公开(公告)号：WO03038865A2

公开(公告)日：2003-05-08

申请号：PCT/US0234923

申请日：2002-10-31

Applicant: VIRTIUM TECHNOLOGY INC

Inventor： NGUYEN CHINH ,  HOANG PHU ,  HOANG PHAN ,  LE ANDY

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H01L

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/0367 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10992 ,  H05K2203/043 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

Abstract translation: 在本发明的一个实施例中，堆叠元件包括印刷电路板（PCB）和多个焊料凸块。 PCB具有顶侧和底侧。 顶侧连接到第一设备的第一个引脚。 多个焊料凸块位于底侧，并附接到第二器件的第二引脚的上部区域，以提供第一引脚和第二引脚之间的电连接。

公开(公告)号：WO0191176A3

公开(公告)日：2002-04-18

申请号：PCT/US0114674

申请日：2001-05-07

Applicant: UNITIVE ELECTRONICS INC ,  RINNE GLENN A

Inventor： RINNE GLENN A

IPC: H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  H01L23/485

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11901 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/10992 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Solder bumps are fabricated by plating a first solder layer (150) on an underbump metallurgy (130), plating a second solder layer (160) having higher melting point than the first solder layer on the first solder layer and plating a third solder layer (170) having lower melting point than the second solder layer on the second solder layer. The structure then is heated to below the melting point of the second solder layer but above the melting point of the first solder layer and the third solder layer, to alloy at least some of the first solder layer with at least some of the underbump metallurgy and to round the third solder layer. Accordingly, a trilayer solder bump may be fabricated wherein the first and third layers melt at lower temperatures than the second solder layer, to thereby round the outer surface of the solder bump and alloy the base of the solder bump to the underbump metallurgy, while allowing the structure of the intermediate layer to be preserved. Solder bump fabrication as described above may be particularly useful with lead-tin solder wherein the first solder layer is eutectic lead-tin solder, the second solder layer is lead-tin solder having higher lead content than eutectic lead-tin solder and the third solder layer is eutectic lead-tin solder. In yet other embodiments, the thickness and/or composition of the outer underbump metallurgy layer and/or of the first solder layer may be selected so that upon heating, sufficient tin from the first solder layer is alloyed with at least some of the outer underbump metallurgy layer, such that the first solder layer is converted to a fourth solder layer having the same lead content as the second solder layer. Bilayer solder bumps thereby may be provided.

Abstract translation: 通过在第一焊料层上电镀第一焊料层（150），在第一焊料层上电镀具有比第一焊料层更高的熔点的第二焊料层（160）并镀覆第三焊料层（ 170），其熔点低于第二焊料层上的第二焊料层。 然后将该结构加热到低于第二焊料层的熔点但高于第一焊料层和第三焊料层的熔点，以使第一焊料层中的至少一些与至少一些下焊管冶金和 绕第三焊料层。 因此，可以制造三层焊料凸块，其中第一和第三层在比第二焊料层更低的温度下熔化，从而使焊料凸块的外表面圆周化，并将焊料凸块的基底合金到底部焊接冶金，同时允许 待保存的中间层的结构。 如上所述的焊料凸块制造对于铅锡焊料尤其有用，其中第一焊料层是共晶铅锡焊料，第二焊料层是比共晶铅锡焊料具有更高铅含量的铅锡焊料，而第三焊料 层是共晶铅锡焊料。 在另外的其它实施例中，可以选择外部底部基质金属层和/或第一焊料层的厚度和/或组成，使得在加热时，来自第一焊料层的足够的锡与至少一些外部底部基底 使得第一焊料层被转换成具有与第二焊料层相同的铅含量的第四焊料层。 可以提供双层焊料凸块。

