中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

694 records (took 0.027 seconds)

    METHOD OF PRODUCTION OF CIRCUIT BOARD
    162.
    发明申请
    METHOD OF PRODUCTION OF CIRCUIT BOARD 审中-公开
    生产电路板的方法

    公开(公告)号：US20150237736A1

    公开(公告)日：2015-08-20

    申请号：US14424854

    申请日：2013-08-23

    Applicant: ZEON CORPORATION

    Inventor： Takashi Iga

    IPC: H05K3/00 ,  H05K3/18 ,  H05K1/03 ,  H05K3/10

    CPC classification number: H05K3/0014 ,  H05K1/032 ,  H05K3/0044 ,  H05K3/007 ,  H05K3/045 ,  H05K3/107 ,  H05K3/182 ,  H05K2201/0166 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/0156 ,  H05K2203/025 ,  Y10T29/49155

    Abstract: A method of production of a circuit board comprising a step of forming resist patterns 20 on a support 10 by a photoresist to obtain a support with resist patterns, a step of forming a curable resin composition layer 30 which is comprised of a curable resin composition on the resist patterns 20 of the support with resist patterns, a step of laying a substrate 40 on the curable resin composition layer 30, a step of making the curable resin composition which forms the curable resin composition layer 30 cure to make the curable resin composition layer 30 a cured resin layer 30a, a step of peeling off the support 10 from the curable resin composition layer 30 or the cured resin layer 30a and the resist patterns 20 before or after making the curable resin composition cure, a step of peeling off or dissolving the resist patterns 20 to remove the resist patterns 20 from the cured resin layer 30a so as to form a cured resin layer which has relief structures, and a step of forming fine wirings 50 by plating recesses of the relief structures which are formed at the cured resin layer 30a.

    Abstract translation: 一种电路板的制造方法，其特征在于，包括通过光致抗蚀剂在支持体10上形成抗蚀剂图案20以获得具有抗蚀剂图案的载体的步骤，形成由固化性树脂组合物构成的固化性树脂组合物层30的工序 具有抗蚀剂图案的支持体的抗蚀剂图案20，将基材40铺设在可固化树脂组合物层30上的步骤，使形成固化性树脂组合物层30的固化性树脂组合物固化，使固化性树脂组合物层 30表示固化树脂层30a，在使固化性树脂组合物固化前后之前，从固化性树脂组合物层30或固化树脂层30a和抗蚀图案20剥离载体10的步骤，剥离或溶解的步骤 抗蚀剂图案20，以从固化树脂层30a去除抗蚀剂图案20，以形成具有浮雕结构的固化树脂层，以及形成精细布线的步骤 通过在固化树脂层30a上形成的浮雕结构的凹部进行电镀。

    Substrate for display device and method of manufacturing the same
    163.
    发明授权
    Substrate for display device and method of manufacturing the same 有权
    显示装置用基板及其制造方法

    公开(公告)号：US08241735B2

    公开(公告)日：2012-08-14

    申请号：US12091781

    申请日：2007-09-06

    Applicant: Takeshi Murashige ,  Yoshimasa Sakata ,  Tatsuki Nagatsuka

    Inventor： Takeshi Murashige ,  Yoshimasa Sakata ,  Tatsuki Nagatsuka

    IPC: B32B7/02

    CPC classification number: G02F1/133305 ,  B32B17/064 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0166 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/266 ,  Y10T428/31525

    Abstract: There is provided a substrate for a display device that has excellent gas barrier properties, flexibility, heat resistance and transparency, and has excellent dimensional stability, operability, and secondary processing characteristics. A substrate for a display device according to the present invention includes: an inorganic glass; and resin layers placed on both sides of the inorganic glass. Preferably, a ratio drsum/dg between a total thickness drsum of the resin layer and a thickness dg of the inorganic glass is 0.5 to 2.2. Preferably, the resin layers on both sides of the inorganic glass are each composed of the same material, each have the same thickness, and a thickness of each of the resin layers is equal to the thickness of the inorganic glass. Preferably, an average coefficient of linear expansion at 170° C. of the substrate for a display device is 20 ppm ° C.−1 or less.

    Abstract translation: 提供了具有优异的阻气性，柔韧性，耐热性和透明性的显示装置用基板，具有优异的尺寸稳定性，可操作性和二次加工特性。 根据本发明的用于显示装置的基板包括：无机玻璃; 并且将树脂层放置在无机玻璃的两侧。 优选地，树脂层的总厚度厚度与无机玻璃的厚度dg之间的比率drsum / dg为0.5〜2.2。 优选地，无机玻璃两侧的树脂层各自由相同的材料组成，各自具有相同的厚度，并且每个树脂层的厚度等于无机玻璃的厚度。 优选地，用于显示装置的基板的170℃下的平均线膨胀系数为20ppm·℃-1以下。

    PASSIVE ELECTRICAL DEVICES AND METHODS OF FABRICATING PASSIVE ELECTRICAL DEVICES
    166.
    发明申请
    PASSIVE ELECTRICAL DEVICES AND METHODS OF FABRICATING PASSIVE ELECTRICAL DEVICES 有权
    被动电气设备和制造被动电气设备的方法

