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    PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    131.
    发明申请
    PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    印刷电路板封装结构及其制造方法

    公开(公告)号：US20140266549A1

    公开(公告)日：2014-09-18

    申请号：US14205344

    申请日：2014-03-11

    Applicant: TRIPOD TECHNOLOGY CORPORATION

    Inventor： Bo-Shiung HUANG ,  Wei-Hsiung YANG ,  Han-Ching SHIH ,  Cheng-Feng LIN

    IPC: H05K1/02 ,  H05K3/42 ,  H01F27/28

    CPC classification number: H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

    Abstract: A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

    Abstract translation: 印刷电路板封装结构包括具有第一表面和第二表面的基板，环形磁性元件，粘合剂层，导电部分和导电通道。 第一表面和第二表面分别具有第一和第二金属部分。 在未被第一表面的第一金属部分覆盖的位置处形成环形凹部。 环形磁性元件放置在环形凹部中。 粘合剂层覆盖第一金属部分和环形磁性元件。 导电部分形成在粘合剂层上。 导电通道穿透导电部分，粘合剂层和基底，并且分别位于环形凹部的内壁和外壁外侧。 每个导电通道包括导电膜电连接到对准的导电部分和第二金属部分。

    Methods for suppressing power plane noise
    132.
    发明授权
    Methods for suppressing power plane noise 有权
    抑制电源平面噪声的方法

    公开(公告)号：US08743555B2

    公开(公告)日：2014-06-03

    申请号：US13965412

    申请日：2013-08-13

    Applicant: Micron Technology, Inc.

    Inventor： Houfei Chen ,  Shiyou Zhao

    IPC: H05K1/18 ,  H05K3/02

    CPC classification number: H05K1/0216 ,  G11C5/04 ,  G11C5/063 ,  H05K1/0298 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/09636 ,  H05K2201/09981 ,  H05K2203/0733 ,  Y10T29/4913 ,  Y10T29/49155

    Abstract: Substrates having power planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a first power plane and a second power plane. The at least one noise suppression structure may include a first power plane extension that extends from the first power plane generally toward the second power plane, and a second power plane extension that extends from the second power plane generally toward the first power plane. Methods for suppressing noise in at least one of the first power plane and second power plane include providing such noise suppression structures between the power planes.

    Abstract translation: 具有诸如印刷电路板的电源层的衬底包括至少一个噪声抑制结构，其被配置为抑制通过第一电力平面和第二电力平面中的至少一个传播的电波。 至少一个噪声抑制结构可以包括从第一电力平面大致朝向第二电力平面延伸的第一电力平面延伸部，以及从第二电力平面大致向第一电力平面延伸的第二电力平面延伸部。 用于抑制第一电力平面和第二电力平面中的至少一个中的噪声的方法包括在电力平面之间提供这种噪声抑制结构。

    Electronic circuit
    133.
    发明授权
    Electronic circuit 有权
    电子电路

    公开(公告)号：US08441807B2

    公开(公告)日：2013-05-14

    申请号：US13040915

    申请日：2011-03-04

    Applicant: Naofumi Kitano ,  Toshiro Nishimura

    Inventor： Naofumi Kitano ,  Toshiro Nishimura

    IPC: H05K7/00

    CPC classification number: H05K1/0231 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/165 ,  H05K3/4614 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

    Abstract: An electronic circuit is obtained that has reduced EMI levels. The circuit includes an integrated circuit, which is a source of noise, a bypass capacitor, and a circuit substrate on which they are mounted. An electronic circuit one electrode terminal of the bypass capacitor and one connecting electrode of the integrated circuit are connected through a first wire interconnect formed in the circuit substrate, and, additionally, another electrode terminal of the bypass capacitor and another connecting electrode of the integrated circuit are connected through a second wire interconnect, and the gap between the first wire interconnect and the second wire interconnect is made smaller than either the gap between the one connecting electrode and the other connecting electrode on the integrated circuit or the gap between the one electrode terminal and the other electrode terminal of the bypass capacitor.

    Abstract translation: 获得具有降低的EMI电平的电子电路。 电路包括作为噪声源的集成电路，旁路电容器和安装在其上的电路基板。 旁路电容器的一个电极端子和集成电路的一个连接电极的电子电路通过形成在电路基板中的第一线路互连而连接，另外，旁路电容器的另一个电极端子和集成电路的另一个连接电极 通过第二导线互连连接，并且使第一线互连和第二线互连之间的间隙小于集成电路上的一个连接电极和另一个连接电极之间的间隙或者一个电极端子之间的间隙 旁路电容器的另一个电极端子。

    Spark gap apparatus
    135.
    发明授权
    Spark gap apparatus 有权
    火花间隙装置

    公开(公告)号：US08395875B2

    公开(公告)日：2013-03-12

    申请号：US12856276

    申请日：2010-08-13

    Applicant: Andrew F. Tresness

    Inventor： Andrew F. Tresness

    IPC: H02H1/00

    CPC classification number: H05K1/026 ,  H01T4/08 ,  H05K1/116 ,  H05K3/0038 ,  H05K2201/09036 ,  H05K2201/09636 ,  H05K2203/0242

    Abstract: A spark gap for protecting electronic circuits from excessive electrical surges comprises a substrate containing an opening, a dielectric medium occupying the opening, and first and second electrodes. The first electrode is embedded in the substrate, on one side of the opening, and has a first conductive surface that extends through the substrate and is substantially exposed in the opening and to the dielectric medium. The second electrode is embedded in the substrate, on another side of the opening, and has a second conductive surface that extends through the substrate and is substantially exposed in the opening and to the dielectric medium. The first conductive surface is in opposing relation to the second conductive surface, and they are spaced apart by a predetermined distance to establish a gap width. An electrical arc is generated across the opening when a voltage potential difference between the conductive surfaces exceeds a threshold value.