公开(公告)号：WO01091176A2

公开(公告)日：2001-11-29

申请号：PCT/US2001/014674

申请日：2001-05-07

IPC: H01L21/48 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/10992 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Solder bumps are fabricated by plating a first solder layer (150) on an underbump metallurgy (130), plating a second solder layer (160) having higher melting point than the first solder layer on the first solder layer and plating a third solder layer (170) having lower melting point than the second solder layer on the second solder layer. The structure then is heated to below the melting point of the second solder layer but above the melting point of the first solder layer and the third solder layer, to alloy at least some of the first solder layer with at least some of the underbump metallurgy and to round the third solder layer. Accordingly, a trilayer solder bump may be fabricated wherein the first and third layers melt at lower temperatures than the second solder layer, to thereby round the outer surface of the solder bump and alloy the base of the solder bump to the underbump metallurgy, while allowing the structure of the intermediate layer to be preserved. Solder bump fabrication as described above may be particularly useful with lead-tin solder wherein the first solder layer is eutectic lead-tin solder, the second solder layer is lead-tin solder having higher lead content than eutectic lead-tin solder and the third solder layer is eutectic lead-tin solder. In yet other embodiments, the thickness and/or composition of the outer underbump metallurgy layer and/or of the first solder layer may be selected so that upon heating, sufficient tin from the first solder layer is alloyed with at least some of the outer underbump metallurgy layer, such that the first solder layer is converted to a fourth solder layer having the same lead content as the second solder layer. Bilayer solder bumps thereby may be provided.

Abstract translation: 通过在第一焊料层上电镀第一焊料层（150），在第一焊料层上电镀具有比第一焊料层更高的熔点的第二焊料层（160）并镀覆第三焊料层（ 170），其熔点低于第二焊料层上的第二焊料层。 然后将该结构加热到低于第二焊料层的熔点但高于第一焊料层和第三焊料层的熔点，以使第一焊料层中的至少一些与至少一些下焊管冶金和 绕第三焊料层。 因此，可以制造三层焊料凸块，其中第一和第三层在比第二焊料层更低的温度下熔化，从而使焊料凸块的外表面圆周化，并将焊料凸块的基底合金到底部焊接冶金，同时允许 待保存的中间层的结构。 如上所述的焊料凸块制造对于铅锡焊料尤其有用，其中第一焊料层是共晶铅锡焊料，第二焊料层是比共晶铅锡焊料具有更高铅含量的铅锡焊料，而第三焊料 层是共晶铅锡焊料。 在另外的其它实施例中，可以选择外部底部基质金属层和/或第一焊料层的厚度和/或组成，使得在加热时，来自第一焊料层的足够的锡与至少一些外部底部基底 使得第一焊料层被转换成具有与第二焊料层相同的铅含量的第四焊料层。 可以提供双层焊料凸块。

公开(公告)号：WO00064625A1

公开(公告)日：2000-11-02

申请号：PCT/SE2000/000671

申请日：2000-04-07

IPC: B23K35/02 ,  B23K35/14 ,  H01L23/498 ,  H05K3/34 ,  B23K35/22 ,  H01L23/31

CPC classification number: B23K35/0244 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0435 ,  Y02P70/613 ,  H01L2924/00

Abstract: Solderability of a solder ball of solder having a high melting temperature to be used as an electrical and mechanical connection means in a ball grid array module, is improved by first removing native oxide from the solder ball (8), and, then, to prevent formation of new oxide on the solder ball, depositing a protective layer (9) of a metal enabling soldering of the solder ball by a conventional soldering paste.

Abstract translation: 通过首先从焊球（8）去除原生氧化物，改进了具有高熔点的焊料的焊球可焊接性，以用作球栅阵列模块中的电和机械连接装置，然后防止 在焊球上形成新的氧化物，沉积金属的保护层（9），从而能够通过常规焊膏焊接焊球。

公开(公告)号：WO00004584A2

公开(公告)日：2000-01-27

申请号：PCT/DE1999/002118

申请日：1999-07-06

IPC: H01L23/485 ,  H05K3/32 ,  H05K3/34 ,  H01L23/48 ,  H01L21/60 ,  H01L23/482

CPC classification number: H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

Abstract: The invention relates to a semiconductor component in a chip format, comprising a chip with at least one first insulating layer (3) and electric contact surfaces (2) devoid of said insulating layer. Conductors (5) run from the electric contact surfaces (2) to the foot areas (10) of external connection elements (12) along the insulating layer (3). Another insulating layer (8) is also provided with through openings (9) leading from the outside to the foot areas (10) of the external connection elements (12). A conductive adhesive (11) is placed in said openings (9) and metallic globules (12) are placed at least on the outside thereon. The semiconductor element can also contain a solder paste instead of the conductive adhesive in the through openings (9), whereby the metallized synthetic globules are placed thereon. The invention also relates to a method for producing the semiconductor element thus described.

