Distance-determining radar for a motor vehicle; (D) Satellite navigation apparatus; (E) A transponder;and (F) A motor vehicle comprising the above.

公开(公告)号：DE102005055488A1

公开(公告)日：2007-01-04

申请号：DE102005055488

申请日：2005-11-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRUNNBAUER MARKUS ,  POHL JENS ,  BEER GOTTFRIED ,  ESCHER-POEPPEL IRMGARD

IPC: H01L23/50 ,  B23K1/00 ,  B23K31/02 ,  H01L21/60 ,  H05K3/34

Abstract: An electronic structure comprises at least two components interconnected by a multiply discrete solder structure having solder columns (5) comprising a core (14) of lead-free solder and a lead-free covering material (7). The second, covering, material has a higher melting temperature than the first, core, material. An independent claim is also included for a production process for the above structure.

公开(公告)号：DE102005006280A1

公开(公告)日：2006-08-24

申请号：DE102005006280

申请日：2005-02-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： POHL JENS ,  BEER GOTTFRIED

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/08 ,  H01L23/12

公开(公告)号：DE10160508B4

公开(公告)日：2005-02-17

申请号：DE10160508

申请日：2001-11-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  ALTHAUS HANS-LUDWIG ,  DAECHE FRANK

IPC: G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H01L31/0232 ,  G02B6/12

公开(公告)号：DE10160508A1

公开(公告)日：2003-06-12

申请号：DE10160508

申请日：2001-11-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  ALTHAUS HANS-LUDWIG ,  DAECHE FRANK

IPC: G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H01L31/0232 ,  G02B6/12

Abstract: The arrangement has a planar light circuit (PLC) provided on a carrier (1) and has at least one optical channel (2). The optical signals are deviated between a transmission and/or reception unit (5) and an allocated optical channel of the light circuit using a prism (3). The circuit is provided on top of the carrier and the transmission and/or reception unit is provided on the bottom side (1b) of the carrier, adjacent to the carrier or below the carrier.

公开(公告)号：DE10142472A1

公开(公告)日：2002-10-31

申请号：DE10142472

申请日：2001-08-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED

IPC: C09D5/25 ,  H01B3/12 ,  H01L23/28 ,  H01L23/492 ,  H01L23/495 ,  H01L23/60 ,  H05K1/02 ,  H05K3/30

Abstract: Electronic high voltage and power component comprises external contact pins (2) and/or external contact lug (3) protruding from a housing (4). The housing, the contact pins and the contact lug are partially surrounded by a heat conducting high voltage insulating and tracking voltage protective layer based on an organic ceramic. An Independent claim is also included for an electronic high voltage and power component.

公开(公告)号：DE10042839A1

公开(公告)日：2002-04-04

申请号：DE10042839

申请日：2000-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  SPITZLSPERGER WOLFGANG

IPC: H01L23/373 ,  H01L23/433 ,  H01L23/36 ,  H01L23/50 ,  H01L21/58 ,  H01L21/60

Abstract: The chip(s) (12-14) are arranged on a system substrate (2) with metallic track conductors (3). The substrate is located on a metal section (4) forming a heat sink (5). Its outer surface is exposed to the surrounding atmosphere (7). Its inner surface (8) supports the substrate. The inner surface of the metal section is electrically insulated from the tracks of the substrate by a metal oxide bonding layer. An Independent claim is included for the method of manufacture. The heat sink is oxidized, and the substrate is bonded to it. Chips are fixed to the substrate and bonded using wire or ball-grid array technology. The result is encapsulated, leaving the heat sink areas clear.