公开(公告)号：EP2091078A4

公开(公告)日：2010-03-24

申请号：EP07831416

申请日：2007-11-08

Applicant: NIHON DEMPA KOGYO CO

Inventor： YAMADA HIROAKI

IPC: H01L23/12 ,  H03H9/02 ,  H05K3/34

CPC classification number: H05K3/3442 ,  B81B7/0051 ,  B81B2207/07 ,  H01L23/49838 ,  H01L2224/16225 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/1021 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10909 ,  Y02P70/613

公开(公告)号：EP1262782A3

公开(公告)日：2009-06-17

申请号：EP02014918.3

申请日：1995-11-15

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R1/073 ,  H01L21/66 ,  G01R31/28

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: The invention provides a method of testing semiconductor devices (702, 704), prior to their being singulated from a semiconductor wafer. Said method comprises the following steps: permanently mounting a plurality of resilient contact structures (708) directly to a plurality of first terminals on at least one semiconductor device (702, 704) which is resident on a semiconductor wafer, each of said resilient contact structures having a tip and extending from a surface of the semiconductor device; urging a substrate (710) having a plurality of second terminals (712) towards the surface of the semiconductor device to effect a plurality of electrical connections between respective ones of the second terminals and tips of the resilient contact structures; and providing signals to the second terminals of the substrate to exercise the semiconductor device.

公开(公告)号：EP1919031A1

公开(公告)日：2008-05-07

申请号：EP06797002.0

申请日：2006-08-23

Applicant: DDK Ltd.

Inventor： MORIUCHI, Hiroyuki ,  OMORI, Hideo ,  SHIMIZU, Haruki

IPC: H01R4/02 ,  H01R12/04 ,  H01R12/32 ,  H01R43/16 ,  H05K1/18

CPC classification number: H05K3/3447 ,  H01R4/028 ,  H01R13/03 ,  H01R43/16 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/0315 ,  H05K2203/107

Abstract: A microcontact according to the invention is less than 10 mm in length and composed of a conductive basis material, a base surface treatment layer formed thereon, and an upper surface treatment layer, and includes a contact portion, a terminal portion, and an intermediate portion formed over its entire circumference with exposed oxide surfaces of the base surface treatment layer. The exposed oxide surfaces are formed by irradiating the front and rear surfaces of the contact with laser beams at respective predetermined inclined angles to remove the upper surface treatment layer and simultaneously to oxidize the narrow base surface treatment layer exposed by the removal of the upper surface treatment layer. In this manner, the exposed oxide surfaces can be formed with a high accuracy in a simple manner for stopping solder rise at a predetermined position when the terminal portion of the microcontact is jointed to a substrate by soldering.

Abstract translation: 根据本发明的微接触体的长度小于10mm，由导电基材，形成在其上的基面处理层和上表面处理层组成，并且包括接触部分，端子部分和中间部分 在其整个圆周上形成有暴露的基底表面处理层的氧化物表面。 暴露的氧化物表面通过以相应的预定倾斜角将激光束的前表面和后表面照射以除去上表面处理层并同时氧化通过去除上表面处理而暴露的窄基面处理层而形成 层。 以这种方式，当通过焊接将微接触体的端子部分接合到基板上时，可以以简单的方式以高精度形成暴露的氧化物表面，以阻止在预定位置处的焊料上升。

公开(公告)号：EP1326079B1

公开(公告)日：2007-07-04

申请号：EP03003496.1

申请日：1999-12-02

Applicant: FormFactor, Inc.

Inventor： Eldridge, Benjamin N. ,  Grube, Gary W. ,  Mathieu, Gaetan L.

IPC: G01R1/073 ,  G01R31/316

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.

Abstract translation: 探针卡（321）被设置用于使具有凸起的接触元件的电子部件接触。 特别地，本发明可用于使半导体晶片（310）与诸如弹簧的弹性接触元件（301）接触。 探针卡（321）被设计成具有与晶片（310）上的接触元件配合的端子。 在优选实施例中，终端是帖子。 在优选实施例中，端子包括适于重复接触的接触材料。 在一个特别优选的实施例中，空间变压器（324）准备有一侧的接触柱和另一侧的端子。 具有弹簧触点（333,334）的内插器（325）将空间变换器（324）的相对侧上的触点（335）连接到探针卡（321）上的相应端子（332），该端子（332） 又连接到可连接到诸如传统测试器的测试装置的终端（331）。

公开(公告)号：EP1622225B1

公开(公告)日：2007-02-28

申请号：EP05106937.5

申请日：2005-07-27

Applicant: Tyco Electronics AMP K.K.

Inventor： Yamagami, Hidehisa Tyco Electronics AMP K.K. ,  Nishida, Atsushi ,  Minikata, Masato ,  Kobayashi, Hiroshi ,  Furuyama, Ken Tyco Electronics AMP K.K.

