公开(公告)号：US06717067B2

公开(公告)日：2004-04-06

申请号：US10198341

申请日：2002-07-18

Applicant: Zhong-You Shi ,  Delin Li ,  Richard McMillan

Inventor： Zhong-You Shi ,  Delin Li ,  Richard McMillan

IPC: H01R1204

CPC classification number: H05K3/429 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract translation: 一种用于制造具有金属化孔38,40,130,132的多层电路板的方法10,110，其可以选择性地和电接地并且具有至少一个形成的空气桥92,178。

公开(公告)号：US20030226688A1

公开(公告)日：2003-12-11

申请号：US10458448

申请日：2003-06-10

Applicant: Visteon Global Technologies, Inc.

Inventor： Vivek A. Jairazbhoy ,  Andrew Z. Glovatsky

IPC: H05K007/20

CPC classification number: H05K1/0203 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0361 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/09736 ,  H05K2201/10166 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.

Abstract translation: 本发明提供了一种电路板，包括形成用于互连电子部件的多个导电电路迹线的第一导体层。 电路板包括用于支撑第一导体层的基板和由基板形成的基座，用于支撑多个电子部件中的至少一个。 基座提供用于将热量远离多个电子部件中的至少一个的热传导路径和邻近基座的基板中的孔，以允许流体通过基板。

公开(公告)号：US06584682B2

公开(公告)日：2003-07-01

申请号：US09812345

申请日：2001-03-20

Applicant: Robert Edward Belke ,  Thomas Bernd Krautheim ,  Vivek Amir Jairazbhoy ,  Delin Li

Inventor： Robert Edward Belke ,  Thomas Bernd Krautheim ,  Vivek Amir Jairazbhoy ,  Delin Li

IPC: H05K320

CPC classification number: H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method 10 for making multi-layer electronic circuit boards 148, 248 having aperture 146, 246 which may be selectively connected to an electrical ground potential.

Abstract translation: 一种用于制造具有孔146,246的多层电子电路板148,248的方法10，其可选择性地连接到电接地电位。

公开(公告)号：US20030102152A1

公开(公告)日：2003-06-05

申请号：US10300049

申请日：2002-11-20

Inventor： Lawrence Leroy Kneisel ,  Mohan Paruchuri ,  Vivek Jairazbhoy ,  Vladimir Stoica

IPC: H05K001/02

CPC classification number: H05K3/4641 ,  H05K3/386 ,  H05K3/4038 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2201/09581 ,  H05K2203/1438

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.

公开(公告)号：US06475703B2

公开(公告)日：2002-11-05

申请号：US09203148

申请日：1998-12-01

Applicant: Delin Li ,  Achyuta Achari ,  Alice Dawn Zitzmann ,  Robert Edward Belke, Jr. ,  Brenda Joyce Nation ,  Edward McLeskey ,  Mohan R. Paruchuri ,  Lakhi Nandlal Goenka

Inventor： Delin Li ,  Achyuta Achari ,  Alice Dawn Zitzmann ,  Robert Edward Belke, Jr. ,  Brenda Joyce Nation ,  Edward McLeskey ,  Mohan R. Paruchuri ,  Lakhi Nandlal Goenka

IPC: G03C556

CPC classification number: H05K3/062 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

Abstract translation: 一种具有空气桥交叉结构的多层电路板及其制造方法，其特征在于，该电路包括专门设计的金属强化层，用于机械地和/或电气地加固电路。

公开(公告)号：US06403893B2

公开(公告)日：2002-06-11

申请号：US09907971

申请日：2001-03-20

Applicant: Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

Inventor： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC: H05K114

CPC classification number: H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49156

Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.

