Symmetric memory cell and BNN circuit

    公开(公告)号:US12205630B2

    公开(公告)日:2025-01-21

    申请号:US18005101

    申请日:2020-08-24

    Abstract: Provided are a symmetric memory cell and a BNN circuit. The symmetric memory cell includes a first complementary structure and a second complementary structure, the second complementary structure being symmetrically connected to the first complementary structure in a first direction, wherein the first complementary structure includes a first control transistor configured to be connected to the second complementary structure, the second complementary structure includes a second control transistor, a drain electrode of the second control transistor and a drain electrode of the first control transistor being symmetrically arranged in the first direction and connected to a bit line, and the symmetric memory cell is configured to store a weight value 1 or 0.

    Method for manufacturing semiconductor device

    公开(公告)号:US12198930B2

    公开(公告)日:2025-01-14

    申请号:US17630674

    申请日:2021-11-12

    Abstract: A method for manufacturing a semiconductor device. A photolithographic coating, including a first film, a photolithographic film, and a second film, is formed on the to-be-connected structure. Refractive indexes of the first film and the second film are smaller than 1, so that the photolithographic coating forms an optical structure with a high reflection coefficient. The photolithographic coating is exposed to a light having a target wavelength through a mask. The to-be-connected structure is reflected in the photolithographic coating, and hence serves as another mask and is imaged to the photolithographic film. A pattern of the mask is simultaneously imaged to the photolithographic film. That is, both the to-be-connected structure and the pattern of the mask are imaged to a target region of the photolithographic film, and the target region corresponds to the to-be-connected structure.

    Data recovery method for flash memory

    公开(公告)号:US12197282B2

    公开(公告)日:2025-01-14

    申请号:US18553929

    申请日:2021-04-08

    Abstract: A data recovery method for a flash memory includes: reading data from the flash memory by using preset read voltage; calculating a check node error rate corresponding to the data; calculating a read voltage adjustment step size according to the check node error rate; adjusting the preset read voltage according to the read voltage adjustment step size and reading data from the flash memory by using the adjusted preset read voltage, and repeating the operation of calculating a check node error rate corresponding to the data to operation of adjusting the preset read voltage according to the read voltage adjustment step size and reading data from the flash memory by using the adjusted preset read voltage, until the check node error rate is minimum; and selecting a read voltage corresponding to the minimum check node error rate to read data from the flash memory, so as to perform data recovery.

    In-memory computing using SOT-MRAM
    164.
    发明授权

    公开(公告)号:US12154609B2

    公开(公告)日:2024-11-26

    申请号:US17821783

    申请日:2022-08-23

    Abstract: A magnetoresistive memory cell includes a first magnetic tunnel junction, a second magnetic tunnel junction and a metal layer. The first magnetic tunnel junction and the second magnetic tunnel junction each are disposed on the metal layer; the metal layer is configured to pass write current, a projection line of an easy axis of the first magnetic tunnel junction on a plane where the metal layer is located forms a first angle against a direction of the write current, and a projection line of an easy axis of the second magnetic tunnel junction on the plane where the metal layer is located forms a second angle against a direction opposite to the direction of the write current; the first angle and the second angle are all less than 90°; the first magnetic tunnel junction and the second magnetic tunnel junction are configured to pass read current.

    GATE-ALL-AROUND TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240379764A1

    公开(公告)日:2024-11-14

    申请号:US18533891

    申请日:2023-12-08

    Abstract: A gate-all-around transistor and a method for manufacturing the same. The gate-all-around transistor comprises: a semiconductor substrate; an active structure disposed on the semiconductor substrate, where the active structure comprises a source, a drain, and a channel between the source and the drain; a doped epitaxial structure, where a portion of the semiconductor substrate beneath the channel is recessed to form a first groove, the first groove is fully filled with the doped epitaxial structure, and primary carriers of the doped epitaxial structure are opposite in polarity to primary carriers of the source and the drain; and a gate stack structure surrounding the channel, where a portion of the gate stack structure beneath the channel is disposed between the doped epitaxial structure and the channel.

Patent Agency Ranking