응력 감소층을 갖는 기밀 밀봉된 패키지
    164.
    发明公开
    응력 감소층을 갖는 기밀 밀봉된 패키지 审中-实审
    具有应力减少层的人造密封包装

    公开(公告)号:KR1020160146879A

    公开(公告)日:2016-12-21

    申请号:KR1020167032332

    申请日:2014-08-11

    Abstract: 웨이퍼구조체및 상에배치된장치및 장치웨이퍼에접합된리드구조체를갖는밀봉된패키지이다. 상기장치웨이퍼는, 기판; 상기장치주위에기판의표면부분상에배치된금속고리및 상기금속고리에배치된접합물질을포함한다. 상기금속고리의제1층은기판의표면부분의연성보다높은연성을갖고, 상기접합물질의폭보다큰 폭을갖는, 응력완화완충층을포함한다. 금속고리는상기접합물질의내부에지및 외부에지중 적어도하나를넘어서측면으로연장된다. 상기응력완화완충층의열팽창계수는상기기판의표면부분의팽창계수보다크고접합물질의팽창계수보다작다.

    Abstract translation: 密封包装,其具有设置在晶片结构上的装置102和结合到装置晶片的盖结构108。 器件晶片包括:衬底104; 设置在设备周围的基板的表面部分上的金属环107DW和设置在金属环上的接合材料118。 金属环的第一层包括具有比衬底的表面部分更高的延展性的应力消除缓冲层109DW以及大于接合材料的宽度的宽度。 金属环横向延伸超出接合材料的内边缘和外边缘中的至少一个。 应力消除缓冲层的热膨胀系数大于衬底表面部分的膨胀系数,小于接合材料的膨胀系数。

    적외선 검출기
    165.
    发明公开
    적외선 검출기 审中-实审
    红外探测器

    公开(公告)号:KR1020130050710A

    公开(公告)日:2013-05-16

    申请号:KR1020110115922

    申请日:2011-11-08

    Inventor: 남성현 박해석

    Abstract: PURPOSE: An infrared detector is provided to increase the temperature of an absorbing body effectively by the generation of heat caused by absorbing infrared rays. CONSTITUTION: An infrared detector(10) comprises a substrate(11), a resonator(30), a thermoelectric material layer(50), a lead line(60), a thermal isolation layer(70), and a ground plate layer(90). The resonator absorbs infrared rays becoming incident. The thermoelectric material layer is in contact to the resonator, and a resistance value of the thermoelectric material layer is varied according to a temperature change caused by the absorbed infrared rays. The lead line electrically connects the thermoelectric material layer and the substrate. The thermal isolation layer is arranged between the substrate and the thermoelectric material layer, thereby preventing thermal transmission to the substrate. The ground plate layer prevents the infrared rays toward the substrate.

    Abstract translation: 目的:提供红外检测器,通过吸收红外线产生的热量有效地增加吸收体的温度。 构成:红外检测器(10)包括衬底(11),谐振器(30),热电材料层(50),引线(60),热隔离层(70)和接地板层 90)。 谐振器吸收红外线入射。 热电材料层与谐振器接触,并且热电材料层的电阻值根据由吸收的红外线引起的温度变化而变化。 引线将热电材料层和基板电连接。 热隔离层设置在基板和热电材料层之间,从而防止热传递到基板。 接地板层防止红外线朝向基板。

    뒤틀림 현상이 개선된 멤스형 적외선 센서 및 그 제조 방법
    166.
    发明公开
    뒤틀림 현상이 개선된 멤스형 적외선 센서 및 그 제조 방법 失效
    具有改进的机械稳定性的微型测量仪及其制造方法

    公开(公告)号:KR1020090063371A

    公开(公告)日:2009-06-18

    申请号:KR1020070130698

    申请日:2007-12-14

    Abstract: A MEMS infrared sensor and a manufacturing method thereof are provided to improve a characteristic of the sensor by increasing an area of a senor unit by reducing the area occupied by a support arm. A sacrificial layer is formed on a substrate(10) including a reflective film. A step(12) for a support arm structure of the three-dimensional structure is formed. An anchor(13) is patterned in a lower part of the step. A lower protective film(14) is deposited in the front side of the sacrificial layer. A contact hole(15) is formed in the lower protective film. An electrode(16) is formed on the lower protective film of the support arm structure. A sensor material(17) is deposited in the front side of the sacrificial layer. An upper protective film(18) is deposited in the front side of the sacrificial layer. A path(19) of the etchant material is formed by patterning the upper protective film.

    Abstract translation: 提供了一种MEMS红外传感器及其制造方法,通过减小支撑臂占据的面积来增加传感器单元的面积来提高传感器的特性。 在包括反射膜的基板(10)上形成牺牲层。 形成用于三维结构的支撑臂结构的台阶(12)。 锚(13)在台阶的下部被图案化。 在牺牲层的前侧沉积下保护膜(14)。 在下保护膜中形成接触孔(15)。 电极(16)形成在支撑臂结构的下保护膜上。 传感器材料(17)沉积在牺牲层的前侧。 在牺牲层的前侧沉积上保护膜(18)。 蚀刻剂材料的路径(19)通过图案化上保护膜而形成。

    적외선 검출기
    167.
    发明授权

    公开(公告)号:KR101861147B1

    公开(公告)日:2018-05-28

    申请号:KR1020110115922

    申请日:2011-11-08

    Inventor: 남성현 박해석

    Abstract: 적외선검출기가개시된다. 개시된적외선검출기는, 기판으로부터이격되어있으며입사되는적외선을흡수하는공진기와, 공진기에접하며흡수된적외선에의한온도변화에따라저항값이변하도록된 열전재료층을구비한다. 열전재료층과기판사이는리드선에의해전기적으로연결된다. 열격리층은, 기판과열전재료층사이에마련되어기판으로의열전달을차단한다. 그라운드평판층은, 적외선광이기판쪽으로진행하는것을차단한다.