    公开(公告)号：US20100175914A1

    公开(公告)日：2010-07-15

    申请号：US12352411

    申请日：2009-01-12

    Applicant: Pranabes K. PRAMANIK ,  Yuji KAGEYAMA ,  Fujio KUWAKO ,  Jin Hyun HWANG

    Inventor： Pranabes K. PRAMANIK ,  Yuji KAGEYAMA ,  Fujio KUWAKO ,  Jin Hyun HWANG

    IPC: H05K1/03 ,  B31B1/60 ,  H01G4/06

    CPC classification number: H01G4/18 ,  H01G4/203 ,  H01G4/33 ,  H05K1/162 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09309 ,  Y10T156/10

    Abstract: A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.

    Abstract translation: 提供了一种诸如电容器的薄层压无源电器件以及制造薄层压无源电器件的方法。 无源电器件包括两个导体，例如铜箔导体，由具有软化点温度大于第一温度的第一材料的第一层和第一材料的电介质隔开，第一层的第一材料具有软化点温度 小于第一温度。 第一温度可以为至少150摄氏度或更高。 通过提供具有较高软化点材料的第一层，可以防止通过制造工艺促进导体的短路。 还公开了制造无源电器件的方法。

    Circuit board structure with capacitor embedded therein and method for fabricating the same
    168.
    发明申请
    Circuit board structure with capacitor embedded therein and method for fabricating the same 审中-公开
    具有电容器的电路板结构嵌入其中及其制造方法

    公开(公告)号：US20090077799A1

    公开(公告)日：2009-03-26

    申请号：US12232189

    申请日：2008-09-12

    Applicant: Chih Kui Yang

    Inventor： Chih Kui Yang

    IPC: H05K1/18 ,  H05K3/10

    CPC classification number: H05K1/162 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0959 ,  Y10T29/49155

    Abstract: The present invention relates to a circuit board structure with a capacitor embedded therein and the method for fabricating the same. The disclosed structure comprises: a core board; a buffer layer disposed on two surfaces of the core board and having a plurality of open areas; a first circuit layer disposed in the open areas; a high dielectric material film disposed over the first circuit layer and the buffer layer on at least one surface of the core board; and a second circuit layer disposed on the high dielectric material film, wherein the region where the second circuit layer corresponds to the first circuit layer functions as a capacitor, and the first circuit layer on two surfaces of the core board electrically connects to each other by at least one plated through hole. The present invention improves the problem of void generation and enhances the precision of the capacitor region.

    Abstract translation: 本发明涉及一种其中嵌有电容器的电路板结构及其制造方法。 所公开的结构包括：芯板; 缓冲层，设置在所述芯板的两个表面上并具有多个开放区域; 布置在所述开放区域中的第一电路层; 设置在所述芯板的至少一个表面上的所述第一电路层和所述缓冲层之上的高电介质材料膜; 以及设置在高电介质材料膜上的第二电路层，其中第二电路层对应于第一电路层的区域用作电容器，并且芯板的两个表面上的第一电路层通过 至少一个电镀通孔。 本发明改善了空穴产生的问题，提高了电容器区域的精度。

    CIRCUIT BOARD STRUCTURE AND METHOD FOR FABRICATING THE SAME
    169.
    发明申请
    CIRCUIT BOARD STRUCTURE AND METHOD FOR FABRICATING THE SAME 审中-公开
    电路板结构及其制造方法

    公开(公告)号：US20080041621A1

    公开(公告)日：2008-02-21

    申请号：US11673543

    申请日：2007-02-09

    Applicant: Shih-Ping HSU ,  Ya-Lun YEN

    Inventor： Shih-Ping HSU ,  Ya-Lun YEN

    IPC: H05K1/11 ,  H01R12/04

    CPC classification number: H05K3/465 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/045 ,  H05K3/107 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0166

    Abstract: A circuit board structure and a method for fabricating the same are proposed. A substrate with a first circuit layer formed on at least one surface thereof is provided. A dielectric layer is formed on the surface of the substrate, and a plurality of first and second openings are formed in the dielectric layer, wherein the second openings expose electrical connection pads of the first circuit layer. A metal layer is formed on the surface of the dielectric layer and in the first and second openings. By removing the metal layer on the surface of the dielectric layer, a second circuit layer is formed in the second openings, and a conductive structure is formed in the second openings for electrical connection with the first circuit layer. The present invention improves the bonding strength between the circuit layer and the dielectric layer, and the ability of fabricating fine circuits.

    Abstract translation: 提出了一种电路板结构及其制造方法。 提供了在其至少一个表面上形成有第一电路层的基板。 介电层形成在基板的表面上，多个第一和第二开口形成在电介质层中，其中第二开口露出第一电路层的电连接焊盘。 在电介质层的表面和第一和第二开口中形成金属层。 通过去除电介质层表面上的金属层，在第二开口中形成第二电路层，并且在第二开口中形成导电结构以与第一电路层电连接。 本发明提高了电路层和电介质层之间的接合强度，以及制造精细电路的能力。

Patent Agency Ranking