公开(公告)号：EP2235768A4

公开(公告)日：2011-12-21

申请号：EP08855426

申请日：2008-11-27

Applicant: LG CHEMICAL LTD

Inventor： PARK YOUNGSUN ,  LEE JEONGSUK ,  AHN KEUNPYO ,  KIM CHUNYEON ,  HA JOUNG HO ,  WAKEBE MASAYUKI

IPC: H01M2/34 ,  H01M2/10 ,  H01M2/30 ,  H05K1/00

CPC classification number: H01M2/34 ,  H01M2/0404 ,  H01M10/0525 ,  H01M10/425 ,  H01M10/4257 ,  H01M2010/4271 ,  H01M2200/00 ,  H01M2200/103 ,  H01M2200/106 ,  H01M2220/30 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/341 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/1028 ,  Y02E60/122

Abstract: Disclosed herein is a battery pack comprising: a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state; and a protection circuit module (PCM) electrically connected to the battery cell, wherein the PCM is provided with a safety device of which a circuit is cut off when temperature is high or a large amount of current flows, wherein the PCM is provided with a safety device, the battery cell has an electrode assembly mounted in a metal container together with an electrolyte, the metal container having an open top sealed by a top cap, the battery pack further comprises: an insulative mounting member constructed in a structure in which the PCM is loaded at a top of the insulative mounting member, the insulative mounting member being mounted to the top cap of the battery cell; and an insulative cap coupled to an upper end of the battery cell for covering the insulative mounting member in a state in which the PCM is loaded on the insulative mounting member, and the top cap is provided with a pair of protrusion-type electrode terminals (a first protrusion-type electrode terminal and a second protrusion-type electrode terminal) connected to a cathode and an anode of the electrode assembly, respectively, the insulative mounting member is provided with through-holes corresponding to the protrusion-type electrode terminals, the PCM is provided with through-holes corresponding to the protrusion-type electrode terminals, and the coupling of the insulative mounting member and the PCM to the battery cell is achieved by successively fixedly inserting the protrusion-type electrode terminals through the through-holes of the insulative mounting member and the PCM.

公开(公告)号：EP1446000B1

公开(公告)日：2011-11-09

申请号：EP03388026.1

申请日：2003-04-25

Applicant: Sony Ericsson Mobile Communications AB

Inventor： Fagrenius, Gustav ,  Bengtsson, Henrik ,  Andersson, Niklas ,  Palmqvist, Fredrik

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  H05K3/341 ,  H05K2201/09018 ,  H05K2201/1028 ,  H05K2201/10371 ,  H05K2201/10916 ,  Y02P70/613

公开(公告)号：EP1901350A4

公开(公告)日：2010-03-10

申请号：EP06767882

申请日：2006-07-05

Applicant: TOYOTA JIDOSHOKKI KK ,  SHOWA DENKO KK

Inventor： OTOSHI KOTA ,  KONO EIJI ,  TOH KEIJI ,  TANAKA KATSUFUMI ,  FURUKAWA YUICHI ,  YAMAUCHI SHINOBU ,  HOSHINO RYOICHI ,  WAKABAYASHI NOBUHIRO ,  NAKAGAWA SHINTARO

IPC: H01L23/36 ,  H01L23/367 ,  H05K1/02

CPC classification number: H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP1931183A3

公开(公告)日：2009-09-30

申请号：EP07023165.9

申请日：2007-11-29

Applicant: Hitachi, Ltd.

Inventor： Yokozuka, Takehide ,  Ikeda, Ukyo ,  Harada, Masahide ,  Yoshinari, Hideto

IPC: H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/0979 ,  H05K2201/1028 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10856 ,  H05K2201/10924 ,  H05K2203/0285 ,  H01L2924/00

Abstract: An electronic device of the present invention has a pair of joint pieces 2a, 2b formed on one end of its body and extending to both sides of the body. Both of these joint pieces 2a, 2b are connected to one substrates 5, 7 to improve the joining strength between a lead frame connector 1 and the substrate and ensure the reliability of electrical connection between the lead frame connector 1 and the substrate 5,7.

公开(公告)号：EP1985163A1

公开(公告)日：2008-10-29

申请号：EP07702782.9

申请日：2007-01-16

Applicant: Häusermann GmbH

Inventor： JANESCH, Rudolf ,  STRUMMER, Erich ,  HACKL, Johann

IPC: H05K3/00 ,  H05K1/00

CPC classification number: H05K1/0281 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/0278 ,  H05K3/0017 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/328 ,  H05K3/4691 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/1028 ,  H05K2201/2009 ,  H05K2203/302

Abstract: The invention relates to a multifunctional printed circuit board for use as rigid/flexible or semi-flexible printed circuit board in the form of a through-hole printed circuit board or multilayer printed circuit board or flexible printed circuit board. At least one additional functional element is fastened in at least some sections on a copper foil by ultrasound or friction welding in a planar manner, thereby producing an intermetal compound. A notch is milled into said section allowing the printed circuit board to be bent like a rigid/flexible printed circuit board or semi-flexible printed circuit board. When two notches are milled, the printed circuit board can be bent twice by approximately 45° by a total of 90°. The invention also relates to a method for producing multifunctional printed circuit boards which comprise at least one additional functional element and a milled notch.

