公开(公告)号：WO2007103949A3

公开(公告)日：2008-06-19

申请号：PCT/US2007063429

申请日：2007-03-06

Applicant: STABLCORE INC ,  VASOYA KALU K

Inventor： VASOYA KALU K

IPC: B32B15/00

CPC classification number: H05K3/4641 ,  H05K1/0366 ,  H05K3/429 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/068

Abstract: Methods of manufacturing printed wiring boards including electrically conductive constraining cores that involve a single lamination cycle are disclosed. One example of the method of the invention includes drilling a clearance pattern in an electrically conductive constraining core, arranging the electrically conductive constraining core in a stack up that includes B-stage (semi-cured) layers of dielectric material on either side of the constraining core and additional layers of material arranged to form the at least one functional layer, performing a lamination cycle on the stack up that causes the resin in the B-stage (semi-cured) layers of dielectric to reflow and fill the clearance pattern in the electrically conductive constraining core before curing and drilling plated through holes.

Abstract translation: 公开了包括涉及单层压循环的导电约束芯的印刷线路板的制造方法。 本发明方法的一个实例包括在导电约束芯中钻出间隙图案，将导电约束芯堆叠起来，其包括在约束的任一侧上的电介质材料的B阶（半固化）层 芯层和另外的材料层，以形成至少一个功能层，在叠层上执行层压循环，导致电介质的B级（半固化）层中的树脂回流并填充在 导电约束芯在固化和钻孔电镀通孔之前。

公开(公告)号：WO2008008552A2

公开(公告)日：2008-01-17

申请号：PCT/US2007/016210

申请日：2007-07-16

Applicant: STABLCOR, INC. ,  VASOYA, Kalu, K.

Inventor： VASOYA, Kalu, K.

IPC: H05K1/16

CPC classification number: H05K3/4608 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/11 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/0959 ,  H01L2224/0401

Abstract: Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole.

Abstract translation: 描述了用于制造集成电路的集成电路和工艺，其使用具有作为印刷线路板的电路的一部分的芯层的印刷线路板基板。 在多个实施例中，芯层由碳复合材料构成。 在几个实施例中，描述了在要求高密度间隙孔钻孔的设计中增加芯层的完整性的技术。 本发明的一个实施例包括芯层，其包括导电材料和形成在芯层的外表面上的至少一个堆积布线部分。 此外，积层部分包括至少一个微布线层，其包括通过电镀通孔与芯层中的导电材料电连接的电路。

公开(公告)号：WO2007111107A1

公开(公告)日：2007-10-04

申请号：PCT/JP2007/054549

申请日：2007-03-08

Applicant: 富士通株式会社 ,  川端 章夫 ,  佐藤 信太郎

Inventor： 川端 章夫 ,  佐藤 信太郎

IPC: D01F9/127 ,  B82B1/00 ,  B82B3/00 ,  C01B31/02 ,  D06M15/55 ,  H01J9/02

CPC classification number: D01F9/127 ,  B82Y10/00 ,  B82Y30/00 ,  H01L21/76885 ,  H01L23/373 ,  H01L23/485 ,  H01L23/5226 ,  H01L23/53276 ,  H01L24/13 ,  H01L2221/1094 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  Y10S977/742 ,  H01L2924/00014 ,  H01L2924/00

Abstract: 　カーボンナノチューブを高密度化する技術を提供する。炭素系繊維の集合体構造は、複数の炭素系繊維で構成される前記炭素系繊維の集合体構造であって、一方の端部における前記炭素系繊維の密度と他方の端部における前記炭素系繊維の密度とが異なる前記炭素系繊維が長さ方向に配列された前記炭素系繊維の集合体からなる。

Abstract translation: 一种以高密度设置碳纳米管的技术。 提供了由碳纤维构成的碳纤维组装结构，其中碳纤维沿长度方向取向，使得一端的碳纤维的密度与另一端的碳纤维的密度不同。

公开(公告)号：WO2006131810A2

公开(公告)日：2006-12-14

申请号：PCT/IB2006001477

申请日：2006-06-06

Applicant: TEXTRONICS INC ,  KARAYIANNI ELENI ,  MUNOZ EDUARDO ,  COULSTON GEORGE W PH D ,  BURR STACEY B ,  MICKA THOMAS A

