公开(公告)号：WO2007146384A1

公开(公告)日：2007-12-21

申请号：PCT/US2007/013967

申请日：2007-06-13

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  MAJUMDAR, Diptarka ,  FERGUSON, Saul

Inventor： MAJUMDAR, Diptarka ,  FERGUSON, Saul

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H05K1/092 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/017 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2201/09909 ,  Y10T29/435 ,  Y10T29/49155

Abstract: Disclosed is an improved method of embedding capacitors in printed wiring boards (PWB) made from thick film dielectrics and electrodes, the method comprising the steps of : providing a metallic foil; forming a ceramic dielectric over the metallic foil; forming an electrode over most of said dielectric and at least a portion of said metallic foil; firing the capacitor structure under base metal firing conditions; and etching the metallic foil to form a second electrode. Further the method may comprise forming an insulating isolation layer over the metallic foil before forming the ceramic dielectric.

Abstract translation: 公开了一种在由厚膜电介质和电极制成的印刷电路板（PWB）中嵌入电容器的改进方法，所述方法包括以下步骤：提供金属箔; 在金属箔上形成陶瓷电介质; 在所述电介质的大部分上形成电极，并且至少部分所述金属箔; 在贱金属烧制条件下烧结电容器结构; 并蚀刻金属箔以形成第二电极。 此外，该方法可以包括在形成陶瓷电介质之前在金属箔上形成绝缘隔离层。

公开(公告)号：WO2007145630A1

公开(公告)日：2007-12-21

申请号：PCT/US2006/023457

申请日：2006-06-15

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  BORLAND, William, J. ,  SUH, Seigi ,  MARIA, Jon-Paul ,  IHLEFELD, Jon Fredrick ,  BURN, Ian

Inventor： BORLAND, William, J. ,  SUH, Seigi ,  MARIA, Jon-Paul ,  IHLEFELD, Jon Fredrick ,  BURN, Ian

IPC: C23C18/16 ,  H01L21/316 ,  H05K1/16

CPC classification number: H01L21/31691 ,  C23C18/1212 ,  C23C18/1241 ,  C23C18/1266 ,  C23C18/1283 ,  C23C18/1295 ,  H01G4/129 ,  H05K1/162 ,  H05K2201/017 ,  H05K2201/0355

Abstract: A method of making dense dielectrics layers via chemical solution deposition by adding inorganic glass fluxed material to high dielectric constant compositions, depositing the resultant mixture onto a substrate and annealing the substrate at temperatures between the softening point of the inorganic glass flux and the melting point of the substrate. A method of making a capacitor comprising a dense dielectric layer.

Abstract translation: 一种通过在高介电常数组合物中添加无机玻璃助熔材料，通过化学溶液沉积来制造致密电介质层的方法，将所得混合物沉积在衬底上并在无机玻璃熔剂的软化点和熔点之间的温度下退火衬底 底物。 一种制造包括致密介电层的电容器的方法。

公开(公告)号：WO2007086184A1

公开(公告)日：2007-08-02

申请号：PCT/JP2006/323149

申请日：2006-11-21

Applicant: 株式会社村田製作所 ,  大賀 聡 ,  杉本 安隆

Inventor： 大賀 聡 ,  杉本 安隆

IPC: H01G4/30 ,  H01G4/12

CPC classification number: H01G4/105 ,  H01G4/1227 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/0029 ,  H05K2201/017 ,  H05K2203/171 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49004

Abstract: 　多層セラミック基板において、コンデンサ電極間の絶縁抵抗値やコンデンサのＱ値を大きく変化させることなく、内蔵コンデンサの容量値を精度良くレーザートリミングできる方法を提供する。 　複数のセラミック層（３～５）を積層してなるセラミック積層体（６）内に、第１コンデンサ電極（７）、第２コンデンサ電極（８）および誘電体ガラスセラミック層（４）で形成された内蔵コンデンサ（２）を有する多層セラミック基板（１）について、内蔵コンデンサ（２）の容量値を、第１コンデンサ電極（７）のレーザートリミングによって調整する。この場合、誘電体ガラスセラミック層（４）を、ＴｉＯ ２ を含む誘電体グレインの含有割合が１０～３５体積％である、ＴｉＯ ２ 系誘電体ガラスセラミック層から構成する。

