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    전자유닛
    141.
    发明公开
    전자유닛 失效
    电子单位

    公开(公告)号：KR1020010029776A

    公开(公告)日：2001-04-16

    申请号：KR1020000030229

    申请日：2000-06-02

    Applicant: 알프스 덴키 가부시키가이샤

    Inventor： 나카노가즈히로

    IPC: H05K1/18

    CPC classification number: H01L23/49805 ,  H01L2224/32225 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/10075 ,  H05K2201/10666 ,  H05K2201/10727 ,  Y02P70/613

    Abstract: PURPOSE: An electronic unit is provided to fully dispose a cover to the outer circumference of the upper surface of a circuit board so that the whole upper surface is effectively used as an interconnection pattern, by using connecting conductors installed in each penetration hole to connect the interconnection pattern and a ground pattern on the upper surface with a terminal electrode for interconnection and a terminal electrode for ground on the lower surface of the circuit board. CONSTITUTION: The interconnection pattern(2) and the ground pattern(3) are installed on the upper surface(1a) of the circuit board.(1) Electrical parts(9) are disposed on the circuit board. A cover(8) is installed in the circuit board to cover the electrical parts. The terminal electrode(4) for interconnection and the terminal electrode(5) for ground are installed on the lower surface(1b) of the circuit board. The interconnection pattern and terminal electrode for interconnection and the ground pattern and terminal electrode for ground are connected with a connecting conductor(6,7) installed in a penetration hole.

    Abstract translation: 目的：提供一种电子单元，用于将电路板的上表面的外周完全配置，使得整个上表面被有效地用作互连图案，通过使用安装在每个穿孔中的连接导体来连接 上表面具有用于互连的端子电极的接线图案和接地图案，以及在电路板的下表面上的接地端子电极。 构成：布线图案（2）和接地图案（3）安装在电路板的上表面（1a）上。（1）电气部件（9）设置在电路板上。 电路板上安装有盖（8）以覆盖电气部件。 用于互连的端子电极（4）和用于接地的端子电极（5）安装在电路板的下表面（1b）上。 用于互连的互连图案和端子电极以及用于接地的接地图案和端子电极与安装在穿透孔中的连接导体（6,7）连接。

    Wiring connection part structure of piezoelectric element, piezoelectric actuator, and head suspension
    145.
    发明专利
    Wiring connection part structure of piezoelectric element, piezoelectric actuator, and head suspension 有权
    压电元件，压电致动器和头枕的接线连接部分结构

    公开(公告)号：JP2010154632A

    公开(公告)日：2010-07-08

    申请号：JP2008329222

    申请日：2008-12-25

    Applicant: Nhk Spring Co Ltd ,  日本発條株式会社

    Inventor： ANDO TOSHIKI

    IPC: H02N2/00

    CPC classification number: G11B5/4873 ,  G11B5/486 ,  H01L41/0475 ,  H01L41/0986 ,  H05K3/321 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/10083 ,  H05K2201/10666 ,  Y10T29/42

    Abstract: PROBLEM TO BE SOLVED: To carry out wiring work to a piezoelectric element by keeping high reliability while suppressing the deterioration in the yield of the piezoelectric element. SOLUTION: A through-hole 67 is formed in a terminal member 57, an electric insulation layer 61 side is made to face a piezoelectric element 13 side to allow the terminal member 57 to face a common electrode 19. With a first liquid retaining member 69 interposed in a space between the terminal member 57 and the common electrode plate 19 and in the vicinity of the through-hole 67, a conductive adhesive liquid 71 is filled in the through-hole 67. With a second liquid retaining member 101 interposed so as to surround the first liquid retaining member 69, a sealing adhesive liquid 103 is filled to bury the space between the first and second liquid retaining members 69, 101. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：通过保持高可靠性同时抑制压电元件的产量的劣化，对压电元件进行布线工作。 解决方案：在端子构件57中形成通孔67，使电绝缘层61侧面对压电元件13侧，以使端子构件57面对公共电极19.利用第一液体 保持构件69插入在端子构件57和公共电极板19之间的空间中，并且在通孔67附近，导电粘合剂液体71填充在通孔67中。利用第二液体保持构件101 插入以包围第一液体保持部件69的方式填充密封粘合剂液体103，以填充第一和第二液体保持部件69,101之间的空间。（C）2010，JPO＆INPIT

