公开(公告)号：EP0304699A3

公开(公告)日：1990-05-09

申请号：EP88112746.8

申请日：1988-08-04

Applicant: JUNKOSHA CO. LTD.

Inventor： Satoh, Yoshiaki

IPC: H01B3/44 ,  C08J9/32

CPC classification number: C08J9/32 ,  C08J2327/18 ,  H01B3/445 ,  H05K1/034 ,  H05K1/0373 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0254

Abstract: A composite material of low dielectric constant, having minute hollow spheres of insulating material dispersed in a fibrous Polytetrafluoro­ethylene. The composite material has high mechanical strength.

公开(公告)号：WO2009053460A1

公开(公告)日：2009-04-30

申请号：PCT/EP2008/064431

申请日：2008-10-24

Applicant: EADS DEUTSCHLAND GMBH ,  ASTYX GMBH ,  UNIVERSITÄT DES SAARLANDES WISSENS- UND TECHNOLOGIETRANSFER GMBH ,  KÖRBER, Richard ,  BITTNER, Achim ,  SCHMID, Ulrich ,  PRECHTEL, Ulrich ,  ZIEGLER, Volker ,  FEURER, Ernst

Inventor： KÖRBER, Richard ,  BITTNER, Achim ,  SCHMID, Ulrich ,  PRECHTEL, Ulrich ,  ZIEGLER, Volker ,  FEURER, Ernst

IPC: H01Q1/38 ,  H01L23/15 ,  H05K1/03 ,  G01S13/00 ,  H01Q9/04

CPC classification number: H05K1/024 ,  G01S7/032 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01Q1/38 ,  H01Q9/0407 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/0254 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Die Erfindung betrifft ein Verfahren zum Herstellen eines Radarsensors (10), das besonders zur Herstellung hochintegrierter und dennoch hochempfindlicher Radarsensoren geeignet ist. Der Radarsensor (10) weist mehrere unterschiedlich ansteuerbare Antennen (18, 20) und ein Verteilnetzwerk (14) zur Ansteuerung der Antennen (18, 20) auf. Das erfindungsgemäße Verfahren umfasst die Schritte: a) Bereitstellen einer keramischen Trägerstruktur mit dem Verteil netzwerk (14), in welcher Kavitäten ausgebildet werden, b) Befüllen der Kavitäten mit einer Materialmatrix aus ei nem ersten Material mit Einschlüssen aus einem zweiten Material, um innerhalb der Materialmatrix eine Vielzahl von Bereichen auszubilden, die eine niedrigere Dielektrizitätszahl als das erste Material aufweisen, c) Aufbringen planarer Antennenpatches auf die Materialmatrix.

Abstract translation: 本发明涉及一种方法，用于制造雷达传感器（10），其特别适用于生产高集成度，但高度敏感雷达传感器。 雷达传感器（10）具有用于驱动所述天线（18，20）的多个不同的可控制的天线（18,20）和一分配网络（14）。 本发明的方法包括以下步骤：a）提供一个陶瓷支撑结构与所述分配网络（14）形成在其中的空腔，b）用蛋NEM第一材料具有第二材料的夹杂物中的一种材料基质填充所述空腔 基质形成材料的多个区域，其具有比所述第一材料更低的介电常数，c）施加的平面天线的补丁的材料基体。

公开(公告)号：WO2007125891A1

公开(公告)日：2007-11-08

申请号：PCT/JP2007/058799

申请日：2007-04-24

Applicant: 電気化学工業株式会社 ,  佐々木 修治 ,  西 泰久 ,  山野 眞二 ,  岩佐 光芳

Inventor： 佐々木 修治 ,  西 泰久 ,  山野 眞二 ,  岩佐 光芳

IPC: C01B33/18 ,  C01B13/32 ,  C08K7/26 ,  C08L101/00

CPC classification number: C01B33/18 ,  C01B13/322 ,  C01P2004/32 ,  C01P2004/34 ,  C01P2006/12 ,  C03C11/002 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/2982