Abstract translation: 一种用于制造具有电镀孔96,98的多层电子电路板136的方法，其可以与电接地构件46选择性地和电隔离，并且还具有结构上由材料支撑的选择性地形成的空气桥和/或交叉构件128 134。

公开(公告)号：US06327149B1

公开(公告)日：2001-12-04

申请号：US09655558

申请日：2000-09-06

Applicant: Lakhi Nandlal Goenka

Inventor： Lakhi Nandlal Goenka

IPC: H05K720

CPC classification number: H05K1/0209 ,  H01L23/38 ,  H01L2924/0002 ,  H05K2201/0361 ,  H05K2201/09781 ,  H05K2201/10219 ,  Y10T428/252 ,  H01L2924/00

Abstract: A multi-layer circuit board with a thermoelectric or “Peltier” cooler and a method forming a multi-layer circuit board with a thermoelectric or “Peltier” cooler is disclosed. The circuit board includes a thermoelectric cooler which is integrally formed within the circuit board and which is effective to efficiently absorb and dissipate heat from the circuit board.

Abstract translation: 公开了一种具有热电或“珀尔帖”冷却器的多层电路板，以及形成具有热电或“珀尔帖”冷却器的多层电路板的方法。 电路板包括一体形成在电路板内的热电冷却器，其有效地有效地吸收和散发来自电路板的热量。

公开(公告)号：US20010045407A1

公开(公告)日：2001-11-29

申请号：US09815364

申请日：2001-03-22

Inventor： Bharat Patel ,  Jay D. Baker ,  Mohan Paruchuri

IPC: H01B013/00

CPC classification number: H05K3/44 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536

Abstract: A method 10 for making a multi-layer electronic circuit board 98 having at least one electrically conductive protuberance 15 which forms a nullvianull and which traverses through the various layers of the electric circuit board 98, and further having at least one interconnection portion 102 which supports a wide variety of components and interconnection assemblies.

Abstract translation: 一种用于制造多层电子电路板98的方法10，该多层电子电路板98具有形成“通孔”的至少一个导电突起15，并穿过电路板98的各个层，并且还具有至少一个互连部分102 其支持各种组件和互连组件。

公开(公告)号：US06271481B1

公开(公告)日：2001-08-07

申请号：US09146514

申请日：1998-09-03

Applicant: Lakhi Nandlal Goenka ,  Jay DeAvis Baker

Inventor： Lakhi Nandlal Goenka ,  Jay DeAvis Baker

IPC: H01R909

CPC classification number: H05K1/111 ,  H05K3/062 ,  H05K3/205 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2203/0376 ,  Y02P70/611

Abstract: There is disclosed herein a tri-metal-layer precircuit 50 which may be selectively etched to provide a multilayer electronic circuit 60 having air bridge crossovers 49. The enlarged ends 44 of the upper air bridge elements 42, and/or the top pads 41 of the tower elements 43, are specially designed such that undercutting of the ends 44 and/or top pads 41 is minimized, thereby minimizing the risk of air bridge/top pad delamination.

Abstract translation: 这里公开了三金属层预热电路50，其可以被选择性地蚀刻以提供具有空气桥接器49的多层电子电路60.上部空气桥接元件42的扩大端部44和/或上部空气桥接元件42的顶部焊盘41 塔元件43被特别设计成使端部44和/或顶部焊盘41的底切最小化，从而最小化空气桥/顶垫分层的风险。

公开(公告)号：US06248247B1

公开(公告)日：2001-06-19

申请号：US09203146

申请日：1998-12-01

Applicant: Lakhi Nandlal Goenka ,  Mohan R. Paruchuri

Inventor： Lakhi Nandlal Goenka ,  Mohan R. Paruchuri

IPC: H01B1300

CPC classification number: H05K3/4685 ,  H05K3/06 ,  H05K3/062 ,  H05K3/20 ,  H05K2201/0338 ,  H05K2201/0361 ,  H05K2203/0152 ,  H05K2203/0361

Abstract: There is disclosed herein a multilayer circuit board having air bridge crossover structures and a subtractive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers which provide mechanical and/or electrical fortification to the circuit.

Abstract translation: 这里公开了具有空气桥交叉结构的多层电路板及其制造方法，其中电路包括为电路提供机械和/或电气设防的专门设计的金属防腐层。