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    FLEXIBLE ELECTRICAL JUMPER CABLE AND ASSEMBLY
    161.
    发明申请
    FLEXIBLE ELECTRICAL JUMPER CABLE AND ASSEMBLY 审中-公开
    柔性电动跳线电缆和组件

    公开(公告)号：WO1986006551A1

    公开(公告)日：1986-11-06

    申请号：PCT/US1986000639

    申请日：1986-03-31

    Applicant: AMP INCORPORATED

    Inventor： AMP INCORPORATED ,  DERY, Ronald, Allen ,  GENTRY, William, Gray ,  JONES, Warren, Charlie ,  MAY, Clifton, Carl, Jr. ,  WENTINK, Steven, George

    IPC: H01R04/04

    CPC classification number: H05K3/323 ,  H01R4/04 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/148 ,  H05K1/181 ,  H05K1/189 ,  H05K3/247 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2201/10136 ,  H05K2203/066

    Abstract: A flexible flat cable assembly, which is adapted to form a low profile interconnection between two electrical circuit members, each having a row of closely spaced apart conductive traces (18). The cable (2) comprises a row of traces (18), with an insulating polymeric film (20) overlying each side of the row. Also, the row is exposed at each end of the jumper cable, and the exposed end portion is covered by a layer of an anisotropically conductive adhesive (22). The cable is adapted to electrically join a flat display panel (220) to a printed circuit board (222), with the jumper cable (210) forming the interconnection between the conductors (221) on the display panel with the conductors on the circuit board. A jumper cable assembly is also disclosed, which includes surface mountable electrical components (224) which are electrically connected and mechanically secured to the traces (230) of the jumper cable assembly by means of an anisotropically conductive adhesive (22). A cable assembly especially adapted for tapping is also disclosed.

    Abstract translation: 柔性扁平电缆组件，其适于在两个电路构件之间形成薄型互连，每个具有一排紧密间隔开的导电迹线（18）。 电缆（2）包括一排迹线（18），其上覆盖在该行的每一侧上的绝缘聚合物膜（20）。 此外，该行在跨接电缆的每一端处露出，并且暴露的端部被各向异性导电粘合剂层（22）覆盖。 电缆适于将平面显示面板（220）电连接到印刷电路板（222），跳线电缆（210）在显示面板上的导体（221）之间形成互连，电路板上的导体 。 还公开了一种跳线电缆组件，其包括通过各向异性导电粘合剂（22）电连接并机械地固定到跨接电缆组件的迹线（230）的可表面安装的电气部件（224）。 还公开了一种特别适用于攻丝的电缆组件。

    Metal base circuit board
    164.
    发明专利
    Metal base circuit board 有权
    金属基座电路板

    公开(公告)号：JP2012084567A

    公开(公告)日：2012-04-26

    申请号：JP2010227002

    申请日：2010-10-06

    Applicant: Nhk Spring Co Ltd ,  日本発條株式会社

    Inventor： SASAKI HITOSHI ,  YUKIMASA TARO ,  NAGAOKA EIKI ,  DAITO YASUNOBU

    IPC: H05K1/02 ,  H05K1/05 ,  H05K3/28

    CPC classification number: H05K1/02 ,  H05K1/05 ,  H05K3/3452 ,  H05K2201/09436 ,  H05K2201/09781 ,  H05K2201/2054

    Abstract: PROBLEM TO BE SOLVED: To prevent a metal board from being rubbed by a white resist layer even when metal base circuit boards are managed in a stacked manner.SOLUTION: A metal base circuit board 1 comprises: a circuit part 7 provided on a metal board 3 via an insulation layer 5; and a white resist layer 9 including an inorganic filler which forms soldering lands 9a and 9b of an LED on the circuit part 7 so as to cover the insulation layer 5 and the circuit part 7 on the metal board 3. Dummy circuits 11a and 11b for maintaining height at a position spaced away from the circuit part 7 are formed between the white resist layer 9 and the insulation layer 5 on the metal board 3 side. On the surface of the white resist layer 9 whose height is maintained by the dummy circuits 11a and 11b, symbol patterns 13a and 13b constituting a board uppermost portion are formed of symbol ink.

