公开(公告)号：EP1333079A1

公开(公告)日：2003-08-06

申请号：EP03075164.8

申请日：2003-01-17

Applicant: Delphi Technologies, Inc.

Inventor： Chaudhuri, Arun K. ,  Stepniak, Frank ,  Walsh, Matthew R.

IPC: C09J9/02 ,  C09J163/00 ,  C08K3/08 ,  C08K9/02

CPC classification number: H05K3/321 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H05K3/3489 ,  H05K2201/0218 ,  H05K2203/0425

Abstract: A conductive adhesive material (12) characterized by metallurgical bonds (24) between electrically-conductive particles (20) dispersed in a polymer matrix (22) of the material (12). The polymer matrix (22) has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles (20). At least the outer surfaces of the particles (20) are formed of a fusible material, so that sufficiently heating the conductive adhesive material (12) will reduce metal oxides on the particles (20), and at least partially melt the fusible metal, enabling the particles (20) to metallurgically bond to each other and to metal surfaces (14,16,44,46,54,56) contacted by the adhesive material (12).

Abstract translation: 导电粘合剂材料（12），其特征在于分散在材料（12）的聚合物基体（22）中的导电颗粒（20）之间的冶金结合（24）。 聚合物基体（22）在加热时具有助熔能力，以减少颗粒（20）表面上的金属氧化物。 至少颗粒（20）的外表面由易熔材料形成，使得充分加热导电粘合剂材料（12）将减少颗粒（20）上的金属氧化物，并且至少部分地熔化可熔金属，使得能够 所述颗粒（20）彼此冶金地结合并与由所述粘合剂材料（12）接触的金属表面（14,16,44,46,54,56）。

公开(公告)号：EP0666705A3

公开(公告)日：1996-01-03

申请号：EP95101023.0

申请日：1995-01-26

Applicant: MOLEX INCORPORATED

Inventor： Fuerst, Robert M. ,  Krehbiel, Fred Love ,  Krebaum, Paul

IPC: H05K5/02 ,  H01R13/648

CPC classification number: H05K3/326 ,  H01R4/04 ,  H01R13/7195 ,  H05K1/0215 ,  H05K1/09 ,  H05K1/118 ,  H05K3/306 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/1059 ,  H05K2203/0425

Abstract: An electrical connector assembly (10) includes a housing (26) fabricated of a first metal material and having at least one integral pin (36) projecting from a face (34) thereof. A flat flexible circuit (20) is mounted against the face of the housing and includes a ground plane (44) on a side thereof facing the housing. The circuit has a hole (40) for receiving the integral pin (36) of the housing. The ground plane (44) is of a second metal material different from that of the housing. An omni-directional conductive adhesive (46) is deposited on the ground plane (44) over the area of the hole to expand the conductive interface between the metal housing (26) and the metal ground plane (44). Preferably, the conductive adhesive (46) includes abrasive grain-like particles.

Abstract translation: 电连接器组件（10）包括由第一金属材料制成并具有从其面（34）突出的至少一个整体销（36）的壳体（26）。 平面柔性电路（20）安装在壳体的表面上，并在其面向壳体的一侧包括接地平面（44）。 电路具有用于接收壳体的整体销（36）的孔（40）。 接地平面（44）是与壳体不同的第二金属材料。 在所述孔的区域上的接地平面（44）上沉积全向导电粘合剂（46），以使金属壳体（26）和金属接地平面（44）之间的导电界面膨胀。 优选地，导电粘合剂（46）包括磨粒状颗粒。

公开(公告)号：EP0685879A1

公开(公告)日：1995-12-06

申请号：EP95303495.6

申请日：1995-05-24

Applicant: AT&T Corp.

Inventor： Jin, Sungho ,  McCormack, Mark Thomas

IPC: H01L21/48 ,  H01L21/60

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05147 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0425 ,  H05K2203/0528 ,  H05K2203/104 ,  Y10T156/1089 ,  Y10T156/1093 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with the invention, an electronic device (9) having one or more contact pads (12) is placed in contact with a carrier sheet (21) bearing an array of transferable solder particles. Heat is applied to adhere the solder to the contact pads, and solder is selectively transferred onto the contact pads. In a preferred embodiment the solder-carrying medium comprises elastomeric material and the solder particles comprise solder-coated magnetic particles. Application of a magnetic field while the elastomer is curing produces a regular array of solder coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract translation: 在雅舞蹈通过本发明，给电子设备（9），其具有一个或多个接触垫（12）在与支承在转让焊料颗粒的阵列的载体片（21）接触放置。 热量被施加到焊料粘附到接触焊盘和焊料选择性地转移到接触焊盘。 在优选实施例的焊料承载介质包括弹性体材料和所述焊料粒子包括焊料涂覆的磁性粒子。 的磁场，而弹性体固化的应用程序生成的焊料涂覆的颗粒的规则阵列。 使用这种方法，具有比常规的接触结构更小的设备可以很容易地相互连接。

公开(公告)号：EP0641153A1

公开(公告)日：1995-03-01

申请号：EP94306220.8

申请日：1994-08-23

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Iannetta, Roger A., Jr.

