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    Double-sided flexible electronic circuit module
    152.
    发明授权
    Double-sided flexible electronic circuit module 失效
    双面柔性电子电路模块

    公开(公告)号：US4567543A

    公开(公告)日：1986-01-28

    申请号：US466466

    申请日：1983-02-15

    Applicant: Jay J. Miniet

    Inventor： Jay J. Miniet

    IPC: H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/38 ,  H05K1/00

    CPC classification number: H05K1/189 ,  H05K3/3415 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/096 ,  H05K2201/1034 ,  H05K2201/10462 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/1311 ,  H05K2203/1572 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/284 ,  H05K3/305 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/386 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A double-sided flexible electronic circuit module is provided having a flexible printed circuit board. The flexible circuit board has a plurality of conductive paths on each surface and a plurality of conductively plated-through apertures being connected to the conductive paths. One side of the flexible circuit board is adapted to carry components with leads; the other side of the flexible circuit board is adapted to receive components without leads. A carrier member, larger than the flexible circuit board and of a size and shape sufficient to accommodate the placement of at least one flexible circuit board, is also provided. The carrier member has a plurality of apertures which are in alignment with the apertures of the flexible circuit board, and a plurality of elongated slots in predetermined positions which extend the entire width of the flexible circuit board which is temporarily affixed onto the carrier member. All of the components are soldered to the flexible circuit board, the carrier member acting as a support member to the components having leads.

    Abstract translation: 提供具有柔性印刷电路板的双面柔性电子电路模块。 柔性电路板在每个表面上具有多个导电路径，并且多个电导通孔与导电路径连接。 柔性电路板的一侧适用于携带带导线的部件; 柔性电路板的另一侧适于接收不带引线的部件。 还提供了大于柔性电路板的载体构件以及足以容纳至少一个柔性电路板的放置的尺寸和形状。 载体构件具有与柔性电路板的孔对准的多个孔，以及在预定位置上的多个细长槽，其延伸柔性电路板的整个宽度，该柔性电路板临时固定在承载构件上。 所有的部件被焊接到柔性电路板上，承载部件用作具有引线的部件的支撑部件。

    Arrangement for the connection of an electrode to a support
    153.
    发明授权
    Arrangement for the connection of an electrode to a support 失效
    用于将电极连接到支撑体的布置

    公开(公告)号：US4467401A

    公开(公告)日：1984-08-21

    申请号：US513000

    申请日：1983-07-12

    Applicant: Rainer Siebert ,  Erich Bock

    Inventor： Rainer Siebert ,  Erich Bock

    IPC: H01G9/08 ,  H05K3/30 ,  H05K7/12 ,  H01G1/14

    CPC classification number: H05K3/305 ,  H01G9/08 ,  H01L2924/0002 ,  H05K2201/10462 ,  H05K2203/049 ,  Y02P70/613

    Abstract: An arrangement for the mechanical fastening and electrical connection of a pellet, particularly a tantalum pellet, covered with a surface-adherent electrode, to a support. The electrode cannot be subjected to inertial forces of the pellet. An intermediate sheathing is positioned between the electrode and the support. The sheathing non-adhesively encompasses the pellet in a form-fitting manner. The intermediate sheathing is glued to the support. The electrode is electrically connected with the support through a flexible conductor element.

    Abstract translation: 用于将表面粘附电极覆盖的颗粒，特别是钽颗粒机械紧固和电连接到支撑件的装置。 电极不能受到颗粒的惯性力。 中间护套位于电极和支架之间。 护套以形式配合的方式非粘合地包住沉淀物。 中间护套粘合到支撑件上。 电极通过柔性导体元件与支撑件电连接。

    Electromagnetic relay
    156.
    发明专利
    Electromagnetic relay 审中-公开
    电磁继电器

    公开(公告)号：JP2010113842A

    公开(公告)日：2010-05-20

    申请号：JP2008283336

    申请日：2008-11-04

    Applicant: Fujitsu Component Ltd ,  富士通コンポーネント株式会社

    Inventor： TAKANO SATORU

    IPC: H01H50/14 ,  H01H45/04

    CPC classification number: H01H50/047 ,  H01H50/14 ,  H01H2050/044 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/10462 ,  H05K2201/10818

    Abstract: PROBLEM TO BE SOLVED: To provide a novel electromagnetic relay of low profile which has a simple and rational configuration.
    SOLUTION: The electromagnetic relay 1 includes a body part consisting of a holding block 10 to which various components such as a coil are fitted and a cover 20 attached to it, with the appearance being a rectangular solid. Terminals 5, 6, 7, and 8, having plate-like structure protrude from the body part. They protrude from the first plane A extending parallel to the thinnest direction of the body part, bend to be parallel to the thinnest direction of the body part in the plane vertical to the plate thickness direction of the terminals 5, 6, 7, and 8 and then extend beyond the second plane B across the thinnest direction of the body part. Since the tips of the terminals 5, 6, 7, and 8 extending beyond the second plane B of the body part are mounted on a substrate 30, the electromagnetic relay 1 is secured in such manner as the thinnest direction of the body part is vertical to the surface of the substrate 30.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种具有简单合理配置的低频电磁继电器。 解决方案：电磁继电器1包括主体部分，其由诸如线圈的各种部件装配的保持块10和附接到其上的盖20组成，外观为矩形固体。 具有板状结构的端子5,6,7和8从主体部分突出。 它们从平行于主体部分最薄方向延伸的第一平面A突出，弯曲成与垂直于端子5,6,7和8的板厚度方向的平面垂直于主体部分的最薄方向 然后穿过身体部分最薄的方向延伸超过第二平面B. 由于延伸超过主体部分的第二平面B的端子5,6,7和8的端部安装在基板30上，所以电磁继电器1以如下方式固定：主体部分的最薄方向垂直 到底板30的表面。（C）2010，JPO＆INPIT