    Abstract translation: 解决问题：为了防止金属板被白色抗蚀剂层摩擦，即使金属基底电路板以堆叠的方式被管理。 解决方案：金属基底电路板1包括：经由绝缘层5设置在金属板3上的电路部分7; 以及包含无机填料的白色抗蚀剂层9，其在电路部分7上形成LED的焊接区域9a和9b，以覆盖金属板3上的绝缘层5和电路部分7.虚拟电路11a和11b用于 在金属板3侧的白色抗蚀剂层9和绝缘层5之间形成有与电路部分7隔开的位置的保持高度。 在由伪电路11a和11b保持高度的白色抗蚀剂层9的表面上，构成板最上部的符号图案13a和13b由符号墨形成。 版权所有（C）2012，JPO＆INPIT

    Adapter board, method for manufacturing the same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device
    165.
    发明专利
    Adapter board, method for manufacturing the same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device 有权
    适配板，其制造方法，探针卡，检查半导体波形的方法以及制造半导体器件的方法

    公开(公告)号：JP2010019697A

    公开(公告)日：2010-01-28

    申请号：JP2008180601

    申请日：2008-07-10

    Applicant: Nec Electronics Corp ,  Necエレクトロニクス株式会社

    Inventor： MIZOGUCHI OSAMU

    IPC: G01R1/073 ,  G01R31/26 ,  H01L21/66 ,  H01R12/51

    CPC classification number: H05K1/113 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/244 ,  H05K2201/09436 ,  H05K2201/096 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

    Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive probe card which facilitates an alignment even though an adapter board system is employed, and can prevent deterioration of the contact between a probe and an electrode pad. SOLUTION: The adapter board 1 includes a package substrate 300 having a first surface 1a and a second surface 1b and further including a board 301 having wirings 402, 902 formed therein, pads 303, 903 formed on the first surface 1a, and pads 904, 905 formed on the second surface 1b, an insulating resin layer 305 joined to the first surface 1a, through-holes 308 formed in the positions corresponding to the pads 303, 903 in the insulating resin layer 305, vias 306 formed in the through-holes 308, and pads 307 covering the through-holes 308, wherein the pads 303 are electrically coupled to the pads 904 through the wirings 402, and the pads 307 are electrically coupled to the pads 303 through the vias 306. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供便于对准的便宜的探针卡，即使使用适配器板系统，并且可以防止探针和电极垫之间的接触的劣化。 适配器板1包括具有第一表面1a和第二表面1b的封装基板300，并且还包括形成在其中的布线402,902的板301，形成在第一表面1a上的焊盘303,903以及 形成在第二表面1b上的焊盘904,905，与第一表面1a接合的绝缘树脂层305，在与绝缘树脂层305中的焊盘303,903对应的位置形成的通孔308，形成在第二表面1a上的通孔306 通孔308和覆盖通孔308的焊盘307，其中焊盘303通过布线402电耦合到焊盘904，并且焊盘307通过通孔306电耦合到焊盘303。 版权所有（C）2010，JPO＆INPIT

    Printed circuit board, and mounting structure for surface mounted device
    168.
    发明专利
    Printed circuit board, and mounting structure for surface mounted device 有权
    印刷电路板和表面安装器件的安装结构

    公开(公告)号：JP2009218435A

    公开(公告)日：2009-09-24

    申请号：JP2008061638

    申请日：2008-03-11

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： UKO MASATO ,  TOKII SEIJI

    IPC: H05K3/34 ,  H05K1/18

    CPC classification number: H05K3/3436 ,  H01R12/523 ,  H05K1/113 ,  H05K2201/09381 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09572 ,  Y02P70/613 ,  Y10T29/49213

