公开(公告)号：WO9939554A3

公开(公告)日：2000-08-24

申请号：PCT/IB9900148

申请日：1999-01-27

Applicant: ENERGENIUS INC

Inventor： STAFFIERE DONALD T

IPC: H01L27/08 ,  H01M2/10 ,  H01M6/40 ,  H05K1/00 ,  H05K1/16 ,  H01L27/13

CPC classification number: H01L27/0805 ,  H01M2/1066 ,  H01M6/40 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/09509 ,  H05K2201/10037

Abstract: The present invention is directed towards an embedded electrical storage device in a layered electrical device, such as a printed board or IC chip. The layered electrical device comprises an outer surface. An electrical energy storage device is embedded in the layered electrical device, either partially or fully. The electrical energy storage device comprises at least two electrical conducting layers sandwiching a high capacity dielectric, and is connected to other circuitry on the layered electrical device.

Abstract translation: 本发明涉及分层电气设备中的嵌入式电气存储设备，例如印刷电路板或IC芯片。 分层电气装置包括外表面。 部分或全部将电能存储装置嵌入分层电气装置中。 电能存储装置包括夹持大容量电介质的至少两个导电层，并且连接到分层电气装置上的其它电路。

公开(公告)号：WO1995015579A1

公开(公告)日：1995-06-08

申请号：PCT/FR1994001394

申请日：1994-11-30

Applicant: GIAT INDUSTRIES ,  DESSAUX, Christophe ,  FERRANDIZ, Jean-Marie ,  LACABANNE, Colette ,  MANGERET, Renaud ,  MOREAU, Emmanuel ,  SEGUI, Yvan ,  FARENC, Jean

Inventor： GIAT INDUSTRIES

IPC: H01L23/31

CPC classification number: H05K3/284 ,  H01L23/293 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/01087 ,  H01L2924/181 ,  H05K2201/0179 ,  H05K2201/09872 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Method for the encapsulation of electronic components or an electronic unit fitted on a support such as a printed circuit board, consisting in depositing on the components or electronic unit at least two organic layers (15', 18'). The invention is characterized in that a polyurethane-based material, especially a hydroxylateed polyurethane polybutadiene, is selected to form one of the two layers (15').

Abstract translation: 用于封装电子部件或安装在诸如印刷电路板的支撑件上的电子单元的方法，其包括在组件或电子单元上沉积至少两个有机层（15'，18'）。 本发明的特征在于，选择聚氨酯基材料，特别是羟基化聚氨酯聚丁二烯，以形成两层（15'）之一。

公开(公告)号：EP2109124A4

公开(公告)日：2013-04-03

申请号：EP08703922

申请日：2008-01-25

Applicant: SHOWA DENKO KK

Inventor： SHIRAKAWA AKIHIKO ,  MITSUMOTO RYUICHI ,  TOKITA KOJI

IPC: H01G4/20 ,  H01G4/10 ,  H01G4/12 ,  H01G4/33 ,  H01G9/00 ,  H01G9/052 ,  H01G9/07 ,  H05K1/16

CPC classification number: H01G4/33 ,  H01G4/1218 ,  H01G4/20 ,  H01G9/0032 ,  H01G9/052 ,  H01G9/07 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/0315 ,  Y10T156/10 ,  Y10T428/266

Abstract: The capacitor material of the present invention is comprised by laminating a titanium dioxide layer and a titanate compound layer having perovskite crystals.

公开(公告)号：EP2025210B1

公开(公告)日：2012-02-22

申请号：EP07718465.3

申请日：2007-05-25

Applicant: A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung

Inventor： HAEGELE, Bernd

IPC: H05K1/05 ,  H05K3/28 ,  H05K3/44 ,  C03C3/064 ,  C23C4/18

CPC classification number: H05K1/053 ,  C03C3/064 ,  C23C4/18 ,  H05K1/092 ,  H05K2201/0116 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2203/1147 ,  H05K2203/1366 ,  Y10T29/49126 ,  Y10T29/49146

Abstract: Circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the latter having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.

公开(公告)号：EP2328692A2

公开(公告)日：2011-06-08

申请号：EP09762789.7

申请日：2009-03-05

Applicant: hZo, Inc.

Inventor： MARTIN, Sidney, Edward ,  DAWICKI, Eric, Roger ,  DAWICKI, Angela, Michele

IPC: B05D7/24 ,  C08K3/22 ,  C08K3/28 ,  C09D5/00 ,  C23C16/455 ,  H01L51/52 ,  H05K3/28 ,  C08L65/04

CPC classification number: H05K3/284 ,  B05D1/60 ,  B05D3/142 ,  B05D2601/20 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08L65/04 ,  C09D5/1662 ,  C09D7/61 ,  C09D7/69 ,  C09D165/04 ,  H05K1/0203 ,  H05K1/021 ,  H05K3/285 ,  H05K2201/0179 ,  H05K2201/0209 ,  H05K2201/09872

Abstract: The present disclosure relates, in part, to Parylene based conformal coating compositions having improved properties, e.g., improved heat transfer and durability characteristics, as well as a methods and apparatus to coat objects with these compositions, and objects coated with these compositions. In some aspects, coating compositions comprising Parylene and boron nitride are disclosed. The disclosure also includes objects (e.g., electronic equipment, textiles, etc.) having a conformal coating comprising a Parylene compound and boron nitride.