Abstract translation: 本发明提供一种在多层陶瓷基板中能够以高精度实现内置电容器的电容值的激光微调，而不会使电容器电极之间的绝缘电阻值与电容器的Q值发生显着变化的方法。 在包括层叠在彼此顶部的多个陶瓷层（3〜5层）和内置电容器（2）的陶瓷层叠体（6）的多层陶瓷基板（1）中，形成有第一电容电极（ 7），设置在陶瓷层叠体（6）内的第二电容电极（8）和电介质玻璃陶瓷层（4），内置电容器（2）的电容值通过第一 电容电极（7）。 在这种情况下，电介质玻璃陶瓷层（4）由具有TiO 2的电介质晶粒含量为10〜20的基于TiO 2的电介质玻璃陶瓷层形成 35％（体积）。

公开(公告)号：WO2006019090A1

公开(公告)日：2006-02-23

申请号：PCT/JP2005/014939

申请日：2005-08-16

Applicant: 株式会社トクヤマ ,  前田 昌克 ,  山本 泰幸

Inventor： 前田 昌克 ,  山本 泰幸

IPC: C04B41/80

CPC classification number: C04B41/009 ,  C04B41/5031 ,  C04B41/5063 ,  C04B41/5064 ,  C04B41/87 ,  C04B2111/80 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/017 ,  H05K2201/10106 ,  H05K2201/2054 ,  C04B41/0072 ,  C04B41/4556 ,  C04B41/4539 ,  C04B41/5045 ,  C04B35/58 ,  C04B35/581 ,  H01L2924/00014 ,  H01L2924/00

Abstract: 　電極を有する発光素子を載置するための載置面と、この発光素子の電極と電気的に接続される電極とを有するセラミックス基板からなる発光素子搭載用セラミックス基板であって、セラミックス基板が、窒化物セラミックスからなる基板本体と、この基板本体の表面の少なくとも一部を被覆し、基板本体を形成する窒化物セラミックスとは異種のセラミックスからなる被覆層と、を含んでなり、被複層の表面における３００～８００ｎｍの波長領域の光に対する反射率が５０％以上である、素子から発光された光を確実に効率良く反射して、発光素子の輝度を向上することができると共に、高い放熱性を有する、発光素子搭載用セラミックス基板、およびその製造方法を提供する。

Abstract translation: 公开了一种用于安装发光装置的陶瓷基板，该陶瓷基板由具有安装有安装有电极的发光装置的安装面的陶瓷基板和发光装置的电极的电极 电连接。 陶瓷基板包括由氮化物陶瓷构成的基板主体和覆盖基板主体的至少一部分并且与构成基板主体的氮化物陶瓷不同的陶瓷构成的涂层。 涂层表面对300-800nm波长范围内的光的反射率不小于50％，使得陶瓷衬底可以有效地反射从器件发出的光，从而提高了 发光装置。 此外，用于安装发光装置的陶瓷基板具有高的散热性能。 还公开了一种用于制造这种用于安装发光装置的陶瓷基板的方法。

公开(公告)号：US12076971B2

公开(公告)日：2024-09-03

申请号：US17041884

申请日：2019-03-27

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Dean Michael Thelen

IPC: B32B7/027 ,  B32B17/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C4/18 ,  C03C10/00 ,  C03C21/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: B32B7/027 ,  B32B17/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C4/18 ,  C03C10/0009 ,  C03C10/0054 ,  H05K1/024 ,  H05K1/0306 ,  B32B2307/30 ,  B32B2307/732 ,  B32B2457/00 ,  C03C21/002 ,  C03C2204/00 ,  H05K2201/017 ,  H05K2201/0191 ,  H05K2201/068

Abstract: A laminated glass structure for an electronic device includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad glass layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to about 100 GHz.

