Abstract:
본 발명에 따른 MEMS 센서 패키징은, ROIC 회로가 형성된 제 1 웨이퍼와; 상기 제 1 웨이퍼와 대응하도록 배치되고, 일면에 오목부가 형성되어 MEMS 센서가 마련된 제 2 웨이퍼와; 상기 제 1 웨이퍼와 상기 제 2 웨이퍼를 접합하여 상기 MEMS 센서가 밀봉되도록 상기 MEMS 센서의 주위를 따라 형성된 접합 솔더와; 상기 제 1 웨이퍼의 ROIC 회로와 상기 제 2 웨이퍼의 MEMS 센서가 전기적으로 연결되도록 형성된 패드 솔더를 포함하는 점에 그 특징이 있다. 본 발명에 따르면, ROIC 회로가 형성된 웨이퍼와 MEMS 센서가 형성된 웨이퍼를 접합하여 패키징하는데 있어서, ROIC 회로와 MEMS 센서를 전기적으로 연결하기 위한 패드 솔더를 내부에 형성함으로써 패키지의 크기를 줄이고, 안정적으로 전기적 신호를 공급할 수 있다.
Abstract:
PURPOSE: An infrared detector is provided to increase the temperature of an absorbing body effectively by the generation of heat caused by absorbing infrared rays. CONSTITUTION: An infrared detector(10) comprises a substrate(11), a resonator(30), a thermoelectric material layer(50), a lead line(60), a thermal isolation layer(70), and a ground plate layer(90). The resonator absorbs infrared rays becoming incident. The thermoelectric material layer is in contact to the resonator, and a resistance value of the thermoelectric material layer is varied according to a temperature change caused by the absorbed infrared rays. The lead line electrically connects the thermoelectric material layer and the substrate. The thermal isolation layer is arranged between the substrate and the thermoelectric material layer, thereby preventing thermal transmission to the substrate. The ground plate layer prevents the infrared rays toward the substrate.
Abstract:
A MEMS infrared sensor and a manufacturing method thereof are provided to improve a characteristic of the sensor by increasing an area of a senor unit by reducing the area occupied by a support arm. A sacrificial layer is formed on a substrate(10) including a reflective film. A step(12) for a support arm structure of the three-dimensional structure is formed. An anchor(13) is patterned in a lower part of the step. A lower protective film(14) is deposited in the front side of the sacrificial layer. A contact hole(15) is formed in the lower protective film. An electrode(16) is formed on the lower protective film of the support arm structure. A sensor material(17) is deposited in the front side of the sacrificial layer. An upper protective film(18) is deposited in the front side of the sacrificial layer. A path(19) of the etchant material is formed by patterning the upper protective film.
Abstract:
PURPOSE: An MEMS sensor packaging and a method thereof are provided to form a pad solder in inside for electrically connecting an ROIC circuit and an MEMS sensor, thereby reducing the size of a package and stably supplying electrical signals. CONSTITUTION: An MEMS sensor packaging comprises a firs wafer(100), a second wafer(200), bonding solders(140a,140b), and pad solders(150a,150b). An ROIC circuit is formed on the first wafer. The second wafer, which is arranged corresponding to the firs wafer, includes a convex unit(240) in one surface, and an MEMS(210) sensor is arranged in the convex unit. The bonding solders are formed around the MEMS sensor for sealing the MEMS sensor by bonding the first and second wafers. The pad solders is formed so that the ROIC circuit of the first wafer and the MEMS sensor of the second wafer are electrically connected.
Abstract:
An infrared ray signal detection circuit using a bolometer and a detecting method thereof are provided to reduce resistance value of a bolometer to 1/4 by adding an OR-gate to a row decoder of a detection circuit. An infrared ray signal detection circuit using a bolometer comprises: a cell array in which an infrared ray lead out cell is arranged into a matrix type; a row decoder performing decoding in the cell array by using a low signal; one or more OR-gates(410,420,430,440,450) for applying the low signal in one or more cells; one or more integrators which integrates and amplifies the value outputted from the cell array; and a column decoder for decoding the output outputted from the integrator.