公开(公告)号：EP1344435B1

公开(公告)日：2008-05-14

申请号：EP01989795.8

申请日：2001-11-15

Applicant: Intel Corporation

Inventor： SANKMAN, Robert

IPC: H05K3/40 ,  H05K3/46 ,  H01L23/498

CPC classification number: H05K3/4038 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2203/0235 ,  H01L2224/05599

Abstract: A microelectronic substrate (110) having a plurality of alternating substantially planar layers of dielectric material (102) and conductive material (104), and further having a first surface (116) and a second surface (130), wherein the dielectric material (102) and the conductive material (104) layers extend substantially perpendicularly between the first and second surfaces (116, 130).

公开(公告)号：EP1852910A1

公开(公告)日：2007-11-07

申请号：EP07100139.0

申请日：2007-01-04

Applicant: Eudyna Devices Inc.

Inventor： Oe, Satoshi

IPC: H01L23/498 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2224/16225 ,  H05K3/222 ,  H05K3/3468 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10386 ,  H05K2203/173

Abstract: A mounting substrate (10) including an interconnection (12) provided on a front surface of a substrate, a lead pad (24) provided separately from the interconnection (12), on the front surface of the substrate (10) and, a lead (20) connected to the lead pad (24) by solder (22), and a connecting portion (28) that connects the interconnection (12) and the lead pad (24) after the lead (20) is connected.

Abstract translation: 一种安装基板（10），其包括设置在基板的前表面上的互连（12），在所述基板（10）的前表面上与所述互连（12）分开设置的引线焊盘（24），以及引线 （20）通过焊料（22）连接到引线焊盘（24），以及在引线（20）连接之后连接互连（12）和引线焊盘（24）的连接部分（28）。

公开(公告)号：EP0893945A4

公开(公告)日：2005-03-30

申请号：EP98900724

申请日：1998-01-22

Applicant: ROHM CO LTD

Inventor： NAKAMURA SATOSHI ,  TANAKA MASAHARU

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/4015 ,  H05K3/3405 ,  H05K3/341 ,  H05K2201/09172 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10962 ,  Y02P70/613

Abstract: There are disclosed printed board (5) on which electronic parts are mounted, a method for manufacturing the printed board, and a structure for connecting conductor elements (8, 8') to this printed board. The printed board includes an insulating supporting substrate (50) and at least one metallic terminal (53, 54). The supporting substrate is provided with at least one opening (51, 52) through the substrate, and the metallic terminal is fixed to the supporting substrate without protruding from the supporting substrate and bridges the opening.

公开(公告)号：EP1099362B1

公开(公告)日：2004-11-24

申请号：EP99933415.4

申请日：1999-06-29

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： BERG, Rustan ,  HERNEFJORD, Ingemar

IPC: H05K3/34

CPC classification number: H05K3/341 ,  H01R43/0256 ,  H05K1/0306 ,  H05K3/4015 ,  H05K2201/068 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10969 ,  Y02P70/613

Abstract: The present invention relates to mounting an electric connector (20) onto a printed circuit board, particularly to a printed circuit board comprised of ceramic material, for instance either an LTCC substrate or an HTCC substrate. The problem addressed is one where the connector (20) tends to loosen from the substrate when the temperature varies. This is due to the difference in the coefficients of thermal expansion of the printed circuit board and the connector (20). The problem is solved with the aid of a so-called shim (10) that has a coefficient of thermal expansion between that of the printed circuit board and that of the connector. One side of the shim (10) is soldered onto the connector and the other side of the shim is soldered onto the printed circuit board. The connector (20) is therewith fastened to the printed circuit board. Shear stresses acting between the connector (20) and the printed circuit board are distributed through said board through the medium of two joints instead of one. The connector may alternatively be provided with a built-in shim.

公开(公告)号：EP1465468A1

公开(公告)日：2004-10-06

申请号：EP04006594.8

申请日：2004-03-18

Applicant: Sanyo Electric Co., Ltd. ,  Sanyo Tuner Industries Co., Ltd

Inventor： Mori, Takayuki ,  Komamizu, Shuichi ,  Makino, Kazumi

IPC: H05K3/12 ,  H05K3/34 ,  B41N1/24

CPC classification number: H05K3/3484 ,  B41N1/248 ,  H05K3/1225 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10818 ,  H05K2203/0545

Abstract: A lead-free solder paste printing method is practiced with use of a metal mask having two openings which are circular or elliptical in shape by placing the metal mask (1) on a circuit board (2) having an electrode (21) formed in a predetermined pattern to join an end portion of a lead member (6), and moving a printing squeegee along the upper surface of the metal mask (1) to thereby print a lead-free solder paste on the surface of the electrode (21) on the circuit board (2). The method produces on the electrode (21) of the circuit board (2) two lead-free solder paste patterns (30a,30a) each circular or elliptical in shape and arranged in a direction in which the lead member (6) is to extend from the electrode.

Abstract translation: 使用具有圆形或椭圆形形状的两个开口的金属掩模，通过将金属掩模（1）放置在具有形成在其中的电极（21）的电路板（2）上来实现无铅焊膏印刷方法 预定图案以接合引线构件（6）的端部，并且沿着金属掩模（1）的上表面移动印刷刮板，从而在电极（21）的表面上印刷无铅焊膏 电路板（2）。 该方法在电路板（2）的电极（21）上产生两个形状为圆形或椭圆形的无铅焊膏图形（30a，30a），并且沿引导构件（6）延伸的方向 从电极。