Abstract: 　低誘電性のゴム又は樹脂の組成物などに配合される微細で高中空率を有する無機質中空粉体を提供する。無機質中空粉体は、平均中空率７０体積％超、平均粒子径３～２０μｍを有し、好ましくは、平均中空率７５～８５体積％、平均粒子径５～１５μｍ、最大粒子径２５μｍ以下、比表面積１０ｍ 2 ／ｇ以下、平均球形度０．９０以上、純度９９質量％以上を有する。無機質中空粉体は、外側から順に、助燃ガス供給管、可燃ガス供給管及び無機質原料粉末供給管が組まれた三重管部分を少なくとも備えたバーナーを用いて火炎を形成し、そこにバーナーの無機質原料粉末供給管から、特定粒度の無機質原料粉末を特定相対湿度のキャリアガスに同伴させながら高速吐出速度で噴射し、熱処理を行わせて製造することができる。

Abstract translation: 用于结合到低介电橡胶或树脂组合物等中的无机中空颗粒，其是超细的并且具有高百分比的空心。 无机中空颗粒的中空平均百分比超过70体积％，平均粒径为3-20μm。 它们优选具有75-85体积％，平均粒径为5-15μm，最大粒径为25μm或更小的中空平均百分比，比表面积为10m 2 / g 或更小，平均球形度为0.90以上，纯度为99质量％以上。 无机中空颗粒可以通过以下方法制备：使用具有至少三管部分的燃烧器形成火焰，所述三管部分包括燃烧负载气体进料管，可燃气体进料管和无机原料粉末进料 从外部按此顺序排列的管道; 并将具有特定粒度的无机原料粉末与具有特定相对湿度的载气一起以高喷出速度从燃烧器的无机原料粉末供给管中喷出粉末， 从而进行热处理。

公开(公告)号：WO2006103847A1

公开(公告)日：2006-10-05

申请号：PCT/JP2006/303092

申请日：2006-02-15

Applicant: 日本碍子株式会社 ,  双信電機株式会社 ,  大渕 武志 ,  井出 良律

Inventor： 大渕 武志 ,  井出 良律

IPC: H01B1/22 ,  H01B1/00 ,  H05K3/46

CPC classification number: H05K1/092 ,  H01B1/16 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0254

Abstract: This invention provides a conductor paste and an electronic component formed by using the conductor paste that can solve problems, involved in conventional electronic components, such as dielectric laminated filters used in high-frequency circuit radio equipment such as cellular phones, prepared by coating a conductor paste onto each of a plurality of ceramic powder molded products, then stacking the molded products on top of each other, and conducting simultaneous firing, for example, a problem that an internal stress takes place by a difference in firing shrinkage behavior between the ceramic powder molded product and the conductor paste in the simultaneous firing. The problems of the conventional electronic components can be solved, for example, by using a conductor paste composed mainly of a silver powder and containing a metal oxide powder of primary particles having a hollow structure.

Abstract translation: 本发明提供一种导体糊料和电子部件，其通过使用能够解决问题的导体糊料和电子部件，涉及传统的电子部件，例如通过涂布导体而制备的诸如蜂窝电话的高频电路无线电设备中使用的介电层压滤波器 粘贴到多个陶瓷粉末成型体中的每一个上，然后将模塑产品堆叠在彼此的顶部并进行同时烧制，例如，通过陶瓷粉末之间的焙烧收缩行为的差异发生内部应力的问题 模制产品和导体膏同时烧制。 常规电子部件的问题可以通过例如使用主要由银粉构成并含有中空结构的一次粒子的金属氧化物粉末的导体糊来解决。

公开(公告)号：WO0102468A9

公开(公告)日：2002-07-25

申请号：PCT/US0018038

申请日：2000-07-01

Applicant: HOLL TECHNOLOGIES COMPANY ,  HOLL RICHARD A

Inventor： HOLL RICHARD A

IPC: C08J3/20 ,  B01F13/10 ,  B22F3/20 ,  B22F3/22 ,  B29B7/40 ,  B29B7/90 ,  B29C47/00 ,  B29C47/50 ,  B29C67/24 ,  B29C70/58 ,  C08J5/00 ,  C08K3/00 ,  C08K7/24 ,  C08L71/12 ,  C22C32/00 ,  H01L23/14 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K3/02 ,  C08K3/08 ,  C08K3/22 ,  C08K5/00 ,  C08K7/22 ,  C08K9/10 ,  H01B3/30

CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressively weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particles size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

Abstract translation: 在聚（亚芳基醚）聚合物材料的基体中包含至少60体积％，优选70体积％的细粉末状填料的颗粒的复合材料通过形成组分的混合物制成，从而形成所需体，然后 将物体加热和压制到足以熔化聚合物的温度和足以将熔融的聚合物分散到填料颗粒之间的空隙中的压力。 令人惊讶的是，当固体含量高达规定值时，这些聚合物材料只能作为粘合材料有效，因为所得物体的含量较低，因此太脆。 这完全违背了接受的现有技术实践，认为随着固体含量增加，复合材料逐渐变弱，因此必须限制这些内容。 在获得尽可能完整的组分分散体的方法中，它们单独分散在含有聚合物的液体分散介质中以及必要的添加剂，如果需要，每种混合物被研磨以获得所需的颗粒尺寸，混合物再次混合 从液体分散介质和由所得糊状混合物形成的绿色物品分离，以产生彻底的分散。 然后如上所述加热和按压绿色制品。 可以使用不同填料材料的混合物来定制最终材料的电学和物理性能。 物品优选地包括用于电子电路的基底。

公开(公告)号：WO01068752A1

公开(公告)日：2001-09-20

申请号：PCT/US2001/008684

申请日：2001-03-16

IPC: C03C25/00 ,  C03C25/10 ,  C03C25/26 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/48 ,  C08J5/08 ,  H05K1/03 ,  H05K3/00

CPC classification number: C03C25/26 ,  C03C25/00 ,  C03C25/10 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2964 ,  Y10T442/20 ,  Y10T442/3049

Abstract: The present invention provides a fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals. The present invetion also provides a reinforced laminate comprising: (a) at least one matrix material; and (b) at least one fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals.

Abstract translation: 本发明提供了一种织物，其包含至少一根纤维束，其包含多根纤维，并且在至少一条纤维束的至少一个表面上具有树脂相容的涂料组合物，其中至少一条纤维束具有空气喷射传输拖 通过具有直径为2毫米的内部空气喷射室和具有20厘米长度的喷嘴出口管以针状进料速率的针空气喷嘴单元确定的每克质量的股线的力值大于100,000克力 每分钟274米，气压310千帕。 本发明还提供一种增强层压材料，包括：（a）至少一种基质材料; 和（b）至少一种织物，其包含至少一根包含多根纤维并且在所述至少一根纤维束的至少一个表面上具有树脂相容性涂料组合物的纤维束，其中所述至少一根纤维束具有空气喷射 通过具有直径为2毫米的内部空气喷射室的针空气喷嘴单元确定的每克质量股线的运输阻力值大于100,000克力，并且在一股线处具有长度为20厘米的喷嘴出口管 进料速度为274米/分钟，空气压力为310千帕。

公开(公告)号：WO0109054A8

公开(公告)日：2001-04-19

申请号：PCT/US0020459

申请日：2000-07-28

Applicant: PPG IND OHIO INC

Inventor： NOVICH BRUCE E ,  LAMMON-HILINSKI KAMI ,  ROBERTSON WALTER J ,  WU XIANG ,  VELPARI VEDAGIRI ,  LAWTON ERNEST L ,  RICE WILLIAM B

IPC: C03C25/10 ,  C03C25/00 ,  C03C25/48 ,  C08J5/08 ,  D06M15/507 ,  D06M15/564 ,  D06M15/59 ,  D06M101/00 ,  H05K1/03 ,  H05K3/00

CPC classification number: C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

公开(公告)号：WO00021900A1

公开(公告)日：2000-04-20

申请号：PCT/US1999/021443

申请日：1999-10-08

IPC: C03C25/10 ,  C08J5/08 ,  D03D1/00 ,  D03D15/12 ,  D06M11/00 ,  D06M11/80 ,  D06M15/507 ,  D06M101/00 ,  H05K1/03 ,  H05K3/00

