公开(公告)号：US20160262262A1

公开(公告)日：2016-09-08

申请号：US15134624

申请日：2016-04-21

Applicant: Lockheed Martin Corporation

Inventor： David G. Findley

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  C04B35/524 ,  G02B6/32 ,  G02B6/138 ,  B28B1/00 ,  C04B35/626 ,  H05K1/02 ,  G02B6/122

CPC classification number: H05K1/0306 ,  B28B1/001 ,  B29C64/165 ,  B32B18/00 ,  B33Y10/00 ,  B33Y80/00 ,  C04B35/522 ,  C04B35/524 ,  C04B35/532 ,  C04B35/5626 ,  C04B35/565 ,  C04B35/571 ,  C04B35/583 ,  C04B35/62645 ,  C04B35/65 ,  C04B35/806 ,  C04B2235/3826 ,  C04B2235/404 ,  C04B2235/427 ,  C04B2235/48 ,  C04B2235/483 ,  C04B2235/5288 ,  C04B2235/5292 ,  C04B2235/5454 ,  C04B2235/6026 ,  C04B2235/80 ,  C04B2235/94 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/68 ,  G02B6/12002 ,  G02B6/132 ,  G02B6/32 ,  G02B6/4204 ,  G02B2006/12035 ,  G02B2006/12135 ,  G02B2006/1219 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/162 ,  H05K2201/0323 ,  H05K2201/037 ,  H05K2201/064

Abstract: According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer. A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline silicon carbide surrounded by polycrystalline diamond. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne).

Abstract translation: 根据一些实施例，一种装置包括由多晶金刚石制成的电路板。 电路板由预陶瓷聚合物的层的热分解形成。 在电路板内形成多个管，并且在电路板的一个或多个表面上包括多个终端。 每个管包括可操作以允许每个管传导电流的石墨烯层。 每层石墨烯通过多晶金刚石电路板在大于或等于900摄氏度的温度下进行热解来形成。 该装置还包括形成在电路板内的多个光波导。 每个光波导包括由多晶金刚石包围的多晶碳化硅芯。 多晶金刚石通过聚（氢化碳炔）的热分解形成，并且碳化硅通过聚（甲基甲硅烷基）的热分解形成。

公开(公告)号：US20150301281A1

公开(公告)日：2015-10-22

申请号：US14258477

申请日：2014-04-22

Applicant: David G. Findley

Inventor： David G. Findley

IPC: G02B6/122 ,  H05K1/02 ,  G02B6/138 ,  H05K1/18 ,  G02B6/132 ,  B29C67/00 ,  H05K1/09

CPC classification number: G02B6/132 ,  B28B1/001 ,  B29C64/165 ,  B29K2083/00 ,  B29L2009/005 ,  B33Y10/00 ,  B33Y80/00 ,  G02B6/12004 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/162 ,  H05K1/185 ,  H05K3/4667 ,  H05K2201/0323 ,  H05K2201/037 ,  H05K2201/064 ,  H05K2201/10015

Abstract: According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer. A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline diamond surrounded by silicon carbide. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne).

Abstract translation: 根据一些实施例，一种装置包括由多晶金刚石制成的电路板。 电路板由预陶瓷聚合物的层的热分解形成。 在电路板内形成多个管，并且在电路板的一个或多个表面上包括多个终端。 每个管包括可操作以允许每个管传导电流的石墨烯层。 每层石墨烯通过多晶金刚石电路板在大于或等于900摄氏度的温度下进行热解来形成。 该装置还包括形成在电路板内的多个光波导。 每个光波导包括由碳化硅包围的多晶金刚石核心。 多晶金刚石通过聚（氢化碳炔）的热分解形成，并且碳化硅通过聚（甲基甲硅烷基）的热分解形成。

公开(公告)号：US20150215042A1

公开(公告)日：2015-07-30

申请号：US14379998

申请日：2012-02-24

Applicant: Daniel Guidotti ,  Qidong Wang ,  Fujiang Lin ,  Guang Zhu

Inventor： Daniel Guidotti ,  Qidong Wang ,  Fujiang Lin ,  Guang Zhu

IPC: H04B10/25 ,  H04B10/00

CPC classification number: H04B10/2503 ,  H04B10/12 ,  H04B10/90 ,  H05K1/0218 ,  H05K1/0239 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/10098

Abstract: The present disclosure provides a millimeter-wave waveguide communication system. The millimeter-wave waveguide communication system may comprise: a clock component, and at least two sets of millimeter-wave receiving/transmitting channels. The clock component is configured to provide a clock signal to sending ends and receiving ends of the two sets of millimeter-wave receiving/sending channels respectively. Each set of millimeter-wave receiving/sending channels comprises: a transmitter component, a receiver component and a transmission waveguide. The transmission waveguide is located between the transmitter component and the receiver component and is configured to provide a channel for millimeter-wave transmission. The top face, side face and/or bottom face of the transmission waveguide, except for active devices and accessories thereof, are plated with a metal conductive wall to form an electromagnetic shield from a transmission waveguide in an adjacent millimeter-wave receiving/sending channel. The metal conductive wall can minimize the crosstalk between the channels during high-speed communications, thereby improving data bandwidth and data throughput of the millimeter-wave communication system.