IPC: H01R13/03 ,  H01R4/02

CPC classification number: H01R13/03 ,  H01R4/02 ,  H01R12/716 ,  H01R43/0256 ,  H05K3/3447 ,  H05K2201/10909

公开(公告)号：EP1441232A2

公开(公告)日：2004-07-28

申请号：EP04005887.7

申请日：1995-11-15

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R1/073

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: A method of making a temporary connection between a first electronic component and a second electronic component, and subsequently making a permanent connection between the first electronic component and a third electronic component, comprising permanently mounting a plurality of resilient contact structures to a surface of the first electronic component; urging the first electronic component against the second electronic component to effect a temporary connection between the first electronic component and the second electronic component; removing the second electronic component; and mounting the first electronic component to the third electronic component.

Abstract translation: 一种在第一电子部件和第二电子部件之间进行临时连接的方法，并且随后在第一电子部件和第三电子部件之间进行永久连接，包括将多个弹性接触结构永久性地安装到第一电子部件的表面上 电子元器件; 推动所述第一电子部件抵靠所述第二电子部件以实现所述第一电子部件和所述第二电子部件之间的临时连接; 去除第二电子部件; 以及将所述第一电子部件安装到所述第三电子部件。

公开(公告)号：EP1326079A3

公开(公告)日：2004-05-19

申请号：EP03003496.1

申请日：1999-12-02

Applicant: FORMFACTOR, INC.

Inventor： Eldridge, Benjamin N. ,  Grube, Gary W. ,  Mathieu, Gaetan L.

IPC: G01R1/073 ,  G01R31/316

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.

公开(公告)号：EP1374654A1

公开(公告)日：2004-01-02

申请号：EP02753633.3

申请日：2002-03-14

Applicant: Aavid Thermalloy, LLC

Inventor： FISHER, Francis, Edward ,  BOWLES, Russell

IPC: H05K7/20

CPC classification number: H05K3/341 ,  H01L23/3672 ,  H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K3/3421 ,  H05K2201/066 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2081 ,  H05K2203/0315 ,  Y02P70/613 ,  H01L2924/00

Abstract: A composite heat sink device (1) includes a heat sink body (2, 3) formed of aluminum, the body (2, 3) having a pair of coplanar surfaces (4), and a thermally conductive solderable element (5), for example of copper, mechanically fixed to each of the coplanar surfaces (4). Each of the solderable elements has a first surface which is contiguous with one of the coplanar surfaces, and a second surface which is soldered to a printed circuit board.

Abstract translation: 一种复合散热装置（1），包括由铝形成的散热器本体（2,3），所述本体（2,3）具有一对共面表面（4）和导热可焊接元件（5），所述导热可焊接元件 铜的例子，机械固定到每个共面表面（4）。 每个可焊接元件具有与共面表面中的一个邻接的第一表面和焊接到印刷电路板的第二表面。

公开(公告)号：EP1135693B1

公开(公告)日：2003-06-04

申请号：EP99963010.6

申请日：1999-12-02

Applicant: FORMFACTOR, INC.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  MATHIEU, Gaetan, L.

IPC: G01R31/316

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.

公开(公告)号：EP1280223A1

公开(公告)日：2003-01-29

申请号：EP02022883.9

申请日：1997-03-18

Applicant: NGK Spark Plug Company Limited

Inventor： Ito, Kenji, c/o NGK Spark Plug Co., Ltd.

IPC: H01P11/00 ,  H01P1/205

CPC classification number: H01P11/007 ,  H01P1/2056 ,  H05K1/0243 ,  H05K3/282 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/1006 ,  H05K2201/10909 ,  H05K2201/10969 ,  Y02P70/613

Abstract: In a dielectric filter to be mounted on a printed circuit board, a conductive layer (x) formed on the surface of a dielectric substrate (1) includes an electroless copper-plated layer (m) formed on the surface of the substrate, and a conductive covering layer (n) having good dielectric conductivity and good solder wettability and formed on the surface of the electroless copper-plated layer (m). In place of the conductive covering layer (n) or in addition to the conductive covering layer (n), there is provided a protective synthetic resin layer (p) which covers the electroless copper-plated layer (m) or the conductive covering layer (n) and which vanishes upon exposure to heat of molten solder (25). Even when the conductive layer (x) is formed by electroless copper-plating, the conductive layer (x) is free from stain. Moreover, a terminal portion of the conductive layer (x) formed on the surface of the dielectric filter (1) can be soldered to a conductive path formed on a printed circuit board to thereby establish electric connection therebetween.

Abstract translation: 在安装在印刷电路板上的介质滤波器中，形成在介质基片（1）表面上的导电层（x）包括形成在基片表面上的无电镀铜层（m），和 导电覆盖层（n）具有良好的介电导电性和良好的焊料润湿性并形成在无电镀铜层（m）的表面上。 代替导电覆盖层（n）或除了导电覆盖层（n）之外，还提供覆盖无电镀铜层（m）或导电覆盖层（p）的保护性合成树脂层（p） n）并且在暴露于熔融焊料（25）的热量时消失。 即使当通过无电镀铜形成导电层（x）时，导电层（x）也没有污点。 而且，形成在介质滤波器（1）的表面上的导电层（x）的端子部分可以焊接到形成在印刷电路板上的导电路径，从而建立它们之间的电连接。