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board capable of sufficiently securing connection strength and connection reliability when mounting a surface mounted device, and to provide a mounting structure of the surface mounted device using the printed circuit board. SOLUTION: A BGA package 3 as a surface mounted device has a plurality of solder balls 3a arranged in alignment and the printed circuit board 2 has a plurality of mounting pads 4 respectively corresponding to the plurality of solder balls 3a. The BGA package 3 is mounted on the printed circuit board 2 when being joined to the mounting pads 4 on the printed circuit board 2 due to melting of the solder balls 3. A recessed via hole 10 is formed in each mounting pad 4 having a circular surface shape and a part of the solder ball 3a is get into the recessed via hole 10. Wherein, a center position of the recessed via hole 10 is separated from the center O of the mounting pad 4 by a diameter dimension and more of the recessed via hole 10. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够在安装表面安装装置时能够充分确保连接强度和连接可靠性的印刷电路板，并且提供使用印刷电路板的表面安装装置的安装结构。 解决方案：作为表面安装器件的BGA封装3具有排列成对准的多个焊球3a，并且印刷电路板2具有分别对应于多个焊球3a的多个安装焊盘4。 BGA封装3由于焊锡球3的熔化而被接合到印刷电路板2上的安装焊盘4而安装在印刷电路板2上。在每个安装焊盘4中形成有凹形的通孔10， 表面形状和焊球3a的一部分进入凹入的通孔10.其中凹入的通孔10的中心位置与安装焊盘4的中心O分开直径尺寸，并且更多的凹陷 通孔10.版权所有（C）2009，JPO＆INPIT

    Wiring board, its manufacturing method, and display device
    170.
    发明专利
    Wiring board, its manufacturing method, and display device 审中-公开
    接线板及其制造方法和显示装置

    公开(公告)号：JP2009031362A

    公开(公告)日：2009-02-12

    申请号：JP2007192477

    申请日：2007-07-24

    Applicant: Mitsubishi Electric Corp ,  三菱電機株式会社

    Inventor： HASHIGUCHI TAKASHI

    IPC: G02F1/1345 ,  G02F1/1368

    CPC classification number: H05K3/3452 ,  H05K1/112 ,  H05K3/323 ,  H05K2201/0191 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09709 ,  H05K2203/0577 ,  H05K2203/0588

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board capable of extending the allowable error range of alignment accuracy in the package of a packaging terminal and an external circuit, to provide its manufacturing method, and to provide a display device. SOLUTION: The wiring board includes a plurality of wiring lines 2a provided on a board 1 and a plurality of packaging terminals 6 respectively provided on the plurality of wiring lines 2a and forming a plurality of rows in a zigzag shape. The packaging terminal 6 includes a first conductive film 2 of the same layer as the wiring line 2a, an insulating film 4 covering the wiring line 2a and the first conductive film 2 and having an aperture part 5 on the first conductive film 2 and an upper layer conductive film 7 electrically connected to the first conductive film via the aperture part 5. The insulating film 4 has a thick film part provided outside the region where the plurality of packaging terminals 6 forming the plurality of rows in the zigzag shape are provided and a thin film part 5a provided in a region adjacent to the aperture part 5 in the row direction in the zigzag shape and having film thickness thinner than that of the thick film part. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 解决方案：提供能够延长封装端子和外部电路的封装中的对准精度的允许误差范围的布线板，以提供其制造方法，并提供显示装置。 解决方案：布线板包括设置在板1上的多个布线2a和分别设置在多条布线2a上并形成Z字形的多行的多个封装端子6。 封装端子6包括与布线2a相同层的第一导电膜2，覆盖布线2a和第一导电膜2并且在第一导电膜2上具有孔部5的绝缘膜4， 层状导电膜7经由开口部5电连接到第一导电膜。绝缘膜4具有设置在形成为锯齿形状的多个行的多个封装端子6的区域的外侧的厚膜部， 薄壁部分5a设置在Z形形状的行方向上与孔部5相邻的区域中，并且具有比厚膜部分薄的膜厚度。 版权所有（C）2009，JPO＆INPIT

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