Abstract translation: 本公开提供了一种毫米波波导通信系统。 毫米波波导通信系统可以包括：时钟分量和至少两组毫米波接收/发送信道。 时钟分量被配置为提供时钟信号以分别发送两组毫米波接收/发送信道的端点和接收端。 每组毫米波接收/发送通道包括：发射器部件，接收器部件和传输波导。 传输波导位于发射器部件和接收器部件之间，并且被配置为提供用于毫米波传输的通道。 除了有源器件及其附件之外，传输波导的顶面，侧面和/或底面镀有金属导电壁，以在相邻毫米波接收/发送通道中的传输波导形成电磁屏蔽 。 金属导电壁可以在高速通信期间最小化通道之间的串扰，从而提高毫米波通信系统的数据带宽和数据吞吐量。

公开(公告)号：US20150201500A1

公开(公告)日：2015-07-16

申请号：US14169169

申请日：2014-01-31

Applicant: Zohar SHINAR ,  Joel VIDAL

Inventor： Zohar SHINAR ,  Joel VIDAL

IPC: H05K3/12 ,  B29C67/00

CPC classification number: H05K3/125 ,  B29C64/112 ,  B29C64/135 ,  B29C64/386 ,  B29C70/882 ,  B29K2105/0058 ,  B29K2995/0005 ,  B29K2995/0007 ,  B29L2031/3406 ,  B29L2031/3425 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  H05K1/0206 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/0268 ,  H05K1/0269 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/165 ,  H05K1/167 ,  H05K1/186 ,  H05K3/0005 ,  H05K3/1283 ,  H05K3/225 ,  H05K3/284 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/4664 ,  H05K3/4685 ,  H05K3/4688 ,  H05K2201/0367 ,  H05K2201/037 ,  H05K2201/0391 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/098 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2201/09872 ,  H05K2201/10098 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/163 ,  H05K2203/166

Abstract: Device, system, and method of three-dimensional printing. A device includes: a first 3D-printing head to selectively discharge conductive 3D-printing material; a second 3D-printing head to selectively discharge insulating 3D-printing material; and a processor to control operations of the first and second 3D-printing heads based on a computer-aided design (CAD) scheme describing a printed circuit board (PCB) intended for 3D-printing. A 3D-printer device utilizes 3D-printing methods, in order to 3D-print: (a) a functional multi-layer PCB; or (b) a functional stand-alone electric component; or (c) a functional PCB having an embedded or integrated electric component, both of them 3D-printed in a unified 3D-printing process.

Abstract translation: 三维打印的设备，系统和方法。 一种装置包括：第一3D打印头，用于选择性地排放导电3D打印材料; 第二3D打印头，用于选择性地放电绝缘3D打印材料; 以及基于描述用于3D打印的印刷电路板（PCB）的计算机辅助设计（CAD）方案来控制第一和第二3D打印头的操作的处理器。 3D打印机设备利用3D打印方法，以便3D打印：（a）功能性多层PCB; 或（b）功能独立电气部件; 或（c）具有嵌入或集成电气部件的功能PCB，它们都以统一的3D打印过程3D打印。

公开(公告)号：US20120248587A1

公开(公告)日：2012-10-04

申请号：US13319078

申请日：2010-04-22

Applicant: Pierre-Franck Alleaume ,  Claude Toussain

Inventor： Pierre-Franck Alleaume ,  Claude Toussain

IPC: H01L23/522

CPC classification number: H01P5/028 ,  H01L23/047 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01P5/107 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/09072 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A miniature component includes an MMIC microwave chip encapsulated in an individual package for surface-mounting capable of operating at a frequency F0 very much higher than 45 GHz; and at least one contactless microwave port, by electromagnetic coupling, ensuring the transmission of coupling signals at a working frequency F0. The component comprises a passive multilayer integrated circuit having metallized layers and layers of dielectric material, a top face, a metallized bottom face, the metallized bottom face comprising, on the side of the contactless microwave port, an opening in the metallization for the passage of the coupling electromagnetic waves via the contactless microwave port and, between two layers of dielectric material, a metallized layer having at least one electromagnetic coupling electrical conductor connected to the electronic elements of the chip, said coupling electrical conductor being situated at the level of the contactless microwave port to ensure the transmission of microwave signals by electromagnetic coupling at the working frequency F0.