Abstract translation: 本发明涉及一种半导体器件，芯片格式具有芯片，所述至少一个第一绝缘层（3），并且其自由电连接焊盘（2）。 在第一绝缘层（3）延伸的印制导线（5）的电连接表面（2），通过外部连接元件（12）的支脚部分（10）的。 另一个施加绝缘层（8）设置有通道开口（9），其从所述外端部件的脚部区域（10）根据（12）的外侧引导。 在通道开口（9）上的至少金属珠（12）安装在外部的导电性粘接剂（11）。 半导体元件也可包含一个焊膏代替导电性粘接剂的被放置在金属化的塑料球到通道开口（9）。 本发明还涉及一种用于所述的半导体装置的制造方法。

公开(公告)号：WO98057357A2

公开(公告)日：1998-12-17

申请号：PCT/US1998/010775

申请日：1998-06-09

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L

CPC classification number: H05K3/368 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/09145 ,  H05K2201/0949 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/167 ,  Y02P70/613

Abstract: A multiple circuit board package employing solder balls and method and apparatus for fabricating same. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together using the solder balls. A novel and improved solder ball connection is disclosed, along with a fixture for aligning and fixing the disposition of the pads and the solder balls during a heating cycle in which the circuit boards are placed under pressure while the solder balls are re-flowed for making an electrical connection.

Abstract translation: 使用焊球的多重电路板封装及其制造方法和装置。 使用焊球将两个或多个印刷电路板和多个电子装置连接在一起。 或者，使用焊球将三个或更多个印刷电路板连接在一起。 公开了一种新颖且改进的焊球连接，以及用于在加热循环期间对准和固定焊盘和焊球的布置的固定装置，其中电路板被放置在压力下，同时焊球被重新流动以制造 电气连接。

公开(公告)号：WO98048602A1

公开(公告)日：1998-10-29

申请号：PCT/US1998/007177

申请日：1998-04-09

IPC: H01L23/31 ,  H01L23/498 ,  H05K3/34 ,  H05K3/30 ,  H01L23/48 ,  H01L23/52 ,  H05K3/32

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A ball grid array package (12) utilizes stand-offs having central cores of a material with a higher melting point than solder material surrounding the core. When the ball grid package and motherboard assembly (10) are heated to the melting point of the solder material, the stand-off cores (24) remains solid and function as spacers in preventing direct contact of the package surface and the motherboard surface, thus preventing molten solder balls (14) from being squashed and flowing to adjacent ball contacts.

Abstract translation: 球栅阵列封装（12）利用具有比围绕芯的焊料更高的熔点的材料的中心芯的支架。 当球栅包装和母板组件（10）被加热到焊料材料的熔点时，支架芯（24）保持固体并且用作隔板，以防止封装表面和母板表面的直接接触，因此 防止熔融焊球（14）被挤压并流动到相邻的球接触件。

公开(公告)号：WO1996019913A1

公开(公告)日：1996-06-27

申请号：PCT/US1995016739

申请日：1995-12-19

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  BRADLEY, Edwin, L., III ,  BANERJI, Kingshuk ,  KAZEM-GOUDARZI, Vahid

IPC: H05K03/34

CPC classification number: H05K3/3463 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/04 ,  B23K2101/12 ,  H05K3/1216 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/043

Abstract: A soldering process uses two or more different solder alloys. A first solder alloy (115) that undergoes a solid-to-liquid transition at a first temperature is coated (20) onto the solderable surfaces (105) of a printed circuit board (100). A solder paste (120) that undergoes this solid-to-liquid transition at a temperature greater than the first temperature is deposited on the coated solderable portions, and is heated to a temperature that is above the first temperature but below the second temperature. During this time, the first solder alloy liquifies, while the solder paste does not. The first solder alloy wets to the individual particles in the solder paste, and alloys to the solderable surfaces and the solder particles in the solder paste. The soldering composition is subsequently cooled (40) to solidify the first solder material, forming a solid and substantially planar coating on the solderable portions of the printed circuit board.