    이중의 밀봉 링을 포함하는 웨이퍼 레벨 MEMS 패키지
    168.
    发明公开
    이중의 밀봉 링을 포함하는 웨이퍼 레벨 MEMS 패키지 审中-公开
    带双密封圈的晶圆级MEMS封装

    公开(公告)号:KR20180015742A

    公开(公告)日:2018-02-13

    申请号:KR20187000434

    申请日:2016-04-20

    Abstract: MEMS(microelectromechanical systems) 패키지는길이를규정하기위해제1 쌍의외부에지들과폭을규정하기위해제2 쌍의외부에지들사이에서연장하는기판을포함한다. 밀봉링 조립체는기판상에배치되고그리고적어도하나의 MEMS 디바이스에인접한제1 경계지점및 외부에지들중 적어도하나의에지에인접한제2 경계지점을생성하는적어도하나의밀봉링을포함한다. 패키지는적어도하나의 MEMS 디바이스를포함하는밀봉갭을규정하기위해밀봉링 조립체상에윈도우리드를더 포함한다. 밀봉링 조립체는, 밀봉갭 내로의윈도우리드의휨이감소되도록제2 경계지점에서기판에윈도우리드를앵커링한다.

    Abstract translation: 微机电系统(MEMS)封装包括在第二对外边缘之间延伸的基底以限定第一对外边缘和限定长度的宽度。 该密封环组件包括至少一个密封环,该至少一个密封环设置在基底上并且产生与至少一个MEMS装置相邻的第一边界点和与外边缘的至少一个边缘相邻的第二边界点。 封装还包括在密封环组件上的窗口引线以限定包括至少一个MEMS器件的密封间隙。 密封环组件将窗口引线在第二边界点处锚定到基底,从而减少窗口引线进入密封间隙的翘曲。

    MEMS 센서 패키징 및 그 방법
    169.
    发明公开
    MEMS 센서 패키징 및 그 방법 有权
    MEMS传感器及其方法

    公开(公告)号:KR1020130051800A

    公开(公告)日:2013-05-21

    申请号:KR1020110117153

    申请日:2011-11-10

    Abstract: PURPOSE: An MEMS sensor packaging and a method thereof are provided to form a pad solder in inside for electrically connecting an ROIC circuit and an MEMS sensor, thereby reducing the size of a package and stably supplying electrical signals. CONSTITUTION: An MEMS sensor packaging comprises a firs wafer(100), a second wafer(200), bonding solders(140a,140b), and pad solders(150a,150b). An ROIC circuit is formed on the first wafer. The second wafer, which is arranged corresponding to the firs wafer, includes a convex unit(240) in one surface, and an MEMS(210) sensor is arranged in the convex unit. The bonding solders are formed around the MEMS sensor for sealing the MEMS sensor by bonding the first and second wafers. The pad solders is formed so that the ROIC circuit of the first wafer and the MEMS sensor of the second wafer are electrically connected.

    Abstract translation: 目的:提供MEMS传感器封装及其方法,以在内部形成焊盘焊料,用于电连接ROIC电路和MEMS传感器,从而减小封装的尺寸并稳定地提供电信号。 构成:MEMS传感器封装包括第一晶片(100),第二晶片(200),焊接焊料(140a,140b)和焊盘焊料(150a,150b)。 ROIC电路形成在第一晶片上。 对应于第一晶片布置的第二晶片在一个表面中包括凸单元(240),并且在凸单元中布置MEMS(210)传感器。 粘合焊料围绕MEMS传感器形成,用于通过结合第一和​​第二晶片来密封MEMS传感器。 焊盘焊料形成为使得第一晶片的ROIC电路和第二晶片的MEMS传感器电连接。

    볼로미터를 이용한 적외선 신호 검출회로 및 검출방법
    170.
    发明公开
    볼로미터를 이용한 적외선 신호 검출회로 및 검출방법 失效
    红外线信号检测电路采用BOLOMETER和检测方法

    公开(公告)号:KR1020090030768A

    公开(公告)日:2009-03-25

    申请号:KR1020070096306

    申请日:2007-09-21

    CPC classification number: G01J5/20 B81B2201/0207 H03K19/20 H04N5/357

    Abstract: An infrared ray signal detection circuit using a bolometer and a detecting method thereof are provided to reduce resistance value of a bolometer to 1/4 by adding an OR-gate to a row decoder of a detection circuit. An infrared ray signal detection circuit using a bolometer comprises: a cell array in which an infrared ray lead out cell is arranged into a matrix type; a row decoder performing decoding in the cell array by using a low signal; one or more OR-gates(410,420,430,440,450) for applying the low signal in one or more cells; one or more integrators which integrates and amplifies the value outputted from the cell array; and a column decoder for decoding the output outputted from the integrator.

    Abstract translation: 提供使用测辐射热计的红外线信号检测电路及其检测方法,通过向检测电路的行解码器添加OR门,将测辐射热计的电阻值降至1/4。 使用测辐射热计的红外线信号检测电路包括:将红外线引出单元配置成矩阵型的单元阵列; 行解码器通过使用低信号在单元阵列中执行解码; 用于在一个或多个单元中应用所述低信号的一个或多个OR门(410,420,430,440,450) 一个或多个积分器,其对从单元阵列输出的值进行积分和放大; 以及用于对从积分器输出的输出进行解码的列解码器。

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