Abstract translation: 微型组件包括封装在单个封装中的用于表面安装的MMIC微波芯片，其能够以非常高于45GHz的频率F0工作; 和至少一个非接触微波端口，通过电磁耦合，确保在工作频率F0下传输耦合信号。 该组件包括具有金属化层和电介质材料层的无源多层集成电路，顶面，金属化底面，金属化底面包括在非接触式微波端口侧的金属化中的开口，用于通过 经由非接触微波端口的耦合电磁波和在两层电介质材料之间的金属化层，其具有连接到芯片的电子元件的至少一个电磁耦合电导体，所述耦合电导体位于非接触式 微波端口，确保工作频率F0通过电磁耦合传输微波信号。

公开(公告)号：US20090085200A1

公开(公告)日：2009-04-02

申请号：US11864803

申请日：2007-09-28

Applicant: Raviprakash Nagaraj

Inventor： Raviprakash Nagaraj

IPC: H01L23/34

CPC classification number: H01L23/66 ,  H01L23/585 ,  H01L24/17 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/13099 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0222 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/10734 ,  H01L2924/00

Abstract: In some embodiments an integrated circuit package includes a coaxial arrangement of one or more ground via surrounding a signal via. The one or more ground via and the signal via extend through the package to allow transmission of signals between an integrated circuit and a board. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，集成电路封装包括围绕信号通孔的一个或多个接地通路的同轴布置。 一个或多个接地通孔和信号通孔延伸穿过封装，以允许集成电路和电路板之间的信号传输。 描述和要求保护其他实施例。

公开(公告)号：US20090080832A1

公开(公告)日：2009-03-26

申请号：US12313320

申请日：2008-11-18

Applicant: Bryce D. Horine ,  Gary A. Brist ,  Stephen H. Hall

Inventor： Bryce D. Horine ,  Gary A. Brist ,  Stephen H. Hall

IPC: G02B6/12 ,  B29C65/48 ,  G02B6/10

CPC classification number: H05K1/024 ,  H01P3/121 ,  H01P11/002 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981 ,  Y10T156/1002

Abstract: In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of a quasi-waveguide, and printed circuit board material is laminated to the plated channel using thermoset adhesive. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成准波导的至少两个侧壁，并且使用热固性粘合剂将印刷电路板材料层压到电镀通道上。 描述和要求保护其他实施例。

公开(公告)号：US07480435B2

公开(公告)日：2009-01-20

申请号：US11322601

申请日：2005-12-30

Applicant: Gary A. Brist ,  Bryce D. Horine ,  Stephen H. Stephen

Inventor： Gary A. Brist ,  Bryce D. Horine ,  Stephen H. Stephen

IPC: G02B6/10

CPC classification number: H05K1/024 ,  H01P3/121 ,  H01P11/002 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981

Abstract: In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of an embedded waveguide, and printed circuit board material is laminated to the plated channel. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成嵌入式波导的至少两个侧壁，并且将印刷电路板材料层压到电镀通道。 描述和要求保护其他实施例。

公开(公告)号：US20070154155A1

公开(公告)日：2007-07-05

申请号：US11322601

申请日：2005-12-30

Applicant: Gary Brist ,  Bryce Horine ,  Stephen Stephen

Inventor： Gary Brist ,  Bryce Horine ,  Stephen Stephen

IPC: G02B6/10

CPC classification number: H05K1/024 ,  H01P3/121 ,  H01P11/002 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981

Abstract: In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of an embedded waveguide, and printed circuit board material is laminated to the plated channel. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成嵌入式波导的至少两个侧壁，并且将印刷电路板材料层压到电镀通道。 描述和要求保护其他实施例。

公开(公告)号：US07088199B2

公开(公告)日：2006-08-08

申请号：US10857742

申请日：2004-05-28

Applicant: Gerald Keith Bartley ,  Darryl John Becker ,  Paul Eric Dahlen ,  Philip Raymond Germann ,  Andrew B. Maki ,  Mark Owen Maxson

Inventor： Gerald Keith Bartley ,  Darryl John Becker ,  Paul Eric Dahlen ,  Philip Raymond Germann ,  Andrew B. Maki ,  Mark Owen Maxson

IPC: H01P5/02

CPC classification number: H01P3/12 ,  H05K1/0237 ,  H05K1/0272 ,  H05K3/0061 ,  H05K2201/037

Abstract: A method and stiffener-embedded waveguide structure are provided for implementing enhanced data transfer for printed circuit board applications. At least one microwave channel is defined within a stiffener. The microwave channel provides a high frequency path for data transfers. Use of the waveguide channel in the stiffener for data transfers can replace or supplement otherwise required transmission paths in an associated printed circuit board.

Abstract translation: 提供了一种用于实现印刷电路板应用的增强数据传输的方法和加强肋嵌入式波导结构。 在加强件内限定至少一个微波通道。 微波通道为数据传输提供了高频路径。 在加强件中用于数据传输的波导通道的使用可替代或补充相关印刷电路板中所需的传输路径。