    Package and electronic device using the same
    147.
    发明专利
    Package and electronic device using the same 有权
    包装和电子设备使用它

    公开(公告)号：JP2007149742A

    公开(公告)日：2007-06-14

    申请号：JP2005338600

    申请日：2005-11-24

    Applicant: Mitsubishi Electric Corp ,  三菱電機株式会社

    Inventor： FUJII YOSHIO ,  FUKUMOTO HIROSHI ,  OGAWA SHINPEI ,  YOKOYAMA YOSHINORI

    IPC: H01L23/02

    CPC classification number: H05K3/3436 ,  B81B7/007 ,  B81C2203/019 ,  H01L23/04 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0284 ,  H05K1/141 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10666 ,  H05K2203/1147 ,  Y02P70/613 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a package or the like which has proper electrical connections and hermetic sealing, after the upper substrate and the lower substrate are jointed via solder.
    SOLUTION: An upper-sealing ring 84 and a lower-sealing ring 82 are stuck via sealing solder 72. The leading edge of a sealing protrusion 6 is narrower than the lower-sealing ring 82. Therefore, the sealing solder 72 is provided on the lower-sealing ring 82 and on a side face of the upper-sealing ring 84. In addition, the upper connection pad 83 and the lower connection pad 81 are stuck via connection solder 71. The leading edge of a connection protrusion 5 is smaller in width than the lower connection pad 81. Thus, the connection solder 71 is provided on the lower connection pad 81 and on a side face of the upper connection pad 83.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：在通过焊料接合上基板和下基板之后，提供具有适当的电连接和气密密封的封装等。 解决方案：上密封环84和下密封环82通过密封焊料72粘合。密封突起6的前缘比下密封圈82窄。因此，密封焊料72是 设置在下密封环82上和上密封环84的侧面上。此外，上连接焊盘83和下连接焊盘81通过连接焊料71粘合。连接突起5的前缘 宽度小于下连接焊盘81.因此，连接焊料71设置在下连接焊盘81和上连接焊盘83的侧面上。版权所有（C）2007，JPO＆INPIT

    Electrical assembly
    149.
    发明专利
    Electrical assembly 有权
    电气总成

    公开(公告)号：JP2006005377A

    公开(公告)日：2006-01-05

    申请号：JP2005253276

    申请日：2005-09-01

    Applicant: Raychem Corp ,  レイケム・コーポレイションRaychem Corporation

    Inventor： FANG SHOU-MEAN ,  SIDEN DENIS ,  THOMPSON MARK ,  ZHANG MICHAEL

    IPC: H01C7/02 ,  H01C1/14 ,  H01C17/065 ,  H01C17/28 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

    CPC classification number: H01C17/28 ,  H01C1/1406 ,  H01C7/027 ,  H01C17/06586 ,  H05K1/182 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10469 ,  H05K2201/10666

    Abstract: PROBLEM TO BE SOLVED: To provide an electrical assembly without adding an electrical wire which connects circuit components, and without a heating effect.
    SOLUTION: The laminar electrical device of a circuit protection device comprises two laminar electrodes equipped with a PTC element between both, and a cross-conductor which passes through the device and contacts with one of the two electrodes. This permits connection to both electrodes from the same side of the device. This makes it possible to carry out preparing the devices on an assembly which corresponds to a number of individual devices with division of the assembly.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供电气组件而不添加连接电路部件并且没有加热效果的电线。 解决方案：电路保护装置的层状电气装置包括在两者之间配备有PTC元件的两个层流电极和穿过该装置并与两个电极之一接触的交叉导体。 这允许从设备的相同侧连接到两个电极。 这使得可以在与组件的划分相对应的多个单独装置的组件上进行装置的准备。 版权所有（C）2006，JPO＆NCIPI

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