Inventor： KARAYIANNI ELENI ,  MUNOZ EDUARDO ,  COULSTON GEORGE W PH D ,  BURR STACEY B ,  MICKA THOMAS A

CPC classification number: H05K1/038 ,  D02G3/32 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/0027 ,  D03D15/0066 ,  D03D15/0077 ,  D03D15/0088 ,  D03D15/08 ,  D04B1/14 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2201/04 ,  D10B2211/02 ,  D10B2211/04 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2401/061 ,  D10B2401/16 ,  D10B2403/0114 ,  D10B2403/02431 ,  D10B2501/00 ,  H05K2201/0281 ,  H05K2201/029 ,  Y10T442/30 ,  Y10T442/3024 ,  Y10T442/3976 ,  Y10T442/40 ,  Y10T442/413 ,  Y10T442/45

Abstract: A surface functional electro-textile fabric incorporates energy-active, electrically conductive or optically conductive fibers and nonconductive fibers in a woven or knitted textile fabric. The weave or knit pattern is selected so as to form floats of the electrically conductive fibers on at least one surface of the electro-textile fabric. The electro-textile fabric can be incorporated into an antenna structure that interacts with high frequency electromagnetic radiation, particularly in the frequency range of DC to 100 GHz.

Abstract translation: 表面功能性电纺织物在机织或针织织物中结合能量活性，导电或光导纤维和非导电纤维。 选择编织或编织图案以在电纺织物的至少一个表面上形成导电纤维的浮子。 电纺织物可以结合到与高频电磁辐射相互作用的天线结构中，特别是在DC至100GHz的频率范围内。

公开(公告)号：WO2005118244A2

公开(公告)日：2005-12-15

申请号：PCT/US2005/011943

申请日：2005-04-08

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: B29B11/00

CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0005 ,  B29C70/882 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/243 ,  H01Q1/3283 ,  H01Q1/36 ,  H01Q1/364 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/0087 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Mono-polar and bipolar fuel cell plates are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20 % and 50 % of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 单极和双极燃料电池板由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2005083164A2

公开(公告)日：2005-09-09

申请号：PCT/GB2005/000712

申请日：2005-02-25

Applicant: INTELLIGENT TEXTILES LIMITED ,  SWALLOW, Stanley, Shigezo ,  PETA-THOMPSON, Asha

Inventor： SWALLOW, Stanley, Shigezo ,  PETA-THOMPSON, Asha

IPC: D02G

CPC classification number: D03D15/00 ,  D03D1/0088 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2211/02 ,  D10B2211/04 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2401/16 ,  D10B2403/02431 ,  H01H2203/0085 ,  H01H2203/01 ,  H05K3/10 ,  H05K2201/0281 ,  H05K2201/029 ,  Y10T442/30 ,  Y10T442/3033 ,  Y10T442/3382 ,  Y10T442/339

Abstract: Electrical components are formed in a fabric during the weaving process by a series of crossing conductors in the warp and weft fibres of the fabric. Some of the crossing points provide permanent Separation of the crossing conductors, others permanent connection of the crossing conductors and others connection upon the application of pressure to the fabric. The structure provides the possibility of forming a greater range of components and more reliable component characteristics than heretofore possible.

Abstract translation: 在织造过程中，织物中的织物经纱和纬纱中的一系列交叉导体形成电气部件。 一些交叉点提供了交叉导体的永久分离，其他交叉导体和其他连接在施加压力时连接到织物上。 该结构提供了形成更大范围的部件和比迄今为止更可靠的部件特性的可能性。

公开(公告)号：WO2004107831A2

公开(公告)日：2004-12-09

申请号：PCT/IB2004/050818

申请日：2004-06-01

Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V. ,  MARMAROPOULOS, George ,  MAMA, Jack Kyriakos ,  VU, Giang Truong

Inventor： MARMAROPOULOS, George ,  MAMA, Jack Kyriakos ,  VU, Giang Truong

IPC: H05K3/00

CPC classification number: D02G3/441 ,  A41D1/002 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/08 ,  D10B2101/20 ,  D10B2331/04 ,  D10B2331/10 ,  D10B2401/061 ,  D10B2401/16 ,  D10B2501/00 ,  H01H2203/0085 ,  H05K3/10 ,  H05K2201/0133 ,  H05K2201/0281 ,  H05K2201/029

Abstract: There is provided a flexible, lightweight high-performance electronic fabric interface (30) that can be integral with a wearable garment (60) and can cooperate with any of a variety of different wearable electronics (65) and the like without compromising the comfort and/or durability of the garment (60). The fabric interface is formed from a flexible fiber construction of one or more conductive fibers (10) and one or more non-conductive fibers (20), the non-conductive fibers including one or more fibers having elastomeric properties.

