公开(公告)号：US06270374B1

公开(公告)日：2001-08-07

申请号：US09210073

申请日：1998-12-11

Applicant: Hard A. Carneling

Inventor： Hard A. Carneling

IPC: H01R1371

CPC classification number: H01R12/707 ,  H01R12/7052 ,  H01R12/7064 ,  H01R43/205 ,  H05K1/0269 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10863 ,  H05K2203/161 ,  Y10S439/94

Abstract: An electrical connector having a metal plate which is mounted under the housing with hot riveting. Location pegs are made so that low mounting force is possible. A wafer which is black in color or has another contrasting color makes it possible for a video camera to record the true position of the terminals. The surface of the top side of the housing is suited for vacuum pick up.

Abstract translation: 一种具有金属板的电连接器，其安装在具有热铆接的壳体下方。 定位销被制成使得可以实现低安装力。 黑色或具有另一种对比色的晶片使得摄像机能够记录终端的真实位置。 外壳顶面的表面适用于真空吸尘。

公开(公告)号：US4914259A

公开(公告)日：1990-04-03

申请号：US311838

申请日：1989-02-16

Applicant: Kenzo Kobayashi ,  Hirokazu Shiroishi

Inventor： Kenzo Kobayashi ,  Hirokazu Shiroishi

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/0058 ,  H05K3/306 ,  H05K3/3415 ,  H05K1/0393 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10575 ,  H05K2201/10636 ,  H05K2201/10863 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/1327 ,  H05K2203/1572 ,  H05K3/28 ,  H05K3/3447 ,  Y02P70/611 ,  Y02P70/613

Abstract: A molded circuit board formed by molding a resin substrate to one side of a circuit film made by forming a desired circuit pattern to an insulating film in a manner to form an integral body. In the circuit film, there are provided soldering pad regions for mounting surface-mounting parts in a surface of the circuit film opposite the other surface in contact with resin substrate and through-holes at locations of the circuit film where insert-mounting parts are mounted. In the resin substrate, holes for receiving insert-mounting parts are formed in the molding process at the locations corresponding to the through-holes of the circuit film.

公开(公告)号：US4709302A

公开(公告)日：1987-11-24

申请号：US942097

申请日：1986-12-16

Applicant: William D. Jordan ,  Donald L. Clemens

Inventor： William D. Jordan ,  Donald L. Clemens

IPC: H01L23/32 ,  H05K1/18 ,  H05K3/30 ,  H05K7/12 ,  H05K7/20

CPC classification number: H05K3/306 ,  H01R12/7005 ,  H05K7/12 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2201/10863 ,  H05K3/301

Abstract: Disclosed is apparatus for mounting electronic device packages and heat sinks on printed circuit boards with the pin connectors of the electronic device package held in alignment with preformed locations on the printed circuit boards. The alignment apparatus includes means for securing the electronic device package in intimate thermal contact with the heat sink for rapid dissipation of heat therefrom.

Abstract translation: 公开了用于将电子设备封装和散热器安装在印刷电路板上的装置，其中电子器件封装的引脚连接器与印刷电路板上的预先形成的位置保持一致。 对准装置包括用于固定电子装置包装件与散热器紧密热接触的装置，用于从其快速散发热量。

公开(公告)号：US3718876A

公开(公告)日：1973-02-27

申请号：US3718876D

申请日：1972-03-15

Applicant: BELL TELEPHONE LABOR INC

Inventor： FLETCHER R

IPC: H01H67/24 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H01H67/30

CPC classification number: H01H67/24 ,  H05K1/0271 ,  H05K1/116 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/10863

Abstract: A flexible membrane is disclosed which extends over an aperture in a support plate in an electromagnetic sealed contact matrix or ferreed type switch. The ferreed switch includes at least one circuit path element and the flexible membrane joins the circuit path element to the support plate and extends the circuit path element over the aperture to a point of rigid contact with a conductor lead projecting from an associated sealed contact switch.

Abstract translation: 公开了一种柔性膜，其在电磁密封接触矩阵或惯性型开关中的支撑板上的孔上延伸。 铁路开关包括至少一个电路路径元件，并且柔性膜将电路路径元件连接到支撑板，并且将电路路径元件延伸到孔上方到与从相关联的密封触点开关突出的导体引线刚性接触的点。

公开(公告)号：US3524108A

公开(公告)日：1970-08-11

申请号：US3524108D

申请日：1967-12-26

Applicant: CTS CORP

Inventor： ENGLISH JACK A

IPC: H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K7/06 ,  H05K7/12

CPC classification number: H05K3/306 ,  H05K3/308 ,  H05K3/32 ,  H05K3/3447 ,  H05K2201/09827 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/2036