公开(公告)号：US11690402B2

公开(公告)日：2023-07-04

申请号：US16868256

申请日：2020-05-06

Applicant: JAPAN TOBACCO INC.

Inventor： Tetsuya Yoshimura ,  Masato Miyauchi

IPC: A24F40/46 ,  A24B15/167 ,  A24F40/57 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  A24F40/50 ,  B82Y30/00 ,  A24F40/10 ,  A24F40/20

CPC classification number: A24F40/46 ,  A24B15/167 ,  A24F40/50 ,  A24F40/57 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0386 ,  H05K1/092 ,  H05K3/1283 ,  A24F40/10 ,  A24F40/20 ,  B82Y30/00 ,  H05K2201/017 ,  H05K2201/0154 ,  H05K2201/0284 ,  H05K2201/0293

Abstract: A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290° C. is less than 20% of a percentage weight loss of the paper from room temperature to 900° C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10° C./min.

公开(公告)号：US11647581B2

公开(公告)日：2023-05-09

申请号：US16903694

申请日：2020-06-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuki Takemori

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/28 ,  B32B3/26 ,  B32B15/04 ,  B32B3/30 ,  B32B9/00 ,  B32B9/04 ,  H05K1/02 ,  H05K3/34 ,  H05K3/46 ,  H05K3/24

CPC classification number: H05K1/0306 ,  B32B3/263 ,  B32B3/266 ,  B32B3/30 ,  B32B9/005 ,  B32B9/043 ,  B32B15/04 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/285 ,  H05K3/34 ,  H05K3/4644 ,  H05K3/244 ,  H05K2201/017 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/099 ,  H05K2201/0969 ,  H05K2201/09145 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2203/1131 ,  Y10T428/12201 ,  Y10T428/12361 ,  Y10T428/24273 ,  Y10T428/24331

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

公开(公告)号：US20180302982A1

公开(公告)日：2018-10-18

申请号：US15951808

申请日：2018-04-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sumiyo Nakamura ,  Takahiro Sumi ,  Takahiro Oka

IPC: H05K1/03 ,  C04B35/626 ,  C04B35/622 ,  C04B35/20 ,  C04B35/195 ,  H05K1/02 ,  H05K3/12 ,  H05K1/11

CPC classification number: H05K1/0306 ,  C04B35/195 ,  C04B35/20 ,  C04B35/62218 ,  C04B35/62625 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3481 ,  C04B2235/36 ,  C04B2235/80 ,  H01L21/4867 ,  H01L23/12 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/099 ,  H05K2201/09909 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

公开(公告)号：US20180035537A1

公开(公告)日：2018-02-01

申请号：US15543264

申请日：2016-01-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tatsuya KATOH ,  Masanori ITO ,  Masaki KUTSUNA

IPC: H05K1/03 ,  H05K3/12 ,  C04B35/63 ,  H05K3/46 ,  H01L23/15 ,  H05K1/09 ,  H05K3/28

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126 ,  Y10T29/49163

Abstract: A method of manufacturing a ceramic substrate includes the steps of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of a glass ceramic, applying the ceramic paste to a green sheet which is to become a ceramic layer after firing, applying a conductor paste which is to become a conductor trace after firing to the ceramic paste having been applied to the green sheet, and firing the green sheet carrying the ceramic paste and the conductor paste applied thereto.

公开(公告)号：US09591748B2

公开(公告)日：2017-03-07

申请号：US14560485

申请日：2014-12-04

Applicant: INNOLUX CORPORATION

Inventor： Kai Meng ,  Lien-Hsin Lee

IPC: G06F3/044 ,  H05K1/02 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12 ,  H03K17/96

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.