Abstract translation: 焊接工艺使用两种或更多种不同的焊料合金。 在第一温度下经历固 - 液过渡的第一焊料合金（115）涂覆（20）到印刷电路板（100）的可焊接表面（105）上。 在大于第一温度的温度下经历该固 - 液过渡的焊膏（120）沉积在涂覆的可焊接部分上，并被加热到高于第一温度但低于第二温度的温度。 在此期间，第一焊料合金液化，而锡膏不发生。 第一焊料合金润湿焊锡膏中的各个颗粒，并将其焊接到可焊接表面和焊膏中的焊料颗粒。 焊接组合物随后被冷却（40）以固化第一焊料材料，在印刷电路板的可焊接部分上形成固体和基本上平面的涂层。

公开(公告)号：WO1995024113A1

公开(公告)日：1995-09-08

申请号：PCT/JP1995000248

申请日：1995-02-21

Applicant: SUMITOMO SPECIAL METALS COMPANY LIMITED ,  MUKAI, Katuhiko ,  NAKANO, Keiji ,  YAMAMOTO,Masaharu

Inventor： SUMITOMO SPECIAL METALS COMPANY LIMITED

IPC: H05K03/34

CPC classification number: H05K3/3436 ,  B22F1/0048 ,  B23K35/0244 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  Y02P70/613

Abstract: A Cu ball superior in mass productivity which is effective as a bump for packaging a semiconductor of a BGA (Ball Grid Array) type and having a high dimensional precision, and a method for producing the same ball. In order words, Cu wires are cut to a standard size and obtained Cu pieces each having predetermined diameter and length are degreased, and then they are disposed in a plurality of holes having predetermined diameter, depth, and surface roughness and formed in a flat individual piece disposing fixture. Then, both the individual piece disposing fixture and individual Cu pieces are heated to be fused in an electric furnace, and then they are cooled at a predetermined cooling speed so that the Cu pieces are solidified into a ball due to the surface tension of fused metal itself, whereby in the case of Cu balls having a final diameter of 2mm or less which is obtained after having been fused and solidified, the sphericity of 90 % or more of Cu balls obtained at the same time is within 3 % of the diameter, and a solder layer or a silver solder layer is applied and formed on the outer circumferential surface of the Cu balls as required.

Abstract translation: 作为用于封装BGA（Ball Grid Array）类型的半导体并且具有高尺寸精度的凸块有效的批量生产率的Cu球以及制造该球的方法。 换句话说，将Cu丝切割成标准尺寸，得到具有预定直径和长度的Cu片脱脂，然后将它们设置在具有预定直径，深度和表面粗糙度的多个孔中，并形成为平坦的个体 零件夹具。 然后，将单件零件夹具和各个Cu片都加热熔化在电炉中，然后以预定的冷却速度冷却，使得Cu片由于熔融金属的表面张力而固化成球 在熔融固化后得到的最终直径为2mm以下的Cu球的情况下，同时获得的Cu球的90度以上的球形度在直径的3％以内， 并且根据需要在Cu球的外周面上涂布并形成焊料层或银焊料层。

公开(公告)号：WO1994023555A1

公开(公告)日：1994-10-13

申请号：PCT/US1994002777

申请日：1994-03-17

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  MELTON, Cynthia ,  FUERHAUPTER, Harry ,  DEMET, George

IPC: H05K03/34

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  Y02P70/611

Abstract: In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.

Abstract translation: 在电子封装中，用于接合引线表面（31,40）的焊料连接（14）由包含第三金属，优选金或银的锡 - 铋合金形成，其量有效地增加合金的熔化温度， 在运行中通常遇到的升高的温度下增强连接的机械性能。 用于形成焊料连接的工艺包括将第三金属的膜（36）施加到至少一个引线表面（31）上，然后将锡 - 铋焊膏（38）施加到膜上。 优选地，将锡 - 铋合金的板（26）首先电镀在其上镀有第三金属的引线表面（31）上。 在加热回流焊料期间，第三金属溶解以产生形成连接的均匀液体。