公开(公告)号：ZA7705017B

公开(公告)日：1978-07-26

申请号：ZA7705017

申请日：1977-08-18

Applicant: MOTOROLA INC

Inventor： ERRICHIELLO D

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H05K7/02 ,  H05K7/06

CPC classification number: H05K1/119 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/18 ,  H05K3/42 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10446 ,  H05K2201/10863

公开(公告)号：EP2548421B1

公开(公告)日：2015-02-25

申请号：EP11709694.1

申请日：2011-03-16

Applicant: Robert Bosch GmbH

Inventor： HEIM, Michael ,  BRAUN, Sigmund

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

公开(公告)号：EP2130418B1

公开(公告)日：2012-06-06

申请号：EP08708621.1

申请日：2008-02-04

Applicant: Robert Bosch GmbH

Inventor： GUECKEL, Richard

IPC: H05K3/30

CPC classification number: H01R12/585 ,  H01R12/7064 ,  H01R2201/26 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10863 ,  H05K2203/1446 ,  Y10T29/49945

Abstract: The invention relates to a pin (2) having a contact part that can be inserted into a receiving opening (20) in a circuit board (4) and anchored with a press fit in the receiving opening (20), and to a method for inserting a pin into a receiving opening (20) in a circuit board (4), wherein the pin (2) is inserted into the receiving opening (20) from one side of the circuit board (4) and a contact part (24) of the pin (2) is anchored in the receiving opening (20) with a press fit. According to the invention, the contact part (24) is inserted into the receiving opening (20) with no contact or with a sliding fit and subsequently deformed within the receiving opening (20) by expansion transversely to the insertion direction, in order to anchor it in the receiving opening (20) with a press fit.

公开(公告)号：EP2410825A1

公开(公告)日：2012-01-25

申请号：EP10007538.1

申请日：2010-07-21

Applicant: 3M Innovative Properties Company

Inventor： Szymanki, Guenter ,  Edelmann, Wolfgang ,  Hajok, Johann ,  Bund, Christine

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10863

Abstract: A board, for example a printed circuit board 10 for insertion into a telecommunication module in an insertion direction 100, the printed circuit board 10 comprising a substrate 20, having two major surfaces 92, 94, first and second conductive paths 30, arranged on a major surface of the substrate 20, for electrically contacting first and second resilient contact elements of a linearly-arranged row of resilient contact elements of the telecommunication module, wherein the first and second conductive paths 30 are arranged such that a contacting end 35 of each of the conductive paths 30 is located on a straight reference line 110 which is substantially perpendicular to the insertion direction 100, so that electrical connections between respective resilient contact elements and the respective conductive paths 30 are established at one single insertion depth. The substrate 20 is shaped such that mechanical engagement between parts 25 of the substrate 20 which are to engage mechanically with the first and second resilient contact elements, respectively, and respective resilient contact elements is completed at different insertion depths of the board into the telecommunication module.

Abstract translation: 板，例如用于沿插入方向100插入电信模块的印刷电路板10，印刷电路板10包括基板20，基板20具有两个主表面92,94，第一和第二导电路径30，布置在基板20上 基板20的主表面，用于电接触电信模块的线性排列的弹性接触元件列的第一和第二弹性接触元件，其中第一和第二导电路径30被布置成使得每个的接触端35 导电路径30位于基本上垂直于插入方向100的直线参考线110上，使得相应的弹性接触元件和相应导电路径30之间的电连接在一个单个插入深度处建立。 基板20成形为使得基板20的分别与第一和第二弹性接触元件机械地接合的部件25与相应的弹性接触元件之间的机械接合在板的不同插入深度处完成到电信模块 。

公开(公告)号：EP0930812A2

公开(公告)日：1999-07-21

申请号：EP99100371.6

申请日：1999-01-15

Applicant: BERG ELECTRONICS MANUFACTURING B.V.

Inventor： Carneling, Hard A.

IPC: H05K3/30

CPC classification number: H01R12/707 ,  H01R12/7052 ,  H01R12/7064 ,  H01R43/205 ,  H05K1/0269 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10863 ,  H05K2203/161 ,  Y10S439/94

Abstract: An electrical connector having a metal plate which is mounted under the housing with hot riveting. Location pegs are made so that low mounting force is possible. A wafer which is black in color or has another contrasting color makes it possible for a video camera to record the true position of the terminals. The surface of the top side of the housing is suited for vacuum pick up.

Abstract translation: 一种具有金属板的电连接器，该金属板通过热铆装置安装在壳体下。 定位栓的制作使得安装力很小。 黑色或另一种对比色的晶片使摄像机能够记录终端的真实位置。 外壳顶面的表面适合真空拾取。