IPC: H05K3/10 ,  H05K3/32 ,  H01L21/60

CPC classification number: H01L24/83 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H01R4/04 ,  H05K1/095 ,  H05K1/181 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/28 ,  H05K3/321 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith comprises forming three dimensional, essentially square channels (14) interspersed with lands within a dielectric material (12) on a substrate (10). The channels are then filled in one pass with a curable polymeric material (16) containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components (20) are placed to engage the conductive material. The curable material is then cured after placing the electronic component(s).

Abstract translation: 一种制造平面的方法，具有包括形成在基底（10）上的介电材料（12）内与土地穿插三维的，实质上方形通道（14）组装有至少一个电子电路元件地下电子电路。 然后，信道被填充在一个道次与含有导电性金属填料的可固化聚合物材料（16）所以没有由该导电材料形成的电路迹线的上表面是在基本上相同的水平为土地的上表面上。 电路部件（20）被放置成接合导电材料。 然后，将可固化材料放置电子元件（一个或多个）之后固化。

公开(公告)号：EP0605689A1

公开(公告)日：1994-07-13

申请号：EP93914917.0

申请日：1993-07-12

Applicant: CENTRAL RESEARCH LABORATORIES LIMITED

Inventor： NAYLOR, Malcolm

IPC: H01R4 ,  H05K3

CPC classification number: H05K3/323 ,  H01L2224/29499 ,  H01L2924/01079 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/0218 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0281 ,  H05K2201/0323

Abstract: L'invention concerne un procédé de formation d'une connexion électrique anisotrope entre des éléments conducteurs (22, 24) possédant une couche d'oxyde (28). Le procédé consiste à utiliser un adhésif (30) comportant des fibres de carbone (32) et des particules métalliques (34). Lorsqu'on applique une pression, les fibres de carbone (32) pénètrent dans la couche d'oxyde (28), tandis que les particules métalliques (34) se déforment de telle façon qu'une bonne connexion électrique se fasse entre les éléments de recouvrement (22, 24).

公开(公告)号：US11647583B2

公开(公告)日：2023-05-09

申请号：US16095120

申请日：2017-04-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shimpei Obata ,  Ryuuji Takahashi ,  Yasunori Hoshino ,  Shigetoshi Fujita

IPC: H05K1/03 ,  B32B15/08 ,  B32B5/28 ,  C08J5/10 ,  C08J5/24 ,  H01L23/498 ,  H05K1/02

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/08 ,  C08J5/10 ,  C08J5/244 ,  H01L23/49894 ,  H05K1/0271 ,  H05K1/03 ,  H05K1/0366 ,  B32B2262/101 ,  B32B2457/08 ,  C08J2361/06 ,  C08J2361/08 ,  C08J2363/00 ,  C08J2379/08 ,  C08J2425/12 ,  C08J2433/00 ,  C08J2433/04 ,  C08J2433/12 ,  C08J2433/20 ,  C08J2461/06 ,  C08J2461/08 ,  C08J2463/00 ,  C08J2475/00 ,  C08J2479/08 ,  C08J2483/04 ,  H05K2201/0218 ,  H05K2201/0227

Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.

公开(公告)号：US20170232510A1

公开(公告)日：2017-08-17

申请号：US15501880

申请日：2015-08-21

Applicant: Dowa Electronics Materials Co., Ltd.

Inventor： Noriaki Nogami ,  Hiroshi Kamiga

IPC: B22F1/02 ,  C25D3/48 ,  C25D5/34 ,  C25D7/00 ,  H01L31/0224 ,  C23C18/16 ,  B05D3/02 ,  B05D1/26 ,  B05D7/00 ,  B22F1/00 ,  C23C18/44

CPC classification number: B22F1/025 ,  B05D1/26 ,  B05D3/0254 ,  B05D7/00 ,  B22F1/0014 ,  B22F1/0059 ,  B22F2301/10 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2303/01 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  C09D11/037 ,  C09D11/52 ,  C22C1/0425 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1653 ,  C23C18/44 ,  C23C18/54 ,  C25D3/48 ,  C25D5/34 ,  C25D7/00 ,  H01L31/022425 ,  H01L31/068 ,  H05K1/095 ,  H05K3/4007 ,  H05K2201/0218 ,  Y02E10/547 ,  B22F9/082 ,  C22C5/00 ,  B22F9/24

Abstract: There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.