    Abstract translation: 用于保护电子电路不受过度电涌影响的火花隙包括含有开口的基板，占据开口的电介质以及第一和第二电极。 第一电极在开口的一侧嵌入衬底中，并且具有延伸穿过衬底并基本上暴露在开口和电介质中的第一导电表面。 第二电极嵌入基板中，在开口的另一侧上，并且具有延伸穿过基板的第二导电表面，并且基本上暴露在开口和介电介质中。 第一导电表面与第二导电表面相对，并且它们间隔开预定距离以建立间隙宽度。 当导电表面之间的电压差超过阈值时，跨越开口产生电弧。

    Filter
    136.
    发明授权
    Filter 有权
    过滤

    公开(公告)号：US08299876B2

    公开(公告)日：2012-10-30

    申请号：US12704529

    申请日：2010-02-12

    Applicant: Pei-Yang Lin ,  Chih-Chung Lin ,  Wen-Lin Yang

    Inventor： Pei-Yang Lin ,  Chih-Chung Lin ,  Wen-Lin Yang

    IPC: H01P1/203 ,  H03H7/38

    CPC classification number: H01P1/20345 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09636 ,  H05K2201/09781

    Abstract: A filter for filtering noise generated by a differential signal having a specific wavelength transmitted by a first transmission line and a second transmission line is disclosed. The filter includes a multi-layer substrate, a first microstrip line and a second microstrip line. The first and the second transmission lines and the first and the second microstrip lines are disposed at the multi-layer substrate. In addition, one end of the first microstrip line and one end of the second microstrip line are electrically connected to the first and the second transmission lines, respectively, by passing through the vias, and the other end is in a floating state. The impedances of the first and the second microstrip lines match the impedances of the first and the second transmission lines, respectively. Thus, the first and the second microstrip lines may filter the noise generated by the differential signal having the specific wavelength.

    Abstract translation: 公开了一种用于滤波由具有由第一传输线和第二传输线传输的特定波长的差分信号产生的噪声。 滤波器包括多层基板，第一微带线和第二微带线。 第一和第二传输线以及第一和第二微带线设置在多层基板上。 此外，第一微带线的一端和第二微带线的一端分别通过穿过通孔而电连接到第一和第二传输线，另一端处于浮置状态。 第一和第二微带线的阻抗分别匹配第一和第二传输线的阻抗。 因此，第一和第二微带线可以滤除由具有特定波长的差分信号产生的噪声。

    Printed circuit board
    137.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：US08270180B2

    公开(公告)日：2012-09-18

    申请号：US12646888

    申请日：2009-12-23

    Applicant: Chien-Hung Liu ,  Shou-Kuo Hsu ,  Yu-Chang Pai ,  Po-Chuan Hsieh

    Inventor： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Yu-Chang Pai ,  Po-Chuan Hsieh

    IPC: H05K1/11 ,  H05K7/00 ,  H05K1/14

    CPC classification number: H05K1/0251 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09636

    Abstract: A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.

    Abstract translation: 印刷电路板包括多个信号层，多个接地层，第一传输线，第二传输线，第一通孔和第二通孔。 第一个传输位于多个信号层之一上。 第二传输线位于多个信号层的另一个上。 第一和第二通孔穿过印刷电路板。 第一通孔电耦合到第一和第二传输线，并且与接地层的数量隔离。 第二通孔电耦合到多个接地层中的一个或多个，并与多个接地层中的另一个隔离，以增加电感，从而补偿开路短路的电容特性并提高信号完整性。

    PRINTED CIRCUIT BOARD
    140.
    发明申请
    PRINTED CIRCUIT BOARD 有权
    印刷电路板

    公开(公告)号：US20110094786A1

    公开(公告)日：2011-04-28

    申请号：US12646888

    申请日：2009-12-23

    Applicant: CHIEN-HUNG LIU ,  SHOU-KUO HSU ,  YU-CHANG PAI ,  PO-CHUAN HSIEH

    Inventor： CHIEN-HUNG LIU ,  SHOU-KUO HSU ,  YU-CHANG PAI ,  PO-CHUAN HSIEH

    IPC: H05K1/11

    CPC classification number: H05K1/0251 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09636

    Abstract: A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.

    Abstract translation: 印刷电路板包括多个信号层，多个接地层，第一传输线，第二传输线，第一通孔和第二通孔。 第一个传输位于多个信号层之一上。 第二传输线位于多个信号层的另一个上。 第一和第二通孔穿过印刷电路板。 第一通孔电耦合到第一和第二传输线，并且与接地层的数量隔离。 第二通孔电耦合到多个接地层中的一个或多个，并与多个接地层中的另一个隔离，以增加电感，从而补偿开路短路的电容特性并提高信号完整性。

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