CPC classification number: C08J5/08 ,  C03C25/47 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: One aspect of the present invention is a prepreg for an electronic support, the prepreg comprising: (a) a polymeric matrix material; and (b) a fabric comprising a strand comprising glass fibers, at least a portion of the fabric having a coating which is compatible with the polymeric matrix material, the prepreg having a drill tip percent wear of no greater than about 32 percent, as determined after drilling 2000 holes through a stack of 3 laminates, each laminate including eight of the prepregs, at a hole density of 62 holes per square centimeter (400 holes per square inch) and a chip load of 0.001 with a 0.46 mm (0.018 inch) diameter tungsten carbide drill. The present invention also provides a laminate incorporating the prepreg. Another aspect of the present invention is a prepreg for an electronic support, the prepreg comprising: (a) a polymeric matrix material; and (b) a woven reinforcement fabric comprising glass fibers, at least a portion of the fabric having a coating which is compatible with the polymeric matrix material, the prepreg having a deviation distance of no greater than about 36 micrometers, as determined after drilling 2000 holes through a stack of 3 laminates at a hole density of 62 holes per square centimeter (400 holes per square inch) and a chip load of 0.001 with a 0.46 mm (0.018 inch) diameter tungsten carbide drill. The present invention also provides a laminate incorporating the prepreg.

Abstract translation: 本发明的一个方面是用于电子载体的预浸料坯，所述预浸料包括：（a）聚合物基质材料; 和（b）包含包含玻璃纤维的股线的织物，所述织物的至少一部分具有与所述聚合物基质材料相容的涂层，所述预浸料坯具有不大于约32％的钻头百分比磨损，如所确定的 在通过3个层压体的堆叠中钻孔2000个孔之后，每个层压体包括八个预浸料坯，孔密度为每平方厘米62个孔（400个孔/平方英寸），并且具有0.46mm（0.018英寸）的0.001的切屑负载） 直径碳化钨钻头。 本发明还提供了包含预浸料的层压体。 本发明的另一方面是一种用于电子载体的预浸料，所述预浸料包括：（a）聚合物基质材料; 和（b）包含玻璃纤维的织造增强织物，所述织物的至少一部分具有与所述聚合物基质材料相容的涂层，所述预浸料坯具有不大于约36微米的偏差距离，如在钻井2000之后测定的 孔通过堆叠的3个层压板，孔密度为每平方厘米62孔（400个孔/平方英寸），芯片负载为0.001，直径为0.46毫米（0.018英寸）的碳化钨钻头。 本发明还提供了包含预浸料的层压体。

公开(公告)号：WO1992022422A1

公开(公告)日：1992-12-23

申请号：PCT/US1992005094

申请日：1992-06-17

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  GAZIT, Samuel ,  ADAMS, Gary, W.

IPC: B32B03/10

CPC classification number: H05K1/0373 ,  C08G59/42 ,  C08K3/013 ,  H01L23/145 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/057 ,  H05K2201/068 ,  H01L2924/00 ,  C08L63/00

Abstract: A printed circuit board composed of a low Tg epoxy filled with a low CTE filler in the range of 45 to 65 % by volume and laminated to electrically conductive sheets is presented. The printed circuit board of this invention does not include any woven or nonwoven fabrics. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems.

Abstract translation: 提出了一种印刷电路板，其由填充有45至65体积％的低CTE填料的低Tg环氧树脂组成并层压到导电片上。 本发明的印刷电路板不包括任何织造或非织造织物。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。

公开(公告)号：EP3025566A1

公开(公告)日：2016-06-01

申请号：EP14755444.8

申请日：2014-07-18

Applicant: Rogers Corporation

Inventor： CROSLEY, Jessica

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  C03C11/00 ,  C03C14/00 ,  C03C23/008 ,  C03C2214/12 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/24893 ,  Y10T428/249971 ,  Y10T428/249974

Abstract: A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percent of borosilicate microspheres that have been treated with an alkaline solution.