公开(公告)号：US20160368105A1

公开(公告)日：2016-12-22

申请号：US15034194

申请日：2014-11-04

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Takahiro Hattori ,  Daisuke Soma ,  Takahiro Roppongi ,  Isamu Sato

IPC: B23K35/30 ,  C22C9/00 ,  C22C13/00 ,  B23K35/02 ,  B23K35/26

CPC classification number: B23K35/302 ,  B22F1/00 ,  B22F1/0048 ,  B22F1/025 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  C22C1/0483 ,  C22C9/00 ,  C22C13/00 ,  C23C28/021 ,  C25D3/60 ,  C25D7/00 ,  H01L23/556 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11825 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/13411 ,  H01L2224/13455 ,  H01L2224/13457 ,  H01L2224/13561 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/81024 ,  H01L2224/81048 ,  H01L2224/81075 ,  H01L2224/81211 ,  H01L2224/81395 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/3463 ,  H05K2201/0218 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01026 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01048 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01044 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01092 ,  H01L2924/0109 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/00012 ,  H01L2924/013

Abstract: Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

Abstract translation: 提供了一种Cu芯球和cu型核心柱，其实现了对热循环的降低强度和强度。 Cu芯球（1）包含由Cu或Cu合金制成的Cu球（2）和由Sn和Cu组成的焊料合金制成并覆盖Cu球（2）的焊料层（3）。 焊料层（3）含有不少于0.1％至不超过3.0％的Cu，其余由Sn和杂质构成。

公开(公告)号：US20160316554A1

公开(公告)日：2016-10-27

申请号：US15075064

申请日：2016-03-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： ARATA KISHI ,  TADASHI MAEDA ,  TADAHIKO SAKAI

IPC: H05K1/02 ,  B23K35/26 ,  H05K1/11 ,  B23K35/362 ,  H05K1/14 ,  B23K1/00 ,  B23K35/36

CPC classification number: H05K1/0274 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/362 ,  H01R12/714 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K1/11 ,  H05K1/111 ,  H05K1/14 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Abstract translation: 电路构件的连接结构包括第一电路构件，第二电路构件和接头部分。 第一电路部件具有设置有透光性电极的第一主面。 第二电路部件具有设置有金属电极的第二主面。 接头部分介于第一主表面和第二主表面之间。 接头部分包括树脂部分和焊料部分。 焊料部分电连接透光电极和金属电极。 透光电极含有包含铟和锡的氧化物，焊料部分含有铋和铟。

公开(公告)号：US20160108266A1

公开(公告)日：2016-04-21

申请号：US14514463

申请日：2014-10-15

Applicant: Karen M. Kosydar ,  Gary L. Slater ,  Mary Christine Brick ,  Christine Joanne Landry-Coltrain ,  James Albert Reczek

Inventor： Karen M. Kosydar ,  Gary L. Slater ,  Mary Christine Brick ,  Christine Joanne Landry-Coltrain ,  James Albert Reczek

IPC: C09D11/38 ,  C09D133/14 ,  C09D179/04 ,  C09D179/08 ,  C09D179/02

CPC classification number: C09D11/38 ,  C08K9/02 ,  C09D4/00 ,  C09D11/037 ,  C09D11/10 ,  C09D11/101 ,  C09D11/52 ,  C09D133/14 ,  C09D179/02 ,  C09D179/04 ,  C09D179/08 ,  H05K1/095 ,  H05K3/185 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2203/0709 ,  C08F222/10

Abstract: A non-aqueous composition contains dispersed carbon-coated metal particles in an organic diluent in an amount of at least 10 weight %. The dispersed carbon-coated metal particles have a median diameter equal to or less than 0.6 μm, and are dispersed using a particle dispersing agent that has a weight average molecular weight (Mw) of at least 2,000 and up to and including 100,000 and comprises nitrogen-containing units. The median diameter of the dispersed particles is determined using a dynamic light scattering method. Moreover, when the non-aqueous composition contains up to and including 25 weight % of the dispersed carbon-coated metal particles, it exhibits no visual settling when subjected to a settling test of at least 24 hours at 20° C. Such non-aqueous compositions can include photocurable components and are useful to prepare photocurable and photocured electrically-conductive patterns and layers in various articles, including touch screen devices having touch screen displays.

Abstract translation: 非水性组合物在有机稀释剂中含有至少10重量％的分散的碳涂覆的金属颗粒。 分散的碳涂覆的金属颗粒的中值直径等于或小于0.6μm，并且使用重均分子量（Mw）至少为2,000且至多并包括100,000的颗粒分散剂分散，并且包含氮 包含单位。 使用动态光散射法测定分散颗粒的中值粒径。 此外，当非水性组合物含有至多且包含25重量％的分散的碳涂覆的金属颗粒时，当在20℃进行至少24小时的沉降试验时，其表现出没有视觉沉降。这种非水性 组合物可以包括光固化组分，并且可用于制备各种制品中的光固化和光固化导电图案和层，包括具有触摸屏显示器的触摸屏装置。