Abstract translation: 提供了一种柔性，轻便的高性能电子织物接口（30），其可与可穿戴服装（60）成一体，并且可以与各种不同的可穿戴电子设备（65）等中的任一种配合，而不会影响舒适性和 /或衣服（60）的耐久性。 织物界面由一种或多种导电纤维（10）和一种或多种非导电纤维（20）的柔性纤维结构形成，非导电纤维包括一种或多种具有弹性体性质的纤维。

公开(公告)号：WO2004064467A1

公开(公告)日：2004-07-29

申请号：PCT/JP2003/000325

申请日：2003-01-16

Applicant: 富士通株式会社 ,  阿部 知行 ,  林 伸之 ,  谷 元昭

Inventor： 阿部 知行 ,  林 伸之 ,  谷 元昭

IPC: H05K3/46

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/09 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T428/24917 ,  H01L2924/00

Abstract: 多層配線基板（Ｘ１）は、コア部（１００）およびコア外配線部（３０）を有する。コア部（１００）は、カーボンファイバ材（１１）および樹脂組成物（１２）からなるカーボンファイバ強化部（１０）、並びに、ガラスファイバ材（２１ａ）を含有する少なくとも１つの絶縁層（２１）と１０～４０ＧＰａの弾性率を有する導体よりなる配線パターン（２２）とによる積層構造を有し且つカーボンファイバ強化部（１０）に接合しているコア内配線部（２０）を含む。コア外配線部（３０）は、少なくとも１つの絶縁層（３１）および配線パターン（３２）による積層構造を有し、コア内配線部（２０）にてコア部（１００）に接合している。

Abstract translation: 一种包括芯部（100）和外芯布线部（30）的多层布线基板（X1）。 芯部（100）由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10）和与碳纤维增强部（ 10），同时具有包含玻璃纤维材料（21a）的至少一个绝缘层（21）和弹性模量为10-40GPa的导体的布线图案（22）的多层结构。 外芯接线部（30）通过芯内配线部（20）与芯部（100）接合，同时具有至少一个绝缘层（31）和布线图案（32）的多层结构。

公开(公告)号：WO1990007804A1

公开(公告)日：1990-07-12

申请号：PCT/EP1989001619

申请日：1989-12-29

Applicant: MST MICRO-SENSOR-TECHNOLOGIE GMBH ,  FREUND, Ernst

Inventor： MST MICRO-SENSOR-TECHNOLOGIE GMBH

IPC: H01R04/04

CPC classification number: H01R43/00 ,  H01R4/726 ,  H05K3/323 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2203/0195 ,  H05K2203/0278

Abstract: A process and a device are useful for connecting contacts of a first electronic component to contacts of a second electronic component. The components are aligned in accordance with the order of connection and bonded to each other by a hot-melt adhesive charged with electrically conductive particles which are not connected to each other in an electrically conductive manner. During the bonding process, the connection regions of the components are moved toward each other in such a way that only directly opposite contacts are connected to each other electrically by the conducting particles in the adhesive. The device for implementing the process comprises a clamping device for fixing the components in the predetermined order of connection and a strip heater which heats the connection regions in order to melt the adhesive. The process and device make it possible to produce rapid and reliable contact between contacts located a short distance apart.

公开(公告)号：EP3066897A1

公开(公告)日：2016-09-14

申请号：EP14793165.3

申请日：2014-11-05

Applicant: Philips Lighting Holding B.V.

Inventor： CHERENACK, Kunigunde Hadelinde ,  VAN OS, Jacobus Petrus Johannes ,  SCHUURBIERS, Roland Marinus

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/038 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/181 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/10113 ,  H05K2201/10151

Abstract: A device comprising a first and a second electrically conductive textile portion is provided, wherein the first and second textile portions are electrically isolated from each other. The device also comprises an electrical element having a first contact pad which is electrically connected to the first textile portion and a second contact pad which is electrically connected to the second textile portion, wherein the first and second textile portions are adapted to supply the electrical element with electrical power. An improved textile device is thereby provided, which is capable of supplying an electrical element with electrical power.