公开(公告)号：EP2327283A2

公开(公告)日：2011-06-01

申请号：EP09784909.5

申请日：2009-08-11

Applicant: Semblant Global Limited

Inventor： HUMPHRIES, Mark, Robson ,  FERDINANDI, Frank ,  SMITH, Rodney, Edward

IPC: H05K3/28

CPC classification number: H05K3/282 ,  H01H13/78 ,  H01H2215/004 ,  H01H2229/012 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/06 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45149 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/4517 ,  H01L2224/45171 ,  H01L2224/45173 ,  H01L2224/45178 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/8502 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85484 ,  H01L2224/85611 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/3011 ,  H05K3/222 ,  H05K3/284 ,  H05K3/328 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/049 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20758

Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的衬底。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。

公开(公告)号：EP2136399A4

公开(公告)日：2011-05-25

申请号：EP08739676

申请日：2008-04-02

Applicant: IBIDEN CO LTD

Inventor： KAWANO SHUICHI

IPC: H01L23/32 ,  H01L23/12

CPC classification number: H05K1/162 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/423 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/0733 ,  H01L2924/00

公开(公告)号：EP2282620A1

公开(公告)日：2011-02-09

申请号：EP09750642.2

申请日：2009-05-21

Applicant: Meisei Gakuen ,  Shin-Etsu Polymer Co., Ltd.

Inventor： OTSUKA Kanji ,  AKIYAMA Yutaka ,  KAWAGUCHI Toshiyuki ,  TAHARA Kazutoki

IPC: H05K1/02 ,  H05K3/28 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0218 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09236

Abstract: Disclosed is a paired low-characteristic impedance power line and ground line structure in which loop inductance is substantially 0. The paired low-characteristic impedance power line and ground line structure includes a laminated sheet (1) in which a metal wiring layer (20) having a power line (21) and a ground line (22) is provided on the surface of an insulating sheet (10), an insulating thin-film layer (31) provided so as to cover the power line (21) and the ground line (22), and a resistive layer (32) provided on the surface of the insulating thin-film layer (31).

Abstract translation: 公开了一种成对的低特性阻抗电源线和地线结构，其中回路电感基本上为0.成对的低特性阻抗电源线和地线结构包括层压板（1），其中金属布线层（20） 在绝缘片（10）的表面设置有电源线（21）和接地线（22）的绝缘薄膜层（31），覆盖电源线（21）和接地线 （22）以及设置在绝缘薄膜层（31）的表面上的电阻层（32）。

公开(公告)号：EP1855516A4

公开(公告)日：2010-07-28

申请号：EP06715221

申请日：2006-03-03

Applicant: MURATA MANUFACTURING CO

Inventor： KAWAKAMI HIROMICHI ,  FUJITA IWAO ,  TOSE MAKOTO ,  SAITO YOSHIFUMI ,  KIMURA MASAHIRO

IPC: H05K3/28 ,  H01L23/12 ,  H01L23/28

CPC classification number: H01L24/81 ,  H01L21/4807 ,  H01L21/481 ,  H01L23/15 ,  H01L23/24 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/3185 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81355 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/0179 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A ceramic multilayer substrate which has excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, and its manufacturing method are obtained. The entire laminated substrate body (2) including lands (16) and (17), and external electrodes (24) and (25) is covered with a siloxane film formed by means of a PVD process. The thickness of the siloxane film is set less than 100 nm. After that, external electrodes (16) and (17) of a mounting component (11) are electrically connected and firmly hold to the lands (16) and (17) of the laminated substrate body 2 via solder (19). Next, a resin sealing material (4) for sealing the mounting component (11) is formed on the laminated substrate body (2).

公开(公告)号：EP2133625A1

公开(公告)日：2009-12-16

申请号：EP08010456.5

申请日：2008-06-09

Applicant: Chen, Hon-Wen

Inventor： Chen, Hon-Wen

IPC: F21V29/00 ,  F21K7/00 ,  F21Y101/02

CPC classification number: H05K1/053 ,  F21K9/00 ,  F21V29/51 ,  F21V29/56 ,  F21V29/763 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10 ,  H05K2201/0179 ,  H05K2201/10106

Abstract: This invention relates to a light emitting diode lamp (1) with high heat-dissipation capacity wherein the lamp (1) has at least one heat sink unit (11), a plurality of air-flow channels (113) being provided within each heat sink unit (11), an electrical insulation layer (12) with high heat-conductivity being provided on the surface of the light emitting diode (14) mounted with heat sink unit (11), a metal circuit (13) being formed on the electrical insulation layer (12) with high heat-conductivity according to demand, at least one light emitting diode (14) being packaged on the metal circuit (13) such that provision of circuit board or coating of heat sink paste become unnecessary for the lamp (1).

Abstract translation: 本发明涉及具有高散热能力的发光二极管灯（1），其中灯（1）具有至少一个散热单元（11），在每个热量内设置多个气流通道（113） （11），具有高导热性的电绝缘层（12）设置在安装有散热单元（11）的发光二极管（14）的表面上，金属电路（13）形成在所述散热单元 电绝缘层（12），根据需要具有高导热性，至少一个发光二极管（14）被封装在金属电路（13）上，使得不需要为灯提供电路板或散热膏涂层 （1）。