    Component fixing method
    158.
    发明专利
    Component fixing method 有权
    组件固定方法

    公开(公告)号：JP2008283032A

    公开(公告)日：2008-11-20

    申请号：JP2007126604

    申请日：2007-05-11

    Applicant: Yazaki Corp ,  矢崎総業株式会社

    Inventor： KAWAMURA YOSHIHIRO

    IPC: H05K3/34

    CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10015 ,  H05K2201/10462 ,  H05K2201/10598 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K2203/0588 ,  Y10T29/43 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

    Abstract: PROBLEM TO BE SOLVED: To improve vibration resistance by securely fixing a large-sized film capacitor upon packaging the film capacitor for use in a high voltage circuit on a printed board. SOLUTION: A resist 7 is formed on a printed board 1 with a predetermined thickness excluding an electrode opposing part 1a (Fig.a), and on the resist 7, a silk printing layer 9 is formed with a predetermined thickness (Fig.b). Thereafter, a recessed part 2b of a film capacitor 2 is stacked on the silk printing layer 9 with a predetermined thickness double-sided tape 6, and an electrode 2a of the film capacitor 2 is opposed to the electrode opposing part 1a of the printed board 1 (Fig.d). The total thickness of the resist 7, the silk printing layer 9, and the double sided tape 6 is made to be larger than the unevenness L1 of the film capacitor 2 to avoid interference between the electrode 2a of the film capacitor 2 and the printed board 1. Because no adhesive is used, it is possible to eliminate the problem of environmental load materials and also it is possible to remove difficulty accompanied by the management of the adhesive. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：通过在将印刷电路板上的高压电路中使用的薄膜电容器封装在一起时，通过牢固地固定大尺寸的薄膜电容器来提高抗振性。 解决方案：除了电极对置部分1a（图a）之外，在具有预定厚度的印刷电路板1上形成抗蚀剂7，并且在抗蚀剂7上形成具有预定厚度的丝印层9（图 .B）。 此后，将薄膜电容器2的凹部2b以预定厚度的双面胶带6堆叠在丝印层9上，并且薄膜电容器2的电极2a与印刷电路板的电极对置部分1a相对 1（图d）。 使抗蚀剂7，丝印层9和双面胶带6的总厚度大于胶片电容器2的不匀度L1，以避免胶片电容器2的电极2a与印刷电路板 因为不使用粘合剂，可以消除环境负载材料的问题，并且可以消除伴随着粘合剂的管理的困难。 版权所有（C）2009，JPO＆INPIT

    Electronic component holder
    159.
    发明专利
    Electronic component holder 审中-公开
    电子元件支架

    公开(公告)号：JP2007317774A

    公开(公告)日：2007-12-06

    申请号：JP2006144022

    申请日：2006-05-24

    Applicant: Funai Electric Co Ltd ,  船井電機株式会社

    Inventor： FUKUMOTO YASUYUKI

    IPC: H05K7/12

    CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component holder of advantage for manufacturability and economical efficiency without the increase in parts count or assembly man-day, and also without substantial increase in manufacturing cost, which can prevent the electronic component from omission by securing simply and firmly the lead of the electronic component.
    SOLUTION: The electronic component holder made of synthetic resin is constituted such that: two or more horizontal grooves 3 making the electronic component leads pass from an opening 6 in front of the holder are formed in an upper surface 7 of the holder, and two or more vertical grooves 4 making the electronic component leads pass by bending them almost at right angles are formed in a rear surface 8 of the holder. As a lead fixing means for carrying out pinch pressure fixing of the lead by using the resiliency of the synthetic resin, an electronic component holder H is used wherein synthetic resin ribs 13a and 13b are formed integrally along the vertical grooves 4 so that the width of the upper end of the vertical groove 4 may be made larger than the diameter of the lead, and the groove width of the lower end may be narrower than the diameter of the lead. Thus, the lead is fixed by pinch pressure fixing by using the resiliency of the synthetic resin ribs 13a and 13b so as to prevent the electronic component from omission.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供可制造性和经济性优势的电子部件保持器，而不增加零件数量或组装人员日，并且也不会大大增加制造成本，这可以防止电子部件省略 通过简单牢固地确保电子部件的引导。 解决方案：由合成树脂制成的电子部件保持器构成为：使得电子部件引线的两个或更多个水平槽3从保持器前面的开口6通过，形成在保持器的上表面7中， 并且在保持器的后表面8中形成有两个或更多个使电子元件引线几乎成直角弯曲的垂直槽4。 作为用于通过使用合成树脂的弹性进行引线的压紧固定的引线固定装置，使用电子部件保持器H，其中合成树脂肋13a和13b沿着垂直槽4一体地形成，使得 可以使垂直槽4的上端大于引线的直径，并且下端的槽宽度可以比引线的直径窄。 因此，通过使用合成树脂肋13a和13b的弹性通过夹紧压力固定导线，以防止电子部件的遗漏。 版权所有（C